Known targets — ChEMBL curated mechanism
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
The experimentally established mechanism targets of Phosphoric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphoric Acid SCHEMBL17239106 | 1.00 | CA2 (0.46) | — | |
| Phosphoric Acid SCHEMBL10433144 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL20742850 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL64265 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL490890 | 0.94 | — | — | |
| Phosphoric Acid SCHEMBL10433145 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL2050201 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL11142325 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL11171408 | 0.94 | CA2 (0.50) | — | |
| Phosphoric Acid SCHEMBL8396473 | 0.94 | CA2 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 112 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122060319-A | Low-expansion-coefficient high-temperature nylon composite material for electronic packaging and preparation method thereof | 广东奇德新材料股份有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-122008647-A | High-strength digital printing conveyer belt with multilayer structure | 青岛环球输送带有限公司 | 2026-05-12 | — | — | CN | claimed |
| US-12628652-B2 | Supporting sealant layer structure for stacked die application | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2026-05-12 | — | — | US | claimed |
| US-20260001301-A1 | FOAMED RESIN INSULATION MATERIAL, AND METHOD FOR MANUFACTURING SAME | MEISEI KOGYO KK (JP) | 2026-01-01 | — | — | US | claimed |
| US-12500093-B2 | Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking application | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-12-16 | — | — | US | claimed |
| EP-4588966-A1 | FOAMED RESIN INSULATION MATERIAL, AND METHOD FOR MANUFACTURING SAME | Meisei Industrial Co., Ltd. (JP) | 2025-07-23 | — | — | EP | claimed |
| CN-118136748-B | COB light source with uniform light emission and preparation process thereof | 珠海市宏科光电子有限公司 | 2024-08-16 | — | — | CN | claimed |
| CN-118136748-A | COB light source with uniform light emission and preparation process thereof | 珠海市宏科光电子有限公司 | 2024-06-04 | — | — | CN | claimed |
| US-20240162051-A1 | COMPOSITE PARTICULATES FOR USE AS PART OF A SUPPORTING FILL MIXTURE IN A SEMICONDUTOR SUBSTRATE STACKING APPLICATION | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-05-16 | — | — | US | claimed |
| CN-117995695-A | Method of forming integrated circuit | 台湾积体电路制造股份有限公司 | 2024-05-07 | — | — | CN | claimed |
| US-20160168017-A1 | Lead-Free Glass and Sealing Material | CENTRAL GLASS COMPANY, LIMITED (JP) | 2016-06-16 | — | — | US | claimed |
| CN-104973785-A | Glass Frit Using Glass Powder With Low Melting Point And Crystalline Ceramic Filler With Low Expansion And Paste Comprising The Same | BASS CO LTD | 2015-10-14 | — | — | CN | claimed |
| EP-1942084-B1 | Glass plate with glass frit structure | SAMSUNG DISPLAY CO LTD (KR) | 2014-12-31 | — | — | EP | claimed |
| CN-101215094-B | Glass powder, composition for preparing sealing agent and illumination device | SAMSUNG SDI CO LTD | 2013-01-02 | — | — | CN | claimed |
| US-8110982-B2 | Organic light emitting diode display device and method of fabricating the same | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-02-07 | — | — | US | claimed |
| US-7871949-B2 | Glass plate with glass frit structure | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2011-01-18 | — | — | US | claimed |
| US-20100044730-A1 | Organic light emitting diode display device and method of fabricating the same | SAMSUNG DISPLAY CO., LTD. (KR) | 2010-02-25 | — | — | US | claimed |
| US-20080164462-A1 | Light emitting unit between first and second substrate; sealing material of vanadium glass frit; manufacturing costs are low and deterioration of the light emitting unit prevented; long lifetime | SAMSUNG SDI CO., LTD. (KR) | 2008-07-10 | — | — | US | claimed |
| EP-1942084-A2 | Glass plate with glass frit structure | Samsung SDI Co., Ltd. (KR) | 2008-07-09 | — | — | EP | claimed |
| CN-101215094-A | Glass powder, composition for preparing sealing agent and illumination device | SAMSUNG SDI CO LTD (KR) | 2008-07-09 | — | — | CN | claimed |