SCHEMBL551679

SCHEMBL551679

CC=CC(=O)OC[SiH](OCC)OCC

nearest known ligand 0.39

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 5/20 0.39
ATM Q13315 1/20 0.35
GSTP1 P09211 1/20 0.34
MAPT P10636 1/20 0.33
CA12 O43570 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA7 P43166 1/20 0.32
CA9 Q16790 1/20 0.32
CA14 Q9ULX7 1/20 0.32
NPSR1 Q6W5P4 1/20 0.31
ALDH1A1 P00352 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL675802 0.85 HCAR2 (0.43) HCAR2ATMGSTP1MAPTNPSR1
SCHEMBL552010 0.82 GSTP1 (0.37) HCAR2ATMGSTP1ALDH1A1
SCHEMBL15312340 0.81 ATM (0.41) HCAR2ATMGSTP1MAPTCA12
SCHEMBL147607 0.79 ATM (0.47) HCAR2ATMMAPTNPSR1ALDH1A1
SCHEMBL107385 0.78 TSHR (0.47) HCAR2NPSR1ALDH1A1
SCHEMBL27879946 0.77 GSTP1 (0.34) HCAR2ATMGSTP1
SCHEMBL264867 0.77
SCHEMBL182296 0.77
SCHEMBL24483 0.77
SCHEMBL22129657 0.76 HCAR2 (0.45) HCAR2ATMMAPTNPSR1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117887083-A Photo-curing ceramic precursor and preparation method and application thereof 佛山莽苍新材料有限公司 2024-04-16 CN claimed
CN-113122032-B Primer composition and laminate 财团法人工业技术研究院 2022-03-15 CN claimed
CN-113122032-A Primer composition and laminate 财团法人工业技术研究院 2021-07-16 CN claimed
CN-117887083-A Photo-curing ceramic precursor and preparation method and application thereof 佛山莽苍新材料有限公司 2024-04-16 CN disclosed
WO-2024038771-A1 WATER REPELLENT COMPOSITION AND FIBER TREATMENT AGENT 信越化学工業株式会社 2024-02-22 WO disclosed
CN-116622010-A Composite carrier type olefin polymerization catalyst and preparation method and application thereof 广东石油化工学院 2023-08-22 CN disclosed
US-20230212443-A1 RESIN COMPOSITION AND CURED PRODUCT THEREOF HENKEL AG & CO KGAA (DE) 2023-07-06 US disclosed
US-20230087974-A1 ADHESIVE COMPOSITION AND CURED PRODUCT THEREOF HENKEL AG & CO KGAA (DE) 2023-03-23 US disclosed
WO-2023020763-A1 EMI SHIELDING ADHESIVE COMPOSITION AND ITS USE HENKEL AG & CO. KGAA (DE) 2023-02-23 WO disclosed
EP-4137548-A1 EMI SHIELDING ADHESIVE COMPOSITION AND ITS USE Henkel AG & Co. KGaA (DE) 2023-02-22 EP disclosed
WO-2022043158-A1 RESIN COMPOSITION AND CURED PRODUCT THEREOF HENKEL AG & CO. KGAA (DE) 2022-03-03 WO disclosed
EP-1514903-A1 CURABLE RESIN COMPOSITION Konishi Co., Ltd. (JP) 2005-03-16 EP disclosed
EP-1035184-B1 WATER-BASE SYNTHETIC RESIN DISPERSION COMPOSITION DAIKIN IND LTD (JP) 2005-03-16 EP disclosed
US-20040092640-A1 Automotive adhesive ISHIZAKI HONTEN CO., LTD. (JP) 2004-05-13 US disclosed
EP-1026202-B1 AQUEOUS RESIN DISPERSION COMPOSITION DAIKIN IND LTD (JP) 2004-04-07 EP disclosed
EP-1380625-A1 AUTOMOTIVE ADHESIVE KONISHI CO., LTD. (JP) 2004-01-14 EP disclosed
US-6541552-B1 Polysilicates for paints having high gloss, stain-proofing, weather resistance, and storage stability DAIKIN INDUSTRIES, LTD. (JP) 2003-04-01 US disclosed
US-6359030-B1 FOR FILM, COATING FILM BEING EXCELLENT IN CHEMICAL RESISTANCE, WATER RESISTANCE, MECHANICAL PROPERTIES DAIKIN INDUSTRIES, LTD. (JP) 2002-03-19 US disclosed
EP-1035184-A1 WATER-BASE SYNTHETIC RESIN DISPERSION COMPOSITION Daikin Industries, Ltd. (JP) 2000-09-13 EP disclosed
EP-1026202-A1 AQUEOUS RESIN DISPERSION COMPOSITION Daikin Industries, Ltd. (JP) 2000-08-09 EP disclosed