Formic Acid

Formic Acid

SCHEMBL5573577

CC(C)C(C)(C)N.O=CO

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
FDPS P14324 1/20 0.30
ALDH1A1 P00352 1/20 0.30
CYP2C19 P33261 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formic Acid SCHEMBL8505568 0.85
Formic Acid SCHEMBL3812926 0.85 ALDH1A1 (0.35) ALDH1A1CYP2C19
Formic Acid SCHEMBL3682015 0.85
Tert-Butylamine SCHEMBL8647449 0.79
SCHEMBL15141903 0.79 ALDH1A1 (0.33) ALDH1A1CYP2C19
SCHEMBL163513 0.79
Bicarbonate SCHEMBL1896980 0.78 CYP1A2 (0.39) FDPSALDH1A1
Bicarbonate SCHEMBL1896976 0.78 CYP1A2 (0.39) FDPSALDH1A1
Formic Acid SCHEMBL5574502 0.76
Ammonia Solution, Strong SCHEMBL7500908 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117946357-A Granulating method of polyisocyanate curing agent 万华化学集团股份有限公司 2024-04-30 CN claimed
US-20070135565-A1 COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2007-06-14 US disclosed
US-7132473-B2 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2006-11-07 US disclosed
EP-1568744-A1 COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2005-08-31 EP disclosed
US-20040219372-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-11-04 US disclosed