SCHEMBL548228

SCHEMBL548228

CCCCOC(=O)CC(C)OC

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.47
ALDH1A1 P00352 1/20 0.47
ATM Q13315 1/20 0.44
DGKA P23743 1/20 0.42
NPSR1 Q6W5P4 2/20 0.42
L3MBTL1 Q9Y468 2/20 0.42
MAPT P10636 1/20 0.42
MAPK1 P28482 1/20 0.42
TSHR P16473 2/20 0.41
HPGD P15428 1/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
RAD52 P43351 1/20 0.41
FAAH O00519 1/20 0.40
HCAR2 Q8TDS4 1/20 0.39
HTR2C P28335 1/20 0.39
TDP1 Q9NUW8 1/20 0.38
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28244712 0.88 NAAA (0.36) NAAAALDH1A1DGKANPSR1L3MBTL1
SCHEMBL11571805 0.85 NAAA (0.47) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL9486790 0.83 NAAA (0.46) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL19434159 0.83 NAAA (0.46) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL1879588 0.82 NAAA (0.48) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL1866046 0.82 ALDH1A1 (0.52) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL95383 0.82 ALDH1A1 (0.52) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL28117429 0.82 ALDH1A1 (0.52) NAAAALDH1A1ATMDGKANPSR1
SCHEMBL16217592 0.81 NAAA (0.32) NAAAALDH1A1DGKANPSR1L3MBTL1
SCHEMBL9396269 0.80 NAAA (0.43) NAAAALDH1A1ATMDGKANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 317 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122094988-A Iodine-containing (meth) acrylate compound, iodine-containing (meth) acrylate (co) polymer, composition for lithography, resist composition, composition for underlayer film formation, and method for producing iodine-containing (meth) acrylate compound 2026-05-26 CN disclosed
CN-122043858-A EUV patterned resist formation method 亚历克斯·P·G·罗宾逊 2026-05-15 CN disclosed
CN-120136704-A Compound, polymer, composition for film formation, pattern formation method, method for forming insulating film, and method for producing compound 三菱瓦斯化学株式会社 2025-06-13 CN disclosed
CN-120136703-A Compound, polymer, composition for film formation, pattern formation method, method for forming insulating film, and method for producing compound 三菱瓦斯化学株式会社 2025-06-13 CN disclosed
WO-2025084341-A1 IODINE-CONTAINING (METH)ACRYLATE COMPOUND, IODINE-CONTAINING (METH)ACRYLATE (CO)POLYMER, LITHOGRAPHY COMPOSITION, RESIST COMPOSITION, UNDERLAYER FILM-FORMING COMPOSITION, AND METHOD FOR PRODUCING IODINE-CONTAINING (METH)ACRYLATE COMPOUND 三菱瓦斯化学株式会社 2025-04-24 WO disclosed
WO-2025084342-A1 IODINE-CONTAINING (METH)ACRYLATE COMPOUND, IODINE-CONTAINING (METH)ACRYLATE (CO)POLYMER, LITHOGRAPHY COMPOSITION, RESIST COMPOSITION, UNDERLAYER-FILM-FORMING COMPOSITION, AND METHOD FOR PRODUCING IODINE-CONTAINING (METH)ACRYLATE COMPOUND 三菱瓦斯化学株式会社 2025-04-24 WO disclosed
WO-2025084340-A1 IODINE-CONTAINING (METH)ACRYLATE COMPOUND, IODINE-CONTAINING (METH)ACRYLATE (CO)POLYMER, LITHOGRAPHY COMPOSITION, RESIST COMPOSITION, BOTTOM LAYER-FORMING COMPOSITION, AND METHOD FOR PRODUCING IODINE-CONTAINING (METH)ACRYLATE COMPOUND 三菱瓦斯化学株式会社 2025-04-24 WO disclosed
WO-2025079631-A1 COMPOSITION, RESIN COMPOSITION, COMPOSITION FOR FILM FORMATION, COMPOSITION FOR FORMING LITHOGRAPHIC FILM, AND COMPOSITION FOR FORMING RESIST FILM 三菱瓦斯化学株式会社 2025-04-17 WO disclosed
WO-2025079648-A1 COMPOUND, COMPOSITION, RESIN COMPOSITION, COMPOSITION FOR FORMING FILM, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, AND COMPOSITION FOR FORMING RESIST FILM 三菱瓦斯化学株式会社 2025-04-17 WO disclosed
CN-119451998-A Composition, resin composition, composition for film formation, pattern formation method, and compound 三菱瓦斯化学株式会社 2025-02-14 CN disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-6337171-B1 AS A RESIST APPLICABLE TO FAR ULTRAVIOLET RAYS SUCH AS A KRF EXCIMER LASER, CHARGED PARTICLE RAYS SUCH AS ELECTRON BEAMS, AND X-RAYS JSR CORPORATION (JP) 2002-01-08 US disclosed
US-20010041769-A1 Polysiloxane, method of manufacturing same, silicon-containingalicyclic compouns, and radiation-sensitive resin composition JSR CORPORATION (JP) 2001-11-15 US disclosed
EP-1142928-A1 Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds JSR Corporation (JP) 2001-10-10 EP disclosed
US-6280900-B1 RADIATION SENSITIVE COMPOSITION WITH ALKALINE DEVELOPER SOLUBLE IN POLYMER COATED ON SUBSTRATE JSR CORPORATION (JP) 2001-08-28 US disclosed
US-20010006758-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2001-07-05 US disclosed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed
EP-1011029-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2000-06-21 EP disclosed