Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.40 |
| ▸ | CES1 | P23141 | 3/20 | 0.32 |
| ▸ | CES2 | O00748 | 4/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | FAAH | O00519 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL555915 | 0.98 | ALDH1A1 (0.41) | ALDH1A1CES1CES2LMNAHSD17B10 | |
| Acetic Acid SCHEMBL28104724 | 0.92 | ALDH1A1 (0.38) | ALDH1A1CES1HSD17B10 | |
| SCHEMBL1082002 | 0.92 | ALDH1A1 (0.38) | ALDH1A1CES1CES2HSD17B10FAAH | |
| SCHEMBL11744217 | 0.90 | ALDH1A1 (0.36) | ALDH1A1 | |
| SCHEMBL557512 | 0.90 | ALDH1A1 (0.39) | ALDH1A1CES1CES2HSD17B10FAAH | |
| SCHEMBL556789 | 0.90 | ALDH1A1 (0.39) | ALDH1A1CES1CES2HSD17B10FAAH | |
| SCHEMBL133348 | 0.89 | ALDH1A1 (0.44) | ALDH1A1CES1CES2LMNAHSD17B10 | |
| Water SCHEMBL9118662 | 0.88 | ALDH1A1 (0.38) | ALDH1A1CES1CES2HSD17B10FAAH | |
| SCHEMBL7889813 | 0.87 | ALDH1A1 (0.38) | ALDH1A1CES2 | |
| SCHEMBL8561226 | 0.87 | ALDH1A1 (0.34) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1652891-B1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO LTD (JP) | 2012-06-13 | — | — | EP | disclosed |
| US-8110645-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2012-02-07 | — | — | US | disclosed |
| EP-1788035-B1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | KONISHI CO LTD (JP) | 2011-01-19 | — | — | EP | disclosed |
| US-20090264602-A1 | Curable Resin Composition and Cold Setting Adhesive | KONISHI CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7576167-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2009-08-18 | — | — | US | disclosed |
| US-20080312401-A1 | Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive | SATO SHINICHI | 2008-12-18 | — | — | US | disclosed |
| US-7449519-B2 | Curing resin, method for producing same and curing resin composition | KONISHI CO., LTD. (JP) | 2008-11-11 | — | — | US | disclosed |
| EP-1788035-A1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | Konishi Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20060189736-A1 | Curable resin composition and cold-setting adhesive | KONISHI CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| EP-1652891-A1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |
| US-20060079605-A1 | Curing resin, method for producing same and curing resin composition | KONISHI CO., LTD. (JP) | 2006-04-13 | — | — | US | disclosed |
| EP-1616886-A1 | CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION | Konishi Co., Ltd. (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-20050182225-A1 | Curable resin composition | KONISHI CO. LTD (JP) | 2005-08-18 | — | — | US | disclosed |
| EP-1514903-A1 | CURABLE RESIN COMPOSITION | Konishi Co., Ltd. (JP) | 2005-03-16 | — | — | EP | disclosed |