SCHEMBL5568688

SCHEMBL5568688

O=C(OC1CCCCO1)C12CC3(C(=O)OC4CCCCO4)CC(C(=O)OC4CCCCO4)(C1)CC(C(=O)OC1CCCCO1)(C2)C3

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
EPHX2 P34913 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5567918 0.93 MEN1 (0.35) MEN1KMT2A
SCHEMBL5563190 0.93 MEN1 (0.35) MEN1KMT2A
SCHEMBL5562876 0.90 MEN1 (0.35) MEN1KMT2AEPHX2
SCHEMBL5568128 0.87 MAPK1 (0.39) MEN1KMT2AEPHX2
SCHEMBL5568107 0.85 MEN1 (0.34) MEN1KMT2AEPHX2
SCHEMBL5568098 0.85 MEN1 (0.34) MEN1KMT2AEPHX2
SCHEMBL1306032 0.83 MEN1 (0.32) MEN1KMT2AEPHX2
SCHEMBL5697624 0.83 EPHX2 (0.39) MEN1KMT2AEPHX2
SCHEMBL13868184 0.82 MEN1 (0.30) MEN1KMT2A
SCHEMBL5568216 0.82 L3MBTL1 (0.37) MEN1KMT2AEPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070078256-A1 Prepolymers, prepolymer compositions, high-molecular-weight polymers with pore structure, and dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2007-04-05 US disclosed
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed