SCHEMBL5599367

SCHEMBL5599367

CCOCC1CCOC1=O

nearest known ligand 0.45

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.35
ALDH1A1 P00352 1/20 0.35
HPGD P15428 1/20 0.35
HSD17B10 Q99714 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14651382 0.85 SMN1; SMN2 (0.35)
SCHEMBL5599002 0.80
SCHEMBL12722834 0.77
SCHEMBL464628 0.77
SCHEMBL2738310 0.77
SCHEMBL22272168 0.76 POLB (0.34)
SCHEMBL12014331 0.75 ALDH1A1 (0.38) KDM4EALDH1A1HPGDHSD17B10
SCHEMBL7657725 0.74 NLRP3 (0.41) KDM4EALDH1A1HPGDHSD17B10
SCHEMBL576482 0.74
SCHEMBL29152239 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8568956-B2 Resist composition and method for producing resist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2013-10-29 US disclosed
EP-1882981-B1 POSITIVE-WORKING RESIST COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION TOKYO OHKA KOGYO CO LTD (JP) 2012-12-19 EP disclosed
US-20120219899-A1 RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2012-08-30 US disclosed
US-7858286-B2 Positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-12-28 US disclosed
US-7858286-B2 Positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-12-28 US disclosed
US-7803512-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-09-28 US disclosed
US-7803512-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-09-28 US disclosed
US-7781144-B2 Positive resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-24 US disclosed
US-7781144-B2 Positive resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-24 US disclosed
US-7645559-B2 Positive resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-01-12 US disclosed
US-20090098483-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHA KOGYO CO., LTD. (JP) 2009-04-16 US disclosed
US-20090068588-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-20090068588-A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-12 US disclosed
US-20090035698-A1 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-05 US disclosed
US-20090035698-A1 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-05 US disclosed
US-20080096126-A1 Polymer Compound, Positive Resist Composition and Process for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-24 US disclosed
US-20080096126-A1 Polymer Compound, Positive Resist Composition and Process for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-04-24 US disclosed
EP-1882981-A1 POSITIVE-WORKING RESIST COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION TOKYO OHKA KOGYO CO., LTD. (JP) 2008-01-30 EP disclosed
EP-1756172-A2 COMPONENTS AND CATALYSTS FOR THE POLYMERIZATION OF OLEFINS Basell Poliolefine Italia S.r.l. (IT) 2007-02-28 EP disclosed
WO-2005123784-A2 COMPONENTS AND CATALYSTS FOR THE POLYMERIZATION OF OLEFINS BASELL POLIOLEFINE ITALIA S.R.L. (IT) 2005-12-29 WO disclosed