Sugi Predict

Sugi Predict / Compounds / SCHEMBL550440

SCHEMBL550440

SCHEMBL550440

Cc1c(C(C)CC(c2cc(C(C)(C)C)c(O)c(C(C)(C)C)c2C)c2cc(C(C)(C)C)c(O)c(C(C)(C)C)c2C)cc(C(C)(C)C)c(O)c1C(C)(C)C

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 5/20 0.38
▸ SMN1; SMN2 Q16637 4/20 0.38
▸ CA2 P00918 3/20 0.38
▸ POLB P06746 1/20 0.38
▸ TYR P14679 1/20 0.38
▸ CYP2C9 P11712 7/20 0.37
▸ CYP2C19 P33261 7/20 0.37
▸ CYP2D6 P10635 4/20 0.37
▸ TP53 P04637 3/20 0.37
▸ ALOX15 P16050 3/20 0.37
▸ HIF1A Q16665 5/20 0.36
▸ HSPA5 P11021 2/20 0.36
▸ CA1 P00915 2/20 0.35
▸ CYP1A2 P05177 5/20 0.35
▸ TSHR P16473 4/20 0.35
▸ CYP3A4 P08684 3/20 0.35
▸ GLRA3 O75311 1/20 0.34
▸ GLRB P48167 1/20 0.34
▸ PTGS1 P23219 1/20 0.33
▸ PTGS2 P35354 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3286187 0.83 CYP2C9 (0.47) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL3286349 0.80 SMN1; SMN2 (0.45) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL5013719 0.80 CYP2C9 (0.59) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL9770229 0.78 CYP2C9 (0.38) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL4651373 0.72 RORC (0.35) TSHRLMNA
SCHEMBL6020246 0.72 CA2 (0.37) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL26591 0.72 CYP2C9 (0.65) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL3083256 0.72 RORC (0.38) ALDH1A1CYP2C9CYP2C19CYP2D6TP53
SCHEMBL29368497 0.72 CYP2C9 (0.65) ALDH1A1SMN1; SMN2CA2POLBTYR
SCHEMBL29359445 0.72 CYP2C9 (0.65) ALDH1A1SMN1; SMN2CA2POLBTYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 — — EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 — — US disclosed
US-7993562-B2 Method of producing a thermoplastic film FUJIFILM CORPORATION (JP) 2011-08-09 — — US disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 — — EP disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 — — US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 — — US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 — — US disclosed
US-7449519-B2 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2008-11-11 — — US disclosed
US-20070281112-A1 Thermoplastic film and method of producing the same, polarizing plate, optical compensation film, antireflection film and liquid-crystal display device FUJIFILM CORPORATION (JP) 2007-12-06 — — US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 — — EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 — — US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 — — EP disclosed
US-20060079605-A1 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2006-04-13 — — US disclosed
EP-1616886-A1 CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION Konishi Co., Ltd. (JP) 2006-01-18 — — EP disclosed