SCHEMBL5568128

SCHEMBL5568128

O=C(OC1CCCCO1)C12CC3CC(C1)CC(C(=O)OC1CCCCO1)(C3)C2

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 1/20 0.39
NPSR1 Q6W5P4 1/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
LMNA P02545 2/20 0.38
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
EPHX2 P34913 1/20 0.36
GAA P10253 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.33
ALDH1A1 P00352 1/20 0.32
HSD11B1 P28845 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5568216 0.94 L3MBTL1 (0.37) MAPK1NPSR1SMN1; SMN2LMNAMEN1
SCHEMBL5562876 0.91 MEN1 (0.35) MAPK1SMN1; SMN2LMNAMEN1KMT2A
SCHEMBL5697624 0.91 EPHX2 (0.39) NPSR1LMNAMEN1KMT2AEPHX2
SCHEMBL5568688 0.87 MEN1 (0.35) MEN1KMT2AEPHX2
SCHEMBL5568098 0.85 MEN1 (0.34) MEN1KMT2AEPHX2
SCHEMBL5568107 0.85 MEN1 (0.34) MEN1KMT2AEPHX2
SCHEMBL6742823 0.83 EPHX2 (0.30) EPHX2
SCHEMBL1143414 0.82 NPSR1 (0.30) NPSR1
SCHEMBL5563190 0.81 MEN1 (0.35) MEN1KMT2A
SCHEMBL5567918 0.81 MEN1 (0.35) MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070078256-A1 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-04-05 US disclosed
US-7163781-B2 Process for producing a semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2007-01-16 US disclosed
US-7163781-B2 Process for producing a semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2007-01-16 US disclosed
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed