SCHEMBL54804

SCHEMBL54804

CC1(OC(=O)CCCCC(=O)OC2(C)CCC3OC3C2)CCC2OC2C1

nearest known ligand 0.31

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.31
NLRP3 Q96P20 2/20 0.31
PRKCA P17252 2/20 0.30
EPHX2 P34913 2/20 0.30
MAPK1 P28482 2/20 0.30
TP53 P04637 1/20 0.30
NFKB1 P19838 1/20 0.30
CYP2C19 P33261 1/20 0.30
THPO P40225 1/20 0.30
STAT6 P42226 1/20 0.30
HIF1A Q16665 1/20 0.30
NPC1 O15118 1/20 0.30
GMNN O75496 1/20 0.30
LMNA P02545 1/20 0.30
MTOR P42345 1/20 0.30
RAB9A P51151 1/20 0.30
BLM P54132 1/20 0.30
PMP22 Q01453 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2389562 0.76 SCN1A (0.32) MAPK1TP53NFKB1CYP2C19THPO
SCHEMBL15573221 0.76 PRKCA (0.39) PRKCAEPHX2LMNA
SCHEMBL27512935 0.74 SMN1; SMN2 (0.33) SMN1; SMN2
SCHEMBL22720394 0.73 PPM1B (0.31)
SCHEMBL22720372 0.73 SCN1A (0.30)
SCHEMBL2959439 0.72
SCHEMBL28761315 0.71 SCN1A (0.35)
SCHEMBL28942493 0.70 CYP19A1 (0.47) NAAAPRKCALMNASMN1; SMN2
SCHEMBL138227 0.70
SCHEMBL2918023 0.70 CYP19A1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2567995-B1 Resin composition for printing plate ASAHI KASEI E MATERIALS CORP (JP) 2014-02-19 EP disclosed
EP-2567995-A2 Resin composition for printing plate Asahi Kasei E-materials Corporation (JP) 2013-03-13 EP disclosed
EP-2100907-B1 RESIN COMPOSITION FOR PRINTING PLATE ASAHI KASEI E MATERIALS CORP (JP) 2013-02-20 EP disclosed
US-8263730-B2 Resin composition for printing plate ASAHI KASEI E-MATERIALS CORPORATION (JP) 2012-09-11 US disclosed
US-20120148949-A1 RESIN COMPOSITION FOR PRINTING PLATE ASAHI KASEI E-MATERIALS CORPORATION 2012-06-14 US disclosed
US-8129494-B2 Resin composition for printing plate ASAHI KASEI E-MATERIALS CORPORATION (JP) 2012-03-06 US disclosed
US-7759049-B2 Photosensitive resin composition for original printing plate capable of being carved by laser ASAHI KASEI CHEMICALS CORPORATION (JP) 2010-07-20 US disclosed
US-20100093119-A1 RESIN COMPOSITION FOR PRINTING PLATE ASAHI KASEI E-MATERIALS CORPORATION (JP) 2010-04-15 US disclosed
EP-2100907-A1 RESIN COMPOSITION FOR PRINTING PLATE Asahi Kasei Chemicals Corporation (JP) 2009-09-16 EP disclosed
EP-1424210-B1 PHOTOSENSITIVE RESIN COMPOSITION AND LASER ENGRAVABLE PRINTING ELEMENT ASAHI KASEI CHEMICALS CORP (JP) 2008-05-14 EP disclosed
EP-1516745-B1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING A LASER ENGRAVABLE PRINTING ELEMENT ASAHI KASEI CHEMICALS CORP (JP) 2007-02-14 EP disclosed
US-7029825-B2 Uniformity in thickness and high dimensional precision, but also enables easy laser engraving without suffering problems caused by the generation of debris ASAHI KASEI CHEMICALS CORPORATION (JP) 2006-04-18 US disclosed
US-20050227165-A1 Photosensitive resin composition for original printing plate capable of being carved by laser ASAHI KASEI CHEMICALS CORPORATION (JP) 2005-10-13 US disclosed
EP-1516745-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR ORIGINAL PRINTING PLATE CAPABLE OF BEING CARVED BY LASER Asahi Kasei Chemicals Corporation (JP) 2005-03-23 EP disclosed
US-20040157162-A1 Uniformity in thickness and high dimensional precision, but also enables easy laser engraving without suffering problems caused by the generation of debris ASAHI KASEI CHEMICALS CORPORATION (JP) 2004-08-12 US disclosed
EP-1424210-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PRINTING PLATE PRECURSOR CAPABLE OF LASER ENGRAVING Asahi Kasei Chemicals Corporation (JP) 2004-06-02 EP disclosed