SCHEMBL556230

SCHEMBL556230

CC1(N)CCCC(CC2CCCC(C)(N)C2)C1

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ARG1 P05089 1/20 0.32
ALDH1A1 P00352 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL466142 0.84 CYP2D6 (0.32) ARG1ALDH1A1TDP1
SCHEMBL14199658 0.84 CYP2D6 (0.32) ARG1ALDH1A1TDP1
SCHEMBL466084 0.84 CYP2D6 (0.32) ARG1ALDH1A1TDP1
SCHEMBL466085 0.84 CYP2D6 (0.32) ARG1ALDH1A1TDP1
SCHEMBL2138556 0.84 NCF1 (0.32) ARG1ALDH1A1TDP1
SCHEMBL7213243 0.84 CYP2D6 (0.32) ARG1ALDH1A1TDP1
Hydrochloric Acid SCHEMBL907394 0.83 CYP2D6 (0.31) ARG1
SCHEMBL14098466 0.83 ARG1 (0.33) ARG1
Hydrochloric Acid SCHEMBL907395 0.83 CYP2D6 (0.31) ARG1
SCHEMBL466147 0.81 ARG1 (0.36) ARG1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 US disclosed