SCHEMBL5485645

SCHEMBL5485645

Cc1cc(O)c(C2CCCCC2)cc1CCc1cc(C2CCCCC2)c(O)cc1C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NUDT1 P36639 1/20 0.46
BACE1 P56817 1/20 0.46
HSP90AA1 P07900 1/20 0.40
HTR2A P28223 2/20 0.36
PSMB5 P28074 1/20 0.36
CNR1 P21554 5/20 0.35
CNR2 P34972 5/20 0.35
PTGDR2 Q9Y5Y4 1/20 0.35
PABPC1 P11940 1/20 0.35
NR1I2 O75469 1/20 0.35
KDM4B O94953 1/20 0.35
CHRM1 P11229 1/20 0.35
TBXA2R P21731 1/20 0.35
ADRA1A P35348 1/20 0.35
DOHH Q9BU89 1/20 0.35
CYP1A2 P05177 2/20 0.35
CYP2D6 P10635 2/20 0.35
MAPK1 P28482 1/20 0.35
CYP2C9 P11712 1/20 0.33
CYP2C19 P33261 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29007729 0.92 NUDT1 (0.43) NUDT1BACE1HSP90AA1CNR1CNR2
SCHEMBL278212 0.90 NUDT1 (0.43) NUDT1BACE1HSP90AA1PSMB5CNR1
SCHEMBL30677888 0.90 NUDT1 (0.43) NUDT1BACE1HSP90AA1PSMB5CNR1
SCHEMBL3254797 0.89 CNR1 (0.43) NUDT1BACE1HSP90AA1HTR2ACNR1
SCHEMBL4060659 0.88 NUDT1 (0.42) NUDT1BACE1HSP90AA1PSMB5CNR1
SCHEMBL10776428 0.88 NUDT1 (0.42) NUDT1BACE1HSP90AA1PSMB5CNR1
SCHEMBL8900285 0.84 NUDT1 (0.38) NUDT1BACE1HSP90AA1PTGDR2CYP1A2
SCHEMBL21612717 0.84 NUDT1 (0.39) NUDT1BACE1HSP90AA1PSMB5CNR1
SCHEMBL1245161 0.83 NUDT1 (0.45) NUDT1BACE1HSP90AA1PSMB5CNR1
SCHEMBL9816553 0.82 CYP2D6 (0.37) NUDT1BACE1HSP90AA1HTR2APTGDR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070299164-A1 Heatcurable dielectric resin composition and heatcurable dielectric resin film NIPPON PAINT CO., LTD. (JP) 2007-12-27 US disclosed
EP-1688965-A2 Heatcurable dielectric resin composition and heatcurable dielectric resin film Nippon Paint Co., Ltd. (JP) 2006-08-09 EP disclosed