SCHEMBL5512252

SCHEMBL5512252

OCOC1CC2C=CC1C2

nearest known ligand 0.34

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.34
LMNA P02545 1/20 0.34
ALDH1A1 P00352 2/20 0.33
GAA P10253 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
EPHX2 P34913 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1088898 0.83 KDM4E (0.32) KDM4ELMNAALDH1A1GAATDP1
SCHEMBL1615141 0.78 ALDH1A1 (0.38) KDM4ELMNAALDH1A1
SCHEMBL13806131 0.76 KDM4E (0.38) KDM4ELMNAALDH1A1TDP1EPHX2
SCHEMBL13888424 0.75
SCHEMBL4742224 0.75 KDM4E (0.36) KDM4EALDH1A1
SCHEMBL31695329 0.75 KDM4E (0.30) KDM4ELMNAALDH1A1
SCHEMBL11526453 0.74 KDM4E (0.35) KDM4EALDH1A1
SCHEMBL5070758 0.74
SCHEMBL1875963 0.72 KDM4E (0.32) KDM4ELMNA
SCHEMBL32689154 0.72 EPHX2 (0.40) KDM4ELMNAALDH1A1GAATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130164680-A1 PHOTORESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND PATTERN FORMING METHOD USING THEREOF INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-06-27 US disclosed
US-20130164680-A1 PHOTORESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND PATTERN FORMING METHOD USING THEREOF INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-06-27 US disclosed
US-20120122031-A1 PHOTORESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND PATTERN FORMING METHOD USING THEREOF INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-05-17 US disclosed
US-20120122031-A1 PHOTORESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND PATTERN FORMING METHOD USING THEREOF INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2012-05-17 US disclosed
US-7714087-B2 Polar group-containing olefin copolymer, process for preparing the same, thermoplastic resin composition containing the copolymer, and uses thereof MITSUI CHEMICALS, INC. (JP) 2010-05-11 US disclosed
US-7700262-B2 Top coat material and use thereof in lithography processes INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-04-20 US disclosed
US-7700262-B2 Top coat material and use thereof in lithography processes INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-04-20 US disclosed
US-20090137757-A1 Polar group-containing olefin copolymer, process for preparing the same, thermoplastic resin composition containing the copolymer, and uses thereof IMUTA JUNICHI 2009-05-28 US disclosed
US-20080166568-A1 TOP COAT MATERIAL AND USE THEREOF IN LITHOGRAPHY PROCESSES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-07-10 US disclosed
US-7393907-B2 Polar group-containing olefin copolymer, process for preparing the same, thermoplastic resin composition containing the copolymer, and uses thereof MITSUI CHEMICALS, INC. (JP) 2008-07-01 US disclosed
US-7335456-B2 Top coat material and use thereof in lithography processes INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-02-26 US disclosed
US-7335456-B2 Top coat material and use thereof in lithography processes INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-02-26 US disclosed
US-20080038676-A1 TOP COAT MATERIAL AND USE THEREOF IN LITHOGRAPHY PROCESSES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-02-14 US disclosed