SCHEMBL560955

SCHEMBL560955

CCCC(CO)(CO)CCO

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.33
TSHR P16473 3/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
LMNA P02545 2/20 0.30
HSD17B10 Q99714 1/20 0.30
MEN1 O00255 1/20 0.30
KMT2A Q03164 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29316638 0.94 ALDH1A1 (0.33) ALDH1A1TSHRSMN1; SMN2LMNAHSD17B10
SCHEMBL11805474 0.94 ALDH1A1 (0.33) ALDH1A1TSHRSMN1; SMN2LMNAHSD17B10
SCHEMBL1053504 0.91 TSHR (0.37) ALDH1A1TSHRSMN1; SMN2
SCHEMBL1101582 0.88 ALDH1A1 (0.37) ALDH1A1TSHRSMN1; SMN2LMNAHSD17B10
SCHEMBL14678840 0.88 ALDH1A1 (0.37) ALDH1A1TSHRSMN1; SMN2LMNAHSD17B10
SCHEMBL5665833 0.87
SCHEMBL39090 0.84 TSHR (0.37) ALDH1A1TSHRSMN1; SMN2
SCHEMBL4530110 0.84 TSHR (0.37) ALDH1A1TSHRSMN1; SMN2
SCHEMBL409753 0.84 TSHR (0.41) ALDH1A1TSHR
SCHEMBL1100793 0.82 ALDH1A1 (0.33) ALDH1A1TSHRSMN1; SMN2LMNAHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1915411-A1 NEW ORGANIC BOTTOM ANTIREFLECTIVE POLYMER COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2008-04-30 EP claimed
US-20070020557-A1 New organic bottom antireflective polymer compositions AZ ELECTRONIC MATERIALS USA CORP. 2007-01-25 US claimed
WO-2007010385-A1 NEW ORGANIC BOTTOM ANTIREFLECTIVE POLYMER COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2007-01-25 WO claimed
US-20250231491-A1 PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) 2025-07-17 US disclosed
US-20250231492-A1 MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE SUNTIFIC MATERIALS (WEIFANG)., LTD. (CN) 2025-07-17 US disclosed
CN-119816784-A Fabrication of integrated circuits using positive photo-patternable dielectrics comprising high silicon content polysilsesquioxanes 潍坊星泰克微电子材料有限公司 2025-04-11 CN disclosed
CN-119631021-A Photolithography method using silicon photoresist 潍坊星泰克微电子材料有限公司 2025-03-14 CN disclosed
EP-4508495-A1 MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE Suntific Materials (Weifang), Ltd. (CN) 2025-02-19 EP disclosed
EP-4508493-A1 PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST Suntific Materials (Weifang), Ltd. (CN) 2025-02-19 EP disclosed
WO-2025000537-A1 PHOTOLITHOGRAPHIC METHOD USING SILICON PHOTORESIST SUNTIFIC MATERIALS (WEIFANG), LTD. (CN) 2025-01-02 WO disclosed
WO-2025000535-A1 MANUFACTURE OF INTEGRATED CIRUIT USING POSITIVE TONE PHOTOPATTERNABLE DIELECTRIC INCLUDING HIGH SILICON CONTENT POLYSILSESQUIOXANE SUNTIFIC MATERIALS (WEIFANG), LTD. (CN) 2025-01-02 WO disclosed
US-20020198297-A1 Polyester and polyamide compositions of low residual aldehyde content ODORISIO PAUL A (US) 2002-12-26 US disclosed
CN-1375522-A Polyester and polyamide composition with low residual aldehyde content CIBA SC HOLDING AG (CH) 2002-10-23 CN disclosed
US-20020137856-A1 Polyester compositions of low residual aldehyde content CIBA SPECIALTY CHEMICALS CORP. 2002-09-26 US disclosed
EP-1239006-A1 Polyester and polyamide compositions of low residual aldehyde content Ciba SC Holding AG (CH) 2002-09-11 EP disclosed
US-5681879-A BLEND OF POLYESTER, POLYHYDRIC ALCOHOL, SYNERGISTIC MIXTURE OF INORGANIC AND HALOGEN FLAME RETARDERS MITSUBISHI CHEMICAL CORPORATION (JP) 1997-10-28 US disclosed
EP-0691370-A2 Flame-retardant polyester resin composition Mitsubishi Chemical Corporation (JP) 1996-01-10 EP disclosed
US-4985582-A CHEMICAL INTERMEDIATES FOR BICYCLIC RING COMPOUNDS HAVING MULTIPLE SULFUR ATOMS IN THE RING SYSTEM THE WELLCOME FOUNDATION LTD. (GB) 1991-01-15 US disclosed
EP-0216625-A2 Pesticidal compounds THE WELLCOME FOUNDATION LIMITED (GB) 1987-04-01 EP disclosed
EP-0208856-A2 Contact adhesive with radiation-hardenable polyesters containing (meth-)acryl groups HÜLS AKTIENGESELLSCHAFT (DE) 1987-01-21 EP disclosed