SCHEMBL5598986

SCHEMBL5598986

CCCCCCCCO[Ti](O)(O)O.[Ti]

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.43
MEN1 O00255 1/20 0.43
HTT P42858 1/20 0.43
KMT2A Q03164 1/20 0.43
MAPT P10636 1/20 0.43
LPAR3 Q9UBY5 6/20 0.41
LPAR2 Q9HBW0 5/20 0.41
LPAR1 Q92633 2/20 0.41
NAAA Q02083 1/20 0.41
CA12 O43570 2/20 0.40
CA1 P00915 2/20 0.40
CA2 P00918 2/20 0.40
CA9 Q16790 2/20 0.40
CES2 O00748 1/20 0.40
TSHR P16473 1/20 0.40
GBA1 P04062 1/20 0.40
HCAR2 Q8TDS4 1/20 0.39
EPHX1 P07099 1/20 0.39
LMNA P02545 1/20 0.38
ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7176815 0.97 THRB (0.44) THRBMEN1HTTKMT2AMAPT
Ethylene Glycol SCHEMBL10549545 0.91 MEN1 (0.50) THRBMEN1HTTKMT2AMAPT
SCHEMBL9295821 0.90 TSHR (0.40) THRBMEN1HTTKMT2AMAPT
SCHEMBL1886639 0.87
Ethylene Glycol SCHEMBL11205401 0.83 TSHR (0.46) THRBMEN1HTTKMT2AMAPT
SCHEMBL414710 0.82 THRB (0.44) THRBMEN1HTTKMT2AMAPT
SCHEMBL10477083 0.82 THRB (0.44) THRBMEN1HTTKMT2AMAPT
SCHEMBL6268184 0.76 THRB (0.40) THRBMEN1HTTKMT2AMAPT
SCHEMBL6839828 0.76 THRB (0.47) THRBMEN1HTTKMT2AMAPT
SCHEMBL258179 0.76 THRB (0.47) THRBMEN1HTTKMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5275841-A Method for encapsulating integrated circuit AT&T BELL LABORATORIES (US) 1994-01-04 US claimed
US-5165956-A Method of encapsulating an electronic device with a silicone encapsulant AT&T BELL LABORATORIES (US) 1992-11-24 US claimed
EP-1414903-B1 POLYESTER POLYAMIDE MOLDING COMPOSITION GEN ELECTRIC (US) 2007-12-05 EP disclosed
EP-1165692-B1 POLYESTER MOLDING COMPOSITION GEN ELECTRIC (US) 2006-01-25 EP disclosed
EP-1414903-A1 POLYESTER POLYAMIDE MOLDING COMPOSITION GENERAL ELECTRIC COMPANY (US) 2004-05-06 EP disclosed
US-20020173591-A1 POLYESTER POLYAMIDE MOLDING COMPOSITION SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2002-11-21 US disclosed
WO-2002081564-A1 POLYESTER POLYAMIDE MOLDING COMPOSITION GENERAL ELECTRIC COMPANY (US) 2002-10-17 WO disclosed
US-6437054-B1 MOLDINGS OF REDUCED MOISTURE ABSORPTION GENERAL ELECTRIC COMPANY 2002-08-20 US disclosed
US-20020103294-A1 COMPOSITION OF POLYESTER SULFONATE SALT INOMER,POLYAMIDE AND POLYEPOXIDE SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-08-01 US disclosed
EP-1165692-A1 POLYESTER MOLDING COMPOSITION GENERAL ELECTRIC COMPANY (US) 2002-01-02 EP disclosed
WO-2000049089-A1 POLYESTER MOLDING COMPOSITION GENERAL ELECTRIC COMPANY (US) 2000-08-24 WO disclosed
US-5275841-A Method for encapsulating integrated circuit AT&T BELL LABORATORIES (US) 1994-01-04 US disclosed
US-5165956-A Method of encapsulating an electronic device with a silicone encapsulant AT&T BELL LABORATORIES (US) 1992-11-24 US disclosed