Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | GLA | P06280 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
| ▸ | CTSB | P07858 | 1/20 | 0.30 |
| ▸ | DHFR | P00374 | 1/20 | 0.30 |
| ▸ | TP53 | P04637 | 1/20 | 0.30 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4247533 | 0.83 | ALDH1A1 (0.30) | ALDH1A1TP53CYP3A4TSHRSMN1; SMN2 | |
| SCHEMBL3725189 | 0.80 | IDO1 (0.46) | TDP1ALDH1A1KMT2A | |
| SCHEMBL29826970 | 0.78 | TDP1 (0.45) | TDP1ALDH1A1GLAMEN1KMT2A | |
| SCHEMBL6480647 | 0.78 | TDP1 (0.45) | TDP1ALDH1A1GLAMEN1KMT2A | |
| SCHEMBL28405645 | 0.77 | TDP1 (0.33) | TDP1ALDH1A1GLA | |
| SCHEMBL30607492 | 0.77 | TDP1 (0.41) | TDP1ALDH1A1GLAMEN1KMT2A | |
| SCHEMBL28454337 | 0.77 | TDP1 (0.41) | TDP1ALDH1A1GLAMEN1KMT2A | |
| Ammonia Solution, Strong SCHEMBL27798784 | 0.76 | TDP1 (0.43) | TDP1ALDH1A1GLAMEN1KMT2A | |
| Methane SCHEMBL27917831 | 0.76 | TDP1 (0.43) | TDP1ALDH1A1GLAMEN1KMT2A | |
| SCHEMBL25282361 | 0.76 | MEN1 (0.38) | TDP1ALDH1A1GLAMEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20120139131-A1 | WAFER MOLD MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2461356-A1 | Wafer mold material and method for manufacturing semiconductor apparatus | Shin-Etsu Chemical Co., Ltd. (JP) | 2012-06-06 | — | — | EP | disclosed |
| US-20070015885-A1 | Thermosetting resin composition | NIPPON PETROCHEMICALS CO., LTD. (JP) | 2007-01-18 | — | — | US | disclosed |
| US-20060156955-A1 | Thermosetting resin composition | NIPPON PETROCHEMICALS CO., LTD. (JP) | 2006-07-20 | — | — | US | disclosed |
| EP-1564257-A1 | THERMOSETTING RESIN COMPOSITION | NIPPON PETROCHEMICALS CO., LTD. (JP) | 2005-08-17 | — | — | EP | disclosed |
| EP-1564256-A1 | THERMOSETTING RESIN COMPOSITION | NIPPON PETROCHEMICALS CO., LTD. (JP) | 2005-08-17 | — | — | EP | disclosed |