SCHEMBL550887

SCHEMBL550887

Cc1ccc(O)c(Cc2c(O)ccc(C)c2C(C)(C)C)c1C(C)(C)C

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 9/20 0.38
ESR2 Q92731 6/20 0.38
HSD17B10 Q99714 3/20 0.35
CYP2C9 P11712 3/20 0.35
CYP1A2 P05177 2/20 0.35
CYP2C19 P33261 2/20 0.35
AR P10275 2/20 0.35
TP53 P04637 3/20 0.35
ALDH1A1 P00352 2/20 0.34
ALOX15 P16050 2/20 0.34
TDP1 Q9NUW8 2/20 0.34
HPGD P15428 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
HIF1A Q16665 1/20 0.34
NR1I2 O75469 1/20 0.33
LMNA P02545 1/20 0.33
MIF P14174 1/20 0.33
TYR P14679 1/20 0.33
HTT P42858 1/20 0.33
NFE2L2 Q16236 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29196855 0.88 ESR1 (0.39) ESR1ESR2HSD17B10CYP2C9AR
SCHEMBL4580621 0.84 HSPA5 (0.47) ESR1ESR2HSD17B10CYP1A2TP53
SCHEMBL9789808 0.83 ESR1 (0.38) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL36472 0.78 ESR1 (0.43) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL29359879 0.78 ESR1 (0.43) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL551395 0.76 ESR1 (0.39) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL8890931 0.76 ESR1 (0.41) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL2051069 0.76 TRPA1 (0.46) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL1053673 0.76 ESR1 (0.41) ESR1ESR2HSD17B10CYP2C9CYP1A2
SCHEMBL30438308 0.76 TRPA1 (0.46) ESR1ESR2HSD17B10CYP2C9CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 141 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-5239185-A None JP disclosed
US-6384179-B1 None US disclosed
WO-2026101220-A1 POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDED ARTICLE PREPARED THEREFROM 코오롱이앤피 주식회사 2026-05-15 WO disclosed
CN-119403843-A Polymer and method for producing same, photosensitive resin composition, cured product, and monomer compound and method for producing same 株式会社日本触媒 2025-02-07 CN disclosed
WO-2023248976-A1 POLYMER AND METHOD FOR PRODUCING SAME, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND MONOMER COMPOUND AND METHOD FOR PRODUCING SAME 株式会社日本触媒 2023-12-28 WO disclosed
EP-4032944-B1 METHOD FOR PRODUCING OXYMETHYLENE COPOLYMER RESIN COMPOSITION, AND OXYMETHYLENE COPOLYMER RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2023-12-13 EP disclosed
US-11820857-B2 Method for producing oxymethylene copolymer resin composition, and oxymethylene copolymer resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-11-21 US disclosed
US-20230120998-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2023-04-20 US disclosed
EP-3133123-B1 SEMIAROMATIC POLYAMIDE RESIN COMPOSITION AND FORMED BODY OBTAINED BY FORMING SAME UNITIKA LTD (JP) 2022-12-28 EP disclosed
US-20220356290-A1 METHOD FOR PRODUCING OXYMETHYLENE COPOLYMER RESIN COMPOSITION, AND OXYMETHYLENE COPOLYMER RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-11-10 US disclosed
US-6388049-B1 MOLDING MATERIALS; NARROW MOLECULAR WEIGHT DISTRIBUTION ASAHI KASEI KABUSHIKI KAISHA (JP) 2002-05-14 US disclosed
US-6384179-B2 COMPRISES 30-90% BY WEIGHT OF POLYACETAL COPOLYMER HAVING A MELT INDEX OF LESS THAN 1 G/10 MIN. AS COMPONENT A AND 70-10% BY WEIGHT OF POLYACETAL COPOLYMER HAVING A MELT INDEX OF 1-100 G/10 MIN. AS COMPONENT B; TOUGHNESS, CREEP RESISTANCE ASAHI KASEI KABUSHIKI KAISHA (JP) 2002-05-07 US disclosed
US-6365655-B1 SUBJECTING AN OXYMETHYLENE COPOLYMER HAVING THERMALLY UNSTABLE TERMINAL GROUPS TO HEAT TREATMENT IN THE PRESENCE OF AT LEAST ONE QUATERNARY AMMONIUM COMPOUND FOR STABILIZATION ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2002-04-02 US disclosed
EP-1132775-A1 Presensitized plate useful for preparing a lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2001-09-12 EP disclosed
EP-0366377-B1 Hydrogenated copolymer rubber, rubber composition comprising said rubber, and rubber product obtained from the rubber JAPAN SYNTHETIC RUBBER CO LTD (JP) 1994-12-14 EP disclosed
US-5252431-A Light sensitive layer and silicone rubber layer; spraying pressurized liquid on the surface to remove the rubber layer FUJI PHOTO FILM CO., LTD. (JP) 1993-10-12 US disclosed
JP-H05239185-A SEALING EPOXY RESIN MOLDING MATERIAL MATSUSHITA ELECTRIC WORKS LTD 1993-09-17 JP disclosed
US-5093426-A Good resistance to low temperature, heat, ozone and oil JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-03 US disclosed
US-4522965-A HIGH HEAT RESISTANCE AND BOND STRENGTH BAYER AKTIENGESELLSCHAFT (DE) 1985-06-11 US disclosed
US-4003960-A CATALYTIC COPOLYMERIZATION OF A POLYLACTAM AND FORMALDEHYDE SOCIETA'ITALIANA RESINE S.I.R. S.P.A. (IT) 1977-01-18 US disclosed