SCHEMBL5567730

SCHEMBL5567730

CCN(CC)C(=O)C12CC3CC(C1)CC(C(=O)N(CC)CC)(C3)C2

nearest known ligand 0.78

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.78
ALDH1A1 P00352 2/20 0.50
NPSR1 Q6W5P4 1/20 0.45
MEN1 O00255 3/20 0.42
KMT2A Q03164 3/20 0.42
LMNA P02545 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
HPGD P15428 1/20 0.41
HTT P42858 1/20 0.41
MCOLN3 Q8TDD5 1/20 0.41
PKM P14618 1/20 0.41
DPP4 P27487 2/20 0.40
HSD11B1 P28845 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5569071 0.93 GAA (0.69) GAAALDH1A1NPSR1MEN1KMT2A
SCHEMBL6140108 0.88 GAA (0.67) GAAALDH1A1MEN1KMT2ALMNA
SCHEMBL5081739 0.88 GAA (0.62) GAAALDH1A1NPSR1MEN1KMT2A
SCHEMBL5080904 0.81 GAA (0.55) GAAALDH1A1MEN1KMT2ASMN1; SMN2
SCHEMBL5081738 0.81 GAA (0.55) GAAALDH1A1MEN1KMT2ASMN1; SMN2
SCHEMBL5081795 0.81 GAA (0.52) GAAALDH1A1LMNA
SCHEMBL6058712 0.78 MEN1 (0.59) GAAALDH1A1NPSR1MEN1KMT2A
SCHEMBL25833496 0.75 GAA (0.52) GAAALDH1A1NPSR1MEN1KMT2A
SCHEMBL14879971 0.74 GAA (0.47) GAAALDH1A1NPSR1MEN1KMT2A
SCHEMBL5080935 0.74 GAA (0.46) GAAALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070078256-A1 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-04-05 US disclosed
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed