SCHEMBL6901118

SCHEMBL6901118

CCCC[Si](C)(OC)OCC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL101564 0.87 TSHR (0.32) LMNA
SCHEMBL5587331 0.85
SCHEMBL398735 0.85 LMNA (0.35) LMNA
SCHEMBL19809200 0.84 LMNA (0.31) LMNA
Water SCHEMBL28747425 0.82 LMNA (0.34) LMNA
SCHEMBL28436545 0.82
SCHEMBL27719687 0.82 TSHR (0.31)
SCHEMBL28518202 0.82 LMNA (0.33) LMNA
SCHEMBL27674343 0.82
SCHEMBL3687489 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
CN-113785085-A Silicon oxide film, material for gas barrier film, and method for producing silicon oxide film 东曹株式会社 2021-12-10 CN disclosed
CN-107325395-B Polypropylene composition and flame-retardant antistatic pipe 中国石油化工股份有限公司 2020-07-24 CN disclosed
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
CN-110249004-A Polyimide precursor composition 东京应化工业株式会社 2019-09-17 CN disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
CN-108387954-A The manufacturing method of laminated body, flexible devices and laminated body 东京应化工业株式会社 2018-08-10 CN disclosed
CN-108389512-A The manufacturing method of laminated body, flexible devices and laminated body 东京应化工业株式会社 2018-08-10 CN disclosed
CN-108250754-A Containing silicone resin composition, containing silicone resin film, silica membrane, illuminated display element panel and luminous display unit 东京应化工业株式会社 2018-07-06 CN disclosed
CN-107922733-A Polyimide precursor composition 东京应化工业株式会社 2018-04-17 CN disclosed
CN-107709464-A Containing silicone resin composition 东京应化工业株式会社 2018-02-16 CN disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed
CN-107429059-A ENERGY-SENSITIVE RESIN COMPOSITION 东京应化工业株式会社 2017-12-01 CN disclosed
US-6723865-B2 FOR PRODUCING STEREOBLOCK POLYPROPYLENE BASELL POLIOLEFINE ITALIA S.P.A. (IT) 2004-04-20 US disclosed
US-5594079-A COORDINATION CATALYST CONTAINING BORON, STEREOREGULAR POLYPROPYLENE TOSOH CORPORATION (JP) 1997-01-14 US disclosed
EP-0582278-A2 Method for producing a polyolefin TOSOH CORPORATION (JP) 1994-02-09 EP disclosed