⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29465676 | 0.77 | — | — | |
| SCHEMBL14940869 | 0.72 | — | — | |
| SCHEMBL54804 | 0.70 | NAAA (0.31) | — | |
| SCHEMBL13592591 | 0.69 | PPM1B (0.32) | — | |
| SCHEMBL12460147 | 0.69 | — | — | |
| SCHEMBL2389562 | 0.68 | SCN1A (0.32) | — | |
| SCHEMBL824256 | 0.67 | EPHX2 (0.30) | — | |
| SCHEMBL23302336 | 0.66 | EPHX1 (0.41) | — | |
| SCHEMBL27512935 | 0.66 | SMN1; SMN2 (0.33) | — | |
| SCHEMBL29610204 | 0.66 | ACHE (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024029475-A1 | WAVELENGTH CONVERSION FILM FORMING COMPOSITION | 日産化学株式会社 | 2024-02-08 | — | — | WO | disclosed |
| WO-2023199738-A1 | COMPOSITION AND CURED PRODUCT | 株式会社ADEKA | 2023-10-19 | — | — | WO | disclosed |
| WO-2023171634-A1 | CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR | 株式会社レゾナック | 2023-09-14 | — | — | WO | disclosed |
| WO-2023171633-A1 | ELECTRICALLY CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, AND CONNECTION STRUCTURE BODY AND METHOD FOR MANUFACTURING SAME | 株式会社レゾナック | 2023-09-14 | — | — | WO | disclosed |
| WO-2023100828-A1 | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | ＥＮＥＯＳ株式会社 | 2023-06-08 | — | — | WO | disclosed |
| US-20230151138-A1 | STEREOISOMER OF EPOXY COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT OBTAINED BY CURING CURABLE COMPOSITION | ENEOS CORPORATION (JP) | 2023-05-18 | — | — | US | disclosed |
| CN-116102594-A | Acid generator, curable composition containing same, and cured product thereof | 三亚普罗股份有限公司 | 2023-05-12 | — | — | CN | disclosed |
| WO-2023026932-A1 | COMPOSITION, CURED OBJECT, AND METHOD FOR PRODUCING CURED OBJECT | 株式会社ADEKA | 2023-03-02 | — | — | WO | disclosed |
| CN-111886287-B | Cardanol-blocked isocyanate adhesion promoter for PVC plastisols | 赢创运营有限公司 | 2022-11-08 | — | — | CN | disclosed |
| WO-2022224934-A1 | ADHESIVE COMPOSITION AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 昭和電工マテリアルズ株式会社 | 2022-10-27 | — | — | WO | disclosed |
| US-20150232718-A1 | ADHESIVE COMPOSITION AND ADHESIVE TAPE | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2015-08-20 | — | — | US | disclosed |
| US-20140161982-A1 | EPOXY RESIN BLEND | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2014-06-12 | — | — | US | disclosed |
| CN-103249775-A | Curable compositions | DOW GLOBAL TECHNOLOGIES INC | 2013-08-14 | — | — | CN | disclosed |
| US-20120055704-A1 | EPOXY RESIN BLEND | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2012-03-08 | — | — | US | disclosed |
| US-20100255740-A1 | EPOXY RESIN BLEND | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2010-10-07 | — | — | US | disclosed |
| CN-101851392-A | Epoxy resin blend | TAIWAN UNION TECHNOLOGY CORP | 2010-10-06 | — | — | CN | disclosed |
| US-7763700-B2 | Epoxy resin curing composition | ADEKA CORPORATION (JP) | 2010-07-27 | — | — | US | disclosed |
| US-20090253887-A1 | EPOXY RESIN CURING COMPOSITION | ADEKA CORPORATION (JP) | 2009-10-08 | — | — | US | disclosed |
| US-7294660-B2 | Contains aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property | ASAHI DENKA CO., LTD. (JP) | 2007-11-13 | — | — | US | disclosed |
| US-20050176854-A1 | Epoxy resin composition | ASAHI DENKA CO (JP) | 2005-08-11 | — | — | US | disclosed |