Sugi Predict

Sugi Predict / Compounds / SCHEMBL556789

SCHEMBL556789

SCHEMBL556789

CCCCCCCCCCCC[Sn](CCCCCCCCCCCC)(OC(C)=O)O[Sn](CCCCCCCCCCCC)(CCCCCCCCCCCC)OC(C)=O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 3/20 0.39
▸ CES2 O00748 5/20 0.38
▸ FAAH O00519 1/20 0.37
▸ CES1 P23141 3/20 0.37
▸ TSHR P16473 6/20 0.36
▸ GPR84 Q9NQS5 7/20 0.35
▸ PPARG P37231 6/20 0.35
▸ PPARD Q03181 6/20 0.35
▸ PPARA Q07869 6/20 0.35
▸ HDAC11 Q96DB2 5/20 0.35
▸ TLR2 O60603 2/20 0.35
▸ TDP1 Q9NUW8 2/20 0.35
▸ FABP4 P15090 2/20 0.35
▸ PTPN1 P18031 2/20 0.35
▸ SLC22A6 Q4U2R8 1/20 0.35
▸ SLC22A8 Q8TCC7 1/20 0.35
▸ MEN1 O00255 1/20 0.35
▸ ESR1 P03372 1/20 0.35
▸ ALOX15 P16050 1/20 0.35
▸ PDE4A P27815 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL557512 1.00 ALDH1A1 (0.39) ALDH1A1CES2FAAHCES1TSHR
SCHEMBL1082002 0.98 ALDH1A1 (0.38) ALDH1A1CES2FAAHCES1TSHR
Water SCHEMBL9118662 0.98 ALDH1A1 (0.38) ALDH1A1CES2FAAHCES1TSHR
SCHEMBL555915 0.92 ALDH1A1 (0.41) ALDH1A1CES2FAAHCES1TSHR
SCHEMBL940522 0.92 ALDH1A1 (0.41) ALDH1A1CES2FAAHCES1TSHR
SCHEMBL556316 0.90 ALDH1A1 (0.40) ALDH1A1CES2FAAHCES1HSD17B10
Acetic Acid SCHEMBL28104724 0.86 ALDH1A1 (0.38) ALDH1A1CES1TSHRGPR84PPARG
SCHEMBL11744217 0.85 ALDH1A1 (0.36) ALDH1A1
SCHEMBL133348 0.83 ALDH1A1 (0.44) ALDH1A1CES2FAAHCES1TSHR
SCHEMBL3749921 0.83 ALDH1A1 (0.35) ALDH1A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 — — EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 — — US disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 — — EP disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 — — US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 — — US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 — — US disclosed
US-7449519-B2 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2008-11-11 — — US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 — — EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 — — US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 — — EP disclosed
US-20060079605-A1 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2006-04-13 — — US disclosed
EP-1616886-A1 CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION Konishi Co., Ltd. (JP) 2006-01-18 — — EP disclosed
US-20050182225-A1 Curable resin composition KONISHI CO. LTD (JP) 2005-08-18 — — US disclosed
EP-1514903-A1 CURABLE RESIN COMPOSITION Konishi Co., Ltd. (JP) 2005-03-16 — — EP disclosed