Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NUDT1 | P36639 | 1/20 | 0.43 |
| ▸ | BACE1 | P56817 | 1/20 | 0.43 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.40 |
| ▸ | SLC5A1 | P13866 | 5/20 | 0.37 |
| ▸ | SLC5A2 | P31639 | 4/20 | 0.37 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.36 |
| ▸ | THRA | P10827 | 2/20 | 0.35 |
| ▸ | THRB | P10828 | 2/20 | 0.35 |
| ▸ | CNR1 | P21554 | 4/20 | 0.35 |
| ▸ | CNR2 | P34972 | 4/20 | 0.35 |
| ▸ | PTGDR2 | Q9Y5Y4 | 1/20 | 0.35 |
| ▸ | PABPC1 | P11940 | 1/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30677888 | 1.00 | NUDT1 (0.43) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL27560096 | 0.90 | HSPA5 (0.44) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL28676321 | 0.90 | NUDT1 (0.40) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL5485645 | 0.90 | NUDT1 (0.46) | NUDT1BACE1HSP90AA1PSMB5THRA | |
| SCHEMBL28675586 | 0.89 | CYP2C9 (0.40) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL4060659 | 0.88 | NUDT1 (0.42) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL10776428 | 0.88 | NUDT1 (0.42) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL23174721 | 0.87 | NUDT1 (0.38) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL5944407 | 0.87 | NUDT1 (0.41) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 | |
| SCHEMBL278225 | 0.87 | SHBG (0.49) | NUDT1BACE1HSP90AA1SLC5A1SLC5A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240101859-A1 | RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME | FUJIFILM CORPORATION (JP) | 2024-03-28 | — | — | US | disclosed |
| US-20240092967-A1 | RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME | FUJIFILM CORPORATION (JP) | 2024-03-21 | — | — | US | disclosed |
| EP-4339251-A1 | COATING RESIN COMPOSITION, POLYMER, POLYMER PRODUCTION METHOD, COATING FILM AND PRODUCTION METHOD THEREFOR | FUJIFILM Corporation (JP) | 2024-03-20 | — | — | EP | disclosed |
| EP-4339252-A1 | RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM AND METHOD FOR PRODUCING SAME | FUJIFILM Corporation (JP) | 2024-03-20 | — | — | EP | disclosed |
| CN-117242145-A | Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film | 富士胶片株式会社 | 2023-12-15 | — | — | CN | disclosed |
| CN-117203294-A | Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film | 富士胶片株式会社 | 2023-12-08 | — | — | CN | disclosed |
| US-11767452-B2 | Curable composition, especially as crystallizing rubber to substrate bonding primer | HENKEL AG & CO. KGAA (DE) | 2023-09-26 | — | — | US | disclosed |
| WO-2022239655-A1 | RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM AND METHOD FOR PRODUCING SAME | 富士フイルム株式会社 | 2022-11-17 | — | — | WO | disclosed |
| WO-2022239656-A1 | COATING RESIN COMPOSITION, POLYMER, POLYMER PRODUCTION METHOD, COATING FILM AND PRODUCTION METHOD THEREFOR | 富士フイルム株式会社 | 2022-11-17 | — | — | WO | disclosed |
| EP-3369770-B1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | HENKEL AG & CO KGAA (DE) | 2021-12-22 | — | — | EP | disclosed |
| US-6777464-B1 | ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-08-17 | — | — | US | disclosed |
| US-6750313-B2 | HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP | TORAY INDUSTRIES, INC. (JP) | 2004-06-15 | — | — | US | disclosed |
| EP-0884342-B1 | Resin for coating formation and method for producing the same | UNITIKA LTD (JP) | 2003-09-24 | — | — | EP | disclosed |
| US-20030013836-A1 | Resin composition and articles molded therefrom | TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) | 2003-01-16 | — | — | US | disclosed |
| EP-1270646-A1 | RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM | TORAY INDUSTRIES, INC. (JP) | 2003-01-02 | — | — | EP | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |
| EP-0943640-A1 | HIGHLY HEAT-RESISTANT, HIGH-PURITY POLYARYLATE AND FILM PRODUCED FROM THE SAME | UNITIKA LTD. (JP) | 1999-09-22 | — | — | EP | disclosed |
| US-5902872-A | POLYARYLATE COMPRISING 2,2-BIS/3-METHYL-4-HYDROXYPHENYL/PROPANE UNITS, TEREPHTHALIC ACID UNITS AND ISOPHTHALIC ACID UNITS, HAVING SPECIFIED INHERENT VISCOSITY | UNITIKA, LTD. (JP) | 1999-05-11 | — | — | US | disclosed |
| EP-0884342-A1 | Resin for coating formation and method for producing the same | UNITIKA LTD. (JP) | 1998-12-16 | — | — | EP | disclosed |