⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13653239 | 0.87 | — | — | |
| SCHEMBL14066035 | 0.81 | — | — | |
| SCHEMBL5460507 | 0.81 | — | — | |
| SCHEMBL426245 | 0.79 | ALDH1A1 (0.33) | — | |
| SCHEMBL6479050 | 0.79 | — | — | |
| SCHEMBL10793169 | 0.71 | ALDH1A1 (0.35) | — | |
| SCHEMBL9222895 | 0.69 | TSHR (0.31) | — | |
| SCHEMBL17735796 | 0.69 | — | — | |
| SCHEMBL8168512 | 0.69 | — | — | |
| SCHEMBL16021749 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8722153-B2 | Release coating composition and method of forming the same | DOW CORNING CORPORATION (US) | 2014-05-13 | — | — | US | disclosed |
| US-8372497-B2 | Silicone coatings on air bags | DOW CORNING CORPORATION (US) | 2013-02-12 | — | — | US | disclosed |
| US-20120301644-A1 | SILICONE COATINGS ON AIR BAGS | DOW SILICONES CORPORATION | 2012-11-29 | — | — | US | disclosed |
| US-20070178319-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| EP-1564269-A1 | COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-08-17 | — | — | EP | disclosed |
| US-20040216641-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-11-04 | — | — | US | disclosed |