SCHEMBL5567903

SCHEMBL5567903

O=C(O)C12CC3CC(C1)CC(C(=O)Oc1ccccc1)(C3)C2

nearest known ligand 0.54

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.54
MAPT P10636 1/20 0.54
XBP1 P17861 1/20 0.54
KDM4E B2RXH2 1/20 0.51
KMT2A Q03164 1/20 0.45
LMNA P02545 4/20 0.45
TP53 P04637 1/20 0.45
POLB P06746 1/20 0.45
RBP4 P02753 1/20 0.44
HSD11B1 P28845 2/20 0.41
HSD11B2 P80365 1/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
PKM P14618 1/20 0.41
P2RX7 Q99572 1/20 0.41
HPGD P15428 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5567915 0.95 GAA (0.58) GAAMAPTXBP1KDM4EKMT2A
SCHEMBL5080864 0.87 GAA (0.49) GAAMAPTXBP1KDM4EKMT2A
SCHEMBL5078724 0.87 GAA (0.49) GAAMAPTXBP1KDM4EKMT2A
SCHEMBL1634162 0.85 GAA (0.72) GAAMAPTXBP1KDM4EKMT2A
SCHEMBL5082277 0.85 MAPT (0.53) GAAMAPTXBP1KDM4EKMT2A
SCHEMBL5084629 0.83 MAPT (0.42) GAAMAPTXBP1KDM4ELMNA
SCHEMBL5081791 0.83 MAPT (0.42) GAAMAPTXBP1KDM4ELMNA
SCHEMBL5082335 0.83 MAPT (0.42) GAAMAPTXBP1KDM4ELMNA
SCHEMBL5078650 0.81 MAPT (0.46) GAAMAPTXBP1KDM4EKMT2A
SCHEMBL14651305 0.81 HSD11B1 (0.59) GAAMAPTXBP1KDM4EKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070078256-A1 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-04-05 US disclosed
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed