Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL343886 | 0.83 | — | — | |
| SCHEMBL7247989 | 0.82 | TSHR (0.31) | TDP1 | |
| SCHEMBL8048839 | 0.82 | TSHR (0.31) | TDP1 | |
| SCHEMBL15044046 | 0.77 | TSHR (0.31) | TDP1 | |
| SCHEMBL8366584 | 0.76 | — | — | |
| SCHEMBL16134341 | 0.75 | TSHR (0.46) | — | |
| SCHEMBL7533268 | 0.75 | — | — | |
| SCHEMBL8516448 | 0.72 | — | — | |
| SCHEMBL27535180 | 0.72 | — | — | |
| SCHEMBL7033929 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1915411-A1 | NEW ORGANIC BOTTOM ANTIREFLECTIVE POLYMER COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2008-04-30 | — | — | EP | claimed |
| US-20070020557-A1 | New organic bottom antireflective polymer compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2007-01-25 | — | — | US | claimed |
| WO-2007010385-A1 | NEW ORGANIC BOTTOM ANTIREFLECTIVE POLYMER COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2007-01-25 | — | — | WO | claimed |
| US-20250231492-A1 | MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE | SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) | 2025-07-17 | — | — | US | disclosed |
| US-20250231491-A1 | PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST | SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) | 2025-07-17 | — | — | US | disclosed |
| CN-119816784-A | Fabrication of integrated circuits using positive photo-patternable dielectrics comprising high silicon content polysilsesquioxanes | 潍坊星泰克微电子材料有限公司 | 2025-04-11 | — | — | CN | disclosed |
| CN-119631021-A | Photolithography method using silicon photoresist | 潍坊星泰克微电子材料有限公司 | 2025-03-14 | — | — | CN | disclosed |
| EP-4508495-A1 | MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE | Suntific Materials (Weifang), Ltd. (CN) | 2025-02-19 | — | — | EP | disclosed |
| EP-4508493-A1 | PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST | Suntific Materials (Weifang), Ltd. (CN) | 2025-02-19 | — | — | EP | disclosed |
| WO-2025000537-A1 | PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST | SUNTIFIC MATERIALS (WEIFANG), LTD. (CN) | 2025-01-02 | — | — | WO | disclosed |
| WO-2025000535-A1 | MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE | SUNTIFIC MATERIALS (WEIFANG), LTD. (CN) | 2025-01-02 | — | — | WO | disclosed |
| US-7163751-B2 | spin-on antireflective coating compositions that contain an aromatic polyester resin and a solvent comprising an oxyisobutyric acid ester, especially methyl-2-hydroxyisobutyrate; | SHIPLEY COMPANY, L.L.C. (US) | 2007-01-16 | — | — | US | disclosed |
| US-20060057491-A1 | Coating compositions for use with an overcoated photoresist | ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. (US) | 2006-03-16 | — | — | US | disclosed |
| EP-1598702-A1 | Coating compositions for use with an overcoated photoresist | Rohm and Haas Electronic Materials, L.L.C. (US) | 2005-11-23 | — | — | EP | disclosed |
| WO-2005097883-A2 | METHOD OF PRODUCING A CROSSLINKED COATING IN THE MANUFACTURE OF INTEGRATED CIRCUITS | KING INDUSTRIES, INC. (US) | 2005-10-20 | — | — | WO | disclosed |
| US-20050215713-A1 | Method of producing a crosslinked coating in the manufacture of integrated circuits | KING INDUSTRIES, INC. | 2005-09-29 | — | — | US | disclosed |
| US-6852421-B2 | Microelectronic wafers having photosensitive antireflective polyester and photoresist multilayers used to form integrated circuits; relief images | SHIPLEY COMPANY, L.L.C. (US) | 2005-02-08 | — | — | US | disclosed |
| US-20040209200-A1 | spin-on antireflective coating compositions that contain an aromatic polyester resin and a solvent comprising an oxyisobutyric acid ester, especially methyl-2-hydroxyisobutyrate; | SHIPLEY COMPANY, L.L.C. | 2004-10-21 | — | — | US | disclosed |
| US-20030180559-A1 | Microelectronic wafers having photosensitive antireflective polyester and photoresist multilayers used to form integrated circuits; relief images | SHIPLEY COMPANY, L.L.C. | 2003-09-25 | — | — | US | disclosed |
| EP-1298492-A2 | Coating compositions for use with an overcoated photoresist | Shipley Co. L.L.C. (US) | 2003-04-02 | — | — | EP | disclosed |