Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL9198276 | 0.97 | KDM4E (0.42) | — | |
| SCHEMBL142703 | 0.97 | — | — | |
| SCHEMBL372419 | 0.93 | — | — | |
| SCHEMBL30395307 | 0.93 | — | — | |
| Fluoride SCHEMBL19181824 | 0.93 | — | — | |
| Bromide SCHEMBL384403 | 0.93 | — | — | |
| SCHEMBL7607070 | 0.93 | KDM4E (0.44) | — | |
| SCHEMBL2866854 | 0.93 | KDM4E (0.44) | — | |
| Fluoride Ion SCHEMBL1996850 | 0.93 | — | — | |
| Iodide SCHEMBL1681443 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113383408-B | Treatment liquid for semiconductor wafer containing onium salt | 株式会社德山 | 2025-04-08 | — | — | CN | claimed |
| US-20150335547-A1 | ORAL CARE COMPOSITION CONTAINING IONIC LIQUIDS | COLGATE-PALMOLIVE COMPANY (US) | 2015-11-26 | — | — | US | claimed |
| EP-2934469-A2 | ORAL CARE COMPOSITION CONTAINING IONIC LIQUIDS | Colgate-Palmolive Company (US) | 2015-10-28 | — | — | EP | claimed |
| WO-2014098871-A2 | ORAL CARE COMPOSITION CONTAINING IONIC LIQUIDS | COLGATE-PALMOLIVE COMPANY (US) | 2014-06-26 | — | — | WO | claimed |
| EP-0398358-B1 | Aluminum electroplating method | MITSUBISHI PETROCHEMICAL CO (JP) | 1994-03-09 | — | — | EP | claimed |
| US-5041194-A | Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1991-08-20 | — | — | US | claimed |
| EP-0398358-A2 | Aluminum electroplating method | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1990-11-22 | — | — | EP | claimed |
| JP-3134194-A | — | — | None | — | — | JP | disclosed |
| US-12600909-B2 | Etching solution composition | RASA INDUSTRIES, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| EP-4622978-A1 | PROCESS FOR THE PRODUCTION OF HYDRIDOSILANES | Momentive Performance Materials GmbH (DE) | 2025-10-01 | — | — | EP | disclosed |
| CN-113383408-B | Treatment liquid for semiconductor wafer containing onium salt | 株式会社德山 | 2025-04-08 | — | — | CN | disclosed |
| CN-114566723-B | Electrolyte for rechargeable electrochemical cells | EOS能源技术控股有限责任公司 | 2025-03-04 | — | — | CN | disclosed |
| WO-2025028268-A1 | ETCHING LIQUID REGENERATION METHOD | ラサ工業株式会社 | 2025-02-06 | — | — | WO | disclosed |
| US-20110150736-A1 | IONIC COMPOUND, METHOD FOR PRODUCING THE SAME, AND ION-CONDUCTIVE MATERIAL COMPRISING THE SAME | NIPPON SHOKUBAI CO., LTD. (JP) | 2011-06-23 | — | — | US | disclosed |
| EP-2327707-A1 | IONIC COMPOUND, PROCESS FOR PRODUCING SAME, AND ION-CONDUCTIVE MATERIAL COMPRISING SAME | Nippon Shokubai Co., Ltd. (JP) | 2011-06-01 | — | — | EP | disclosed |
| US-20090101514-A1 | Electrodeposition Method for Metals | KYOTO UNIVERSITY (JP) | 2009-04-23 | — | — | US | disclosed |
| EP-0398358-B1 | Aluminum electroplating method | MITSUBISHI PETROCHEMICAL CO (JP) | 1994-03-09 | — | — | EP | disclosed |
| US-5041194-A | Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1991-08-20 | — | — | US | disclosed |
| JP-H03134194-A | LOW-MELTING POINT COMPOSITION AND ELECTRIC ALUMINUM PLATING METHOD | MITSUBISHI PETROCHEM CO LTD | 1991-06-07 | — | — | JP | disclosed |
| EP-0398358-A2 | Aluminum electroplating method | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1990-11-22 | — | — | EP | disclosed |