SCHEMBL5587331

SCHEMBL5587331

CCC[Si](C)(OC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL125173 0.86
SCHEMBL6901118 0.85 LMNA (0.31)
SCHEMBL30711599 0.83
Ammonia Solution, Strong SCHEMBL27783638 0.83
Water SCHEMBL28187598 0.83
Bromide SCHEMBL28210464 0.83
SCHEMBL7528826 0.83 LMNA (0.34)
SCHEMBL122896 0.83
SCHEMBL19809293 0.82
SCHEMBL28083062 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113785085-A Silicon oxide film, material for gas barrier film, and method for producing silicon oxide film 东曹株式会社 2021-12-10 CN disclosed
CN-113045757-A Preparation method of methyl propyl silicone oil containing functional groups 湖北江瀚新材料股份有限公司 2021-06-29 CN disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
CN-110249004-A Polyimide precursor composition 东京应化工业株式会社 2019-09-17 CN disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
CN-108387954-A The manufacturing method of laminated body, flexible devices and laminated body 东京应化工业株式会社 2018-08-10 CN disclosed
CN-108389512-A The manufacturing method of laminated body, flexible devices and laminated body 东京应化工业株式会社 2018-08-10 CN disclosed
CN-108250754-A Containing silicone resin composition, containing silicone resin film, silica membrane, illuminated display element panel and luminous display unit 东京应化工业株式会社 2018-07-06 CN disclosed
EP-1641063-B1 POLYMER ELECTROLYTE, POLYMER ELECTROLYTE MEMBRANE THEREFROM, MEMBRANE ELECTRODE ASSEMBLY AND POLYMER ELECTROLYTE FUEL CELL TORAY INDUSTRIES (JP) 2018-06-20 EP disclosed
CN-107922733-A Polyimide precursor composition 东京应化工业株式会社 2018-04-17 CN disclosed
CN-107709464-A Containing silicone resin composition 东京应化工业株式会社 2018-02-16 CN disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed
CN-107429059-A ENERGY-SENSITIVE RESIN COMPOSITION 东京应化工业株式会社 2017-12-01 CN disclosed
US-8455141-B2 Polymer electrolyte as well as polymer electrolyte membrane, membrane electrode assembly and polymer electrolyte fuel cell using the same TORAY INDUSTRIES, INC. (JP) 2013-06-04 US disclosed
US-20070134530-A1 Polymer electrolyte as well as polymer electrolyte membrane, membrane electrode assembly and polymer electrolyte fuel cell using the same TORAY INDUSTRIES, INC. (JP) 2007-06-14 US disclosed
EP-1641063-A1 POLYMER ELECTROLYTE, POLYMER ELECTROLYTE MEMBRANE THEREFROM, MEMBRANE ELECTRODE ASSEMBLY AND POLYMER ELECTROLYTE FUEL CELL TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-5645901-A RESIN SUBSTRATE, CURED COATING LAMINATED TO SUBSTRATE, SILOXANE CURED COATING CONTAINING FINE SILICA PARTICLES, AND INDIUM TIN OXIDE FILM SHARP KABUSHIKI KAISHA (JP) 1997-07-08 US disclosed