SCHEMBL5494891

SCHEMBL5494891

COC(C)(O)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid SCHEMBL9461344 0.79 LMNA (0.42)
SCHEMBL2135066 0.76 ALDH1A1 (0.33)
SCHEMBL14611297 0.73
SCHEMBL7982360 0.73
SCHEMBL10996651 0.71
SCHEMBL27799190 0.71
SCHEMBL15951637 0.71
SCHEMBL27939642 0.71
SCHEMBL27921123 0.71
SCHEMBL4407990 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-63268726-A None JP disclosed
JP-63268725-A None JP disclosed
US-20240352169-A1 RESIN COMPOSITION, WATER-SWELLABLE FILM, ARTICLE COVERED WITH WATER-SWELLABLE FILM, AND METHOD FOR PRODUCING WATER-SWELLABLE FILM OSAKA ORGANIC CHEMICAL INDUSTRY LTD. (JP) 2024-10-24 US disclosed
US-20240209131-A1 COPOLYMER, COATING AGENT, AND ARTICLE OSAKA ORGANIC CHEMICAL INDUSTRY LTD. (JP) 2024-06-27 US disclosed
EP-4365214-A1 COPOLYMER, COATING MATERIAL, AND ARTICLE Osaka Organic Chemical Industry Ltd. (JP) 2024-05-08 EP disclosed
WO-2023074837-A1 RESIN COMPOSITION, WATER-SWELLABLE FILM, ARTICLE COVERED WITH WATER-SWELLABLE FILM, AND METHOD FOR PRODUCING WATER-SWELLABLE FILM 大阪有機化学工業株式会社 2023-05-04 WO disclosed
WO-2023277093-A1 COPOLYMER, COATING MATERIAL, AND ARTICLE 大阪有機化学工業株式会社 2023-01-05 WO disclosed
CN-113754522-A Separation process of water-propylene glycol monomethyl ether-propylene glycol ternary system 华东理工大学 2021-12-07 CN disclosed
CN-111093949-A Composition for mold material 麦克赛尔控股株式会社 2020-05-01 CN disclosed
US-20080097109-A1 2-oxo-1-pyrrolidine derivatives, processes for preparing them and their uses UCB BIOPHARMA SPRL (BE) 2008-04-24 US disclosed
CN-1720284-A Alkali saponification method for cellulose acylate film, cellulose acylate film with saponified surface, and optical film using saponified film FUJI PHOTO FILM CO LTD (JP) 2006-01-11 CN disclosed
CN-1690854-A Photosensitive composition FUJI PHOTO FILM CO LTD (JP) 2005-11-02 CN disclosed
EP-1544260-A1 INKJET RECORDING BLACK INK AND METHOD OF INKJET RECORDING FUJI PHOTO FILM CO., LTD. (JP) 2005-06-22 EP disclosed
CN-1517206-A Lithographic printing plate forebody ��ʿ��Ƭ��ʽ���� 2004-08-04 CN disclosed
CN-1497346-A Composition of refrared sensitive and forebody of lithographic printing plate 富士胶片株式会社 2004-05-19 CN disclosed
CN-1351280-A Photopolymerizable composition for short-wave semiconductor laser exposure, photosensitive composition and method for polymerizing photosensitive composition FUJI PHOTO FILM CO LTD (JP) 2002-05-29 CN disclosed
US-5599955-A FROM A FEEDSTREAM OF HYDROGEN AND A CARBON OXIDE; OXYGENATE PRODUCTION; OLEFIN PRODUCTION; EPOXIDATION UOP (US) 1997-02-04 US disclosed
JP-S63268725-A EPOXY RESIN SOLUTION COMPOSITION DAICEL CHEM IND LTD 1988-11-07 JP disclosed
JP-S63268726-A CURING AGENT SOLUTION COMPOSITION DAICEL CHEM IND LTD 1988-11-07 JP disclosed
US-4404408-A METAL OR NONMETAL COMPLEXES WITH GLYCIDOL, GLYCEROL ETHERS OR GLYCEROL THIOETHERS CIBA-GEIGY CORPORATION (US) 1983-09-13 US disclosed