SCHEMBL548130

SCHEMBL548130

O=S(=O)(Oc1ccc([S+](c2ccccc2)c2ccccc2)cc1)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.42

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PIK3CD O00329 1/20 0.42
PIK3CA P42336 1/20 0.42
PIK3CB P42338 1/20 0.42
CA1 P00915 16/20 0.41
CA2 P00918 16/20 0.41
JAK2 O60674 1/20 0.36
JAK3 P52333 1/20 0.36
PTK2 Q05397 1/20 0.36
CA9 Q16790 4/20 0.33
MMP1 P03956 2/20 0.33
MMP2 P08253 2/20 0.33
MMP9 P14780 2/20 0.33
MMP8 P22894 2/20 0.33
MMP13 P45452 2/20 0.33
AKR1C3 P42330 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1802710 0.98 CA2 (0.43) PIK3CDPIK3CAPIK3CBCA1CA2
SCHEMBL1772329 0.93 PIK3CD (0.39) PIK3CDPIK3CAPIK3CBCA1CA2
SCHEMBL6479936 0.85 CA2 (0.45) PIK3CDPIK3CAPIK3CBCA1CA2
SCHEMBL5124099 0.84 CA1 (0.46) PIK3CDPIK3CAPIK3CBCA1CA2
SCHEMBL13418131 0.84 CXCR2 (0.40) CA1CA2CA9TDP1
SCHEMBL547685 0.84 CXCR2 (0.40) CA1CA2CA9TDP1
SCHEMBL6900759 0.84 CA2 (0.46) PIK3CDPIK3CAPIK3CBCA1CA2
Iodide SCHEMBL5315919 0.84 PIK3CD (0.44) PIK3CDPIK3CAPIK3CBCA1CA2
SCHEMBL27366575 0.84 PIK3CD (0.44) PIK3CDPIK3CAPIK3CBCA1CA2
SCHEMBL575913 0.83 CA2 (0.51) PIK3CDPIK3CAPIK3CBCA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026100410-A1 IODINE-CONTAINING POLYMERIZABLE COMPOUND AND IODINE-CONTAINING POLYMER 三菱瓦斯化学株式会社 2026-05-15 WO disclosed
US-20250362597-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-11-27 US disclosed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-20230096312-A1 RESIST COMPOSITION AND METHOD FOR USING RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-03-30 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
WO-2023008354-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2023-02-02 WO disclosed
WO-2023008355-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAID COMPOSITION 三菱瓦斯化学株式会社 2023-02-02 WO disclosed
US-6383713-B1 ADAMANTYL ACRYLATE POLYMERS AND ACID GENERATORS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-05-07 US disclosed
US-6348297-B1 COMPOSITION COMPRISING ACID GENERATOR COMPRISING ALIPHATIC SULFONIUM SALT, TRIPHENYLSULFONIUM OR DIPHENYLIODONIUM SALT,RESIN HAVING ACID-LABILE GROUP WHICH IS INSOLUBLE IN ALKALI BUT BECOMES SOLUBLE BY ACTION OF ACID SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-02-19 US disclosed
US-20020015913-A1 Chemical amplifying type positive resist composition and sulfonium salt SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-02-07 US disclosed
US-20020006582-A1 Chemical amplification type positive resist compositions and sulfonium salts SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-01-17 US disclosed
EP-1167349-A1 Chemical amplifying type positive resist composition and sulfonium salt SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-01-02 EP disclosed
EP-1154321-A1 Chemical amplification type positive resist compositions and sulfonium salts SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-11-14 EP disclosed
US-20010006758-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2001-07-05 US disclosed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP disclosed
EP-1041442-A1 Chemical amplification type positive resist SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-10-04 EP disclosed
EP-1020767-A1 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-07-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 PIK3CD 4044/4885PIK3CA 3781/4885PIK3CB 4179/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R PIK3CD 4030/4885PIK3CA 3525/4885PIK3CB 4267/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.