Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | ELANE | P08246 | 1/20 | 0.33 |
| ▸ | PRKCA | P17252 | 6/20 | 0.33 |
| ▸ | DAGLA | Q9Y4D2 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 3/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | PRKD3 | O94806 | 1/20 | 0.31 |
| ▸ | PRKCG | P05129 | 1/20 | 0.31 |
| ▸ | PRKCB | P05771 | 1/20 | 0.31 |
| ▸ | PRKCH | P24723 | 1/20 | 0.31 |
| ▸ | PRKCE | Q02156 | 1/20 | 0.31 |
| ▸ | PRKCQ | Q04759 | 1/20 | 0.31 |
| ▸ | PRKCD | Q05655 | 1/20 | 0.31 |
| ▸ | PRKD1 | Q15139 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16454863 | 0.94 | TP53 (0.39) | TP53ELANEPRKCADAGLAMEN1 | |
| SCHEMBL572867 | 0.94 | TP53 (0.39) | TP53ELANEPRKCADAGLAMEN1 | |
| SCHEMBL16454911 | 0.94 | TP53 (0.39) | TP53ELANEPRKCADAGLAMEN1 | |
| SCHEMBL15095429 | 0.89 | PRKCA (0.41) | TP53PRKCADAGLAALDH1A1PRKD3 | |
| SCHEMBL17874465 | 0.89 | PRKCA (0.41) | TP53PRKCADAGLAALDH1A1PRKD3 | |
| SCHEMBL28067535 | 0.87 | PRKCA (0.43) | PRKCADAGLAALDH1A1PRKD3PRKCG | |
| SCHEMBL28067533 | 0.87 | PRKCA (0.43) | PRKCADAGLAALDH1A1PRKD3PRKCG | |
| SCHEMBL27592769 | 0.87 | PRKCA (0.43) | PRKCADAGLAALDH1A1PRKD3PRKCG | |
| SCHEMBL13449685 | 0.82 | KAT2A (0.34) | TP53 | |
| SCHEMBL127823 | 0.82 | KAT2A (0.34) | TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103724984-B | Method and the flexible wiring sheet of the diaphragm of compositions of thermosetting resin, formation flexible wiring sheet | HITACHI CHEMICAL CO., LTD. (JP) | 2016-05-25 | — | — | CN | disclosed |
| CN-102549074-B | Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board | HITACHI CHEMICAL CO.,LTD. (JP) | 2015-11-25 | — | — | CN | disclosed |
| CN-103443158-B | Carboxyl group-containing polyimide, heat-curable resin composition, and flexible metal-clad laminate | TOYO BOSEKI | 2015-03-25 | — | — | CN | disclosed |
| CN-103724984-A | Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board | HITACHI CHEMICAL CO LTD | 2014-04-16 | — | — | CN | disclosed |
| CN-101784928-B | Polymeric optical waveguide film | MITSU CHEMICALS INC | 2014-03-05 | — | — | CN | disclosed |
| CN-103443158-A | Carboxyl group-ontaining polyimide, heat-curable resin composition, and flexible metal-clad laminate | TOYO BOSEKI | 2013-12-11 | — | — | CN | disclosed |
| CN-101535895-B | Photosensitive resin composition and flexible printed wiring board using the same | ASAHI CHEMICAL IND | 2013-01-16 | — | — | CN | disclosed |
| CN-102709201-A | Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them | HITACHI CHEMICAL CO LTD JP | 2012-10-03 | — | — | CN | disclosed |
| CN-101501153-B | Film adhesive, adhesive sheet, and semiconductor device using the same | HITACHI CHEMICAL CO LTD | 2012-08-29 | — | — | CN | disclosed |
| CN-101657507-B | Resin composition, and film-forming material comprising the same | HITACHI CHEMICAL CO LTD | 2012-07-04 | — | — | CN | disclosed |
| CN-102134451-A | Adhesive film for semiconductor, composite sheet, and method for producing semiconductor using the same | HITACHI CHEMICAL CO LTD | 2011-07-27 | — | — | CN | disclosed |
| CN-101657507-A | Resin composition, and film-forming material comprising the same | HITACHI CHEMICAL CO LTD JP | 2010-02-24 | — | — | CN | disclosed |
| CN-101641766-A | Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using same | HITACHI CHEMICAL CO LTD JP | 2010-02-03 | — | — | CN | disclosed |
| CN-101535895-A | Photosensitive resin composition and flexible printed wiring board using the same | ASAHI CHEMICAL IND PI R & D CO (JP) | 2009-09-16 | — | — | CN | disclosed |
| WO-2007116986-A1 | THERMOSET RESIN COMPOSITION | SHOWA DENKO K. K. (JP) | 2007-10-18 | — | — | WO | disclosed |