SCHEMBL5573010

SCHEMBL5573010

CCC1Cc2cccc3cccc1c23

nearest known ligand 0.60

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MTNR1A P48039 16/20 0.60
MTNR1B P49286 16/20 0.60
KDM4E B2RXH2 1/20 0.38
CYP3A4 P08684 1/20 0.38
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10447564 0.82 MTNR1A (0.53) MTNR1AMTNR1BKDM4E
SCHEMBL9861720 0.82 MTNR1A (0.59) MTNR1AMTNR1B
SCHEMBL4589790 0.81 MTNR1A (0.59) MTNR1AMTNR1BKDM4ECYP3A4TSHR
SCHEMBL6634146 0.81 HTR2A (0.56) MTNR1AMTNR1BCYP3A4TSHR
SCHEMBL25739761 0.81 MTNR1A (0.55) MTNR1AMTNR1B
Hydrochloric Acid SCHEMBL10598473 0.80 HTR2A (0.54) MTNR1AMTNR1BCYP3A4TSHR
SCHEMBL5449210 0.79 MTNR1A (0.52) MTNR1AMTNR1BKDM4ECYP3A4TSHR
SCHEMBL6635133 0.79 MTNR1A (0.57) MTNR1AMTNR1BCYP3A4TSHR
SCHEMBL11883759 0.78 HTR2A (0.46) MTNR1AMTNR1B
SCHEMBL6634086 0.77 MTNR1A (0.51) MTNR1AMTNR1BKDM4ECYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4783438-A Partially pressure-sensitive recording paper KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-11-08 US claimed
CN-113518789-B Resin composition, and prepreg, resin-equipped film, resin-equipped metal foil, metal-clad laminate and wiring board using the same 松下知识产权经营株式会社 2024-08-06 CN disclosed
CN-117720787-A Flexible metal clad laminate and method of making the same 科腾聚合物荷兰有限责任公司 2024-03-19 CN disclosed
CN-112020523-B Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-10-24 CN disclosed
EP-3663351-B1 THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LAMINATE PREPARED FROM SAME SHENGYI TECHNOLOGY CO LTD (CN) 2023-08-23 EP disclosed
CN-111620982-B Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same 南亚新材料科技股份有限公司 2023-02-10 CN disclosed
US-11390735-B2 Thermosetting resin composition and prepreg and metal foil-covered laminate made using same SHENGYI TECHNOLOGY CO., LTD. (CN) 2022-07-19 US disclosed
US-20210070980-A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LAMINATE MADE THEREFROM SHENGYI TECHNOLOGY CO., LTD. (CN) 2021-03-11 US disclosed
CN-111620982-A Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same 南亚新材料科技股份有限公司 2020-09-04 CN disclosed
EP-3663348-A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LAMINATE MADE THEREFROM Shengyi Technology Co., Ltd. (CN) 2020-06-10 EP disclosed
CN-109385018-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-109385021-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-109385020-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-107187153-B The PP synthetic papers and its special-purpose ink that a kind of open air uses 叶骏强 2018-03-27 CN disclosed
CN-107187153-A PP synthetic papers and its special-purpose ink that a kind of open air is used 叶骏强 2017-09-22 CN disclosed
CN-107099868-A A kind of preparation method of the smooth high cut resistant UHMWPE filament fibers in surface 江苏锵尼玛新材料有限公司 2017-08-29 CN disclosed
CN-1914239-B Curable resin composition NIPPON STEEL CHEMICAL CO 2010-05-05 CN disclosed
US-20070248911-A1 Pattern forming method and bilayer film IWASAWA HARUO 2007-10-25 US disclosed
CN-1914239-A Curable resin composition NIPPON STEEL CHEMICAL CO (JP) 2007-02-14 CN disclosed
US-4783438-A Partially pressure-sensitive recording paper KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-11-08 US disclosed