⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2176864 | 0.87 | — | — | |
| SCHEMBL43605 | 0.82 | — | — | |
| SCHEMBL75118 | 0.67 | — | — | |
| SCHEMBL133490 | 0.67 | — | — | |
| SCHEMBL3024488 | 0.67 | — | — | |
| SCHEMBL1401312 | 0.67 | — | — | |
| SCHEMBL15355465 | 0.67 | — | — | |
| SCHEMBL5087331 | 0.67 | — | — | |
| SCHEMBL4076325 | 0.67 | — | — | |
| SCHEMBL60807 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111330163-A | Intraoral light therapy devices and methods of using same | 碧乐生物光子科研控股有限公司 | 2020-06-26 | — | — | CN | disclosed |
| US-8535985-B2 | Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-17 | — | — | US | disclosed |
| US-8531024-B2 | Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-10 | — | — | US | disclosed |
| US-8525214-B2 | Semiconductor chip assembly with post/base heat spreader with thermal via | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-09-03 | — | — | US | disclosed |
| US-8415703-B2 | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-04-09 | — | — | US | disclosed |
| US-8354283-B2 | Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-01-15 | — | — | US | disclosed |
| US-8354688-B2 | Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2013-01-15 | — | — | US | disclosed |
| US-8329510-B2 | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2012-12-11 | — | — | US | disclosed |
| US-8324723-B2 | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2012-12-04 | — | — | US | disclosed |
| US-8314438-B2 | Semiconductor chip assembly with bump/base heat spreader and cavity in bump | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2012-11-20 | — | — | US | disclosed |
| US-20100289054-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND ADHESIVE BETWEEN BASE AND TERMINAL | BRIDGE SEMICONDUCTOR CORPORATION | 2010-11-18 | — | — | US | disclosed |
| US-20100203679-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY OVER THE POST | BRIDGE SEMICONDUCTOR CORPORATION | 2010-08-12 | — | — | US | disclosed |
| US-20100190300-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPREADER AND A CAVITY IN THE BASE | BRIDGE SEMICONDUCTOR CORPORATION | 2010-07-29 | — | — | US | disclosed |
| US-20100190297-A1 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY IN THE POST | BRIDGE SEMICONDUCTOR CORPORATION | 2010-07-29 | — | — | US | disclosed |
| US-20100181594-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST | BRIDGE SEMICONDUCTOR CORPORATION (TW) | 2010-07-22 | — | — | US | disclosed |
| US-20100155769-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE | BRIDGE SEMICONDUCTOR CORPORATION | 2010-06-24 | — | — | US | disclosed |
| US-20100155768-A1 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY IN POST | BRIDGE SEMICONDUCTOR CORPORATION | 2010-06-24 | — | — | US | disclosed |
| US-7573447-B2 | Apparatus and method for driving liquid crystal display device | LG DISPLAY CO., LTD. (KR) | 2009-08-11 | — | — | US | disclosed |
| US-20060007103-A1 | Apparatus and method for driving liquid crystal display device | LG. PHILIPS LCD CO., LTD. | 2006-01-12 | — | — | US | disclosed |
| US-6332432-B1 | Animal-borne imaging and data logging system | NATIONAL GEOGRAPHIC SOCIETY | 2001-12-25 | — | — | US | disclosed |