SCHEMBL5611784

SCHEMBL5611784

C=CCOCCCOC=C

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.40
POLB P06746 1/20 0.40
KMT2A Q03164 1/20 0.40
CA1 P00915 2/20 0.32
CA2 P00918 2/20 0.32
CA9 Q16790 1/20 0.32
ALDH1A1 P00352 1/20 0.32
CA7 P43166 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17229561 0.95 MEN1 (0.40) MEN1POLBKMT2ACA1CA2
SCHEMBL826294 0.87 POLB (0.48) MEN1POLBKMT2ACA1CA2
SCHEMBL501087 0.84
SCHEMBL12441311 0.84 POLB (0.46) MEN1POLBKMT2ACA1CA2
SCHEMBL20565098 0.84 POLB (0.46) MEN1POLBKMT2ACA1CA2
SCHEMBL12748104 0.84
SCHEMBL17082940 0.82 MEN1 (0.41) MEN1POLBKMT2ACA1CA2
SCHEMBL31755644 0.82 MEN1 (0.41) MEN1POLBKMT2ACA1CA2
SCHEMBL31755962 0.82 MEN1 (0.41) MEN1POLBKMT2ACA1CA2
SCHEMBL28201514 0.82 MEN1 (0.41) MEN1POLBKMT2ACA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11859050-B2 Silanol-group-terminated polyoxyalkylene compound and production process therefor, room-temperature-curable composition, sealing material, and article SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-02 US disclosed
CN-106104816-B Solar cell backboard and solar module 东丽株式会社 2018-05-11 CN disclosed
US-7271219-B2 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-09-18 US disclosed
US-20040102601-A1 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-05-27 US disclosed
EP-1375553-A1 CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-02 EP disclosed