SCHEMBL5477482

SCHEMBL5477482

NNC(=O)OC(=O)NN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11884227 0.86 CYP1A2 (0.39)
SCHEMBL28007438 0.85
SCHEMBL3081088 0.83
SCHEMBL18839715 0.81
SCHEMBL28332868 0.78
SCHEMBL11884232 0.78 CYP1A2 (0.33)
SCHEMBL28101614 0.78
SCHEMBL7881824 0.76
SCHEMBL28198618 0.76
SCHEMBL2646512 0.74 DGAT1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1679346-B1 POLYACETAL RESIN COMPOSITION POLYPLASTICS CO (JP) 2012-11-14 EP claimed
US-20070123617-A1 Polyacetal resin composition DEUTSCHE BANK AG, NEW YORK BRANCH, AS COLLATERAL AGENT 2007-05-31 US claimed
US-20070032605-A1 Polyacetal resin composition POLYPLASTICS CO., LTD. (JP) 2007-02-08 US claimed
EP-1679346-A1 POLYACETAL RESIN COMPOSITION Polyplastics Co., Ltd. (JP) 2006-07-12 EP claimed
EP-1674526-A1 POLYACETAL RESIN COMPOSITION Polyplastics Co., Ltd. (JP) 2006-06-28 EP claimed
US-20230286042-A1 THREE DIMENSIONAL PRINTING HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 2023-09-14 US disclosed
US-20210323067-A1 THREE-DIMENSIONAL PRINTING HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 2021-10-21 US disclosed
EP-3755487-A1 THREE-DIMENSIONAL PRINTING Hewlett-Packard Development Company, L.P. (US) 2020-12-30 EP disclosed
EP-2754693-B1 EMBEDDING RESIN COMPOSITION FOR ELECTRON MICROSCOPE, AND METHOD FOR OBSERVING SAMPLE ON ELECTRON MICROSCOPE USING SAID COMPOSITION UNIV KURUME (JP) 2018-11-14 EP disclosed
CN-104428293-B Adjust the benzimidazole of TNF α UCB生物制药私人有限公司 2018-06-08 CN disclosed
US-9870894-B2 Embedding resin composition for electron microscopey and method for observing sample with electron microscope using the same KURUME UNIVERSITY (JP) 2018-01-16 US disclosed
CN-104428293-A TNF -alpha modulating benzimidazoles UCB PHARMA SA 2015-03-18 CN disclosed
JP-2002305212-A MOUNTING PASTE FOR SEMICONDUCTOR TOSHIBA CHEM CORP 2002-10-18 JP disclosed
EP-0831922-A2 IMPROVED PHARMACEUTICAL COMPOSITIONS FOR GENE THERAPY Therexsys Limited (GB) 1998-04-01 EP disclosed
WO-1996041606-A2 IMPROVED PHARMACEUTICAL COMPOSITIONS FOR GENE THERAPY THEREXSYS LIMITED (GB) 1996-12-27 WO disclosed
EP-0124058-A1 Preparation of a pharmaceutically active pyridazine derivative I.S.F. Socièta per Azioni (IT) 1984-11-07 EP disclosed
EP-0010638-B1 AGROCHEMICAL AGENTS AND ANIMAL FEED ADDITIVE, THEIR USE, PROCESS FOR PRODUCTION OF FERTILIZERS AND PROCESS FOR FERTILIZING PLANTS BAYER AG (DE) 1982-02-24 EP disclosed
EP-0010243-B1 PROCESS FOR TREATING BIOMASSES; MODIFIED BIOMASSES AND THEIR APPLICATION BAYER AG (DE) 1981-09-30 EP disclosed
EP-0010638-A1 Agrochemical agents and animal feed additive, their use, process for production of fertilizers and process for fertilizing plants BAYER AG (DE) 1980-05-14 EP disclosed
EP-0010243-A1 Process for treating biomasses; modified biomasses and their application BAYER AG (DE) 1980-04-30 EP disclosed