Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Bicarbonate SCHEMBL28854272 | 0.78 | TSHR (0.35) | TSHRNFKB1CYP2C19 | |
| SCHEMBL3640852 | 0.78 | TSHR (0.35) | TSHRNFKB1CYP2C19 | |
| SCHEMBL10987735 | 0.74 | — | — | |
| SCHEMBL6685009 | 0.72 | — | — | |
| SCHEMBL9065657 | 0.72 | — | — | |
| SCHEMBL10891519 | 0.72 | — | — | |
| SCHEMBL27612828 | 0.71 | TSHR (0.33) | TSHRNFKB1CYP2C19 | |
| Sebacic Acid SCHEMBL8181504 | 0.71 | TSHR (0.39) | ALDH1A1ALOX15TSHRNFKB1CYP2C19 | |
| SCHEMBL11586258 | 0.69 | CYP2C19 (0.37) | ALDH1A1CYP2D6TSHRNFKB1CYP2C19 | |
| SCHEMBL14463136 | 0.69 | ITGB3 (0.35) | ALDH1A1CYP2D6TSHRNFKB1CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4386037-A1 | SILPHENYLENE-SKELETON-CONTAINING POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-19 | — | — | EP | disclosed |
| US-20240184206-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR PATTERNING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-06-06 | — | — | US | disclosed |
| EP-4365679-A1 | LAYERED BODY, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-05-08 | — | — | EP | disclosed |
| EP-3656803-B1 | POLYSILOXANE SKELETON POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2024-04-10 | — | — | EP | disclosed |
| EP-3070137-B1 | SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-12-27 | — | — | EP | disclosed |
| EP-3597704-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING PROCESS | SHINETSU CHEMICAL CO (JP) | 2023-10-25 | — | — | EP | disclosed |
| US-11693317-B2 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-04 | — | — | US | disclosed |
| EP-3572879-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-04-19 | — | — | EP | disclosed |
| EP-3505551-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING PROCESS, AND FABRICATION OF OPTO-SEMICONDUCTOR DEVICE | SHINETSU CHEMICAL CO (JP) | 2023-02-08 | — | — | EP | disclosed |
| US-20230030194-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, AND LIGHT EMITTING DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-02-02 | — | — | US | disclosed |
| CN-105722939-A | Silicone adhesive composition and solid-state imaging device | 信越化学工业株式会社 | 2016-06-29 | — | — | CN | disclosed |
| US-9263333-B2 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-02-16 | — | — | US | disclosed |
| US-20140154868-A1 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHERING MATERIAL FOR PROCESSING WAFER, AND MANUFACTURING METHOD OF THIN WAFER | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-06-05 | — | — | US | disclosed |
| EP-2738797-A2 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Shin-Etsu Chemical Co., Ltd. (JP) | 2014-06-04 | — | — | EP | disclosed |
| US-8735264-B2 | Temporary adhesive composition and method for manufacturing thin wafer using the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-27 | — | — | US | disclosed |
| US-20130089967-A1 | TEMPORARY ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-11 | — | — | US | disclosed |
| EP-2578656-A1 | Temporary adhesive composition and method for manufacturing thin wafer using the same | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-04-10 | — | — | EP | disclosed |
| US-20070166591-A1 | POLYMER ELECTROLYTE COMPOSITION AND APPLICATION THEREOF | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2007-07-19 | — | — | US | disclosed |
| US-6632541-B2 | Weather resistance, and recycling properties | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2003-10-14 | — | — | US | disclosed |
| US-20020072561-A1 | OLEFIN-BASED COPOLYMER COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2002-06-13 | — | — | US | disclosed |