SCHEMBL572867

SCHEMBL572867

CCCCC1C(=O)OC(=O)C1C

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.39
ELANE P08246 1/20 0.36
PRKCA P17252 6/20 0.35
DAGLA Q9Y4D2 1/20 0.35
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
KDM4E B2RXH2 1/20 0.33
ALDH1A1 P00352 1/20 0.33
MAPT P10636 1/20 0.33
PKM P14618 1/20 0.33
HPGD P15428 1/20 0.33
HTT P42858 1/20 0.33
PRKD3 O94806 1/20 0.33
PRKCG P05129 1/20 0.33
PRKCB P05771 1/20 0.33
PRKCH P24723 1/20 0.33
PRKCE Q02156 1/20 0.33
PRKCQ Q04759 1/20 0.33
PRKCD Q05655 1/20 0.33
PRKD1 Q15139 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16454911 1.00 TP53 (0.39) TP53ELANEPRKCADAGLAMEN1
SCHEMBL16454863 1.00 TP53 (0.39) TP53ELANEPRKCADAGLAMEN1
Sulfur Dioxide SCHEMBL5612945 0.94 TP53 (0.36) TP53ELANEPRKCADAGLAMEN1
SCHEMBL15095429 0.94 PRKCA (0.41) TP53PRKCADAGLAALDH1A1PRKD3
SCHEMBL17874465 0.94 PRKCA (0.41) TP53PRKCADAGLAALDH1A1PRKD3
SCHEMBL28067535 0.92 PRKCA (0.43) PRKCADAGLAALDH1A1PRKD3PRKCG
SCHEMBL28067533 0.92 PRKCA (0.43) PRKCADAGLAALDH1A1PRKD3PRKCG
SCHEMBL27592769 0.92 PRKCA (0.43) PRKCADAGLAALDH1A1PRKD3PRKCG
SCHEMBL12731699 0.87 PRKCA (0.33) PRKCADAGLAPRKD3PRKCGPRKCB
SCHEMBL127823 0.87 KAT2A (0.34) TP53PLA2G6PLA2G4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 376 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109563062-B Production of sulfonyl azide 陶氏环球技术有限责任公司 2024-06-18 CN claimed
US-20230114308-A1 Flux-Compatible Epoxy-Anhydride Adhesives Compositions for Low-Gap Underfill Applications HENKEL AG & CO KGAA (DE) 2023-04-13 US claimed
CN-111601833-B Block copolymer, polymer composition, adhesive composition, and coupling agent 旭化成株式会社 2023-04-11 CN claimed
CN-115715313-A Flux compatible epoxy-anhydride adhesive compositions for low gap underfill applications 汉高股份有限及两合公司 2023-02-24 CN claimed
CN-109312022-B Aliphatic sulfonyl azide anhydrides for tie layers 陶氏环球技术有限责任公司 2021-12-31 CN claimed
CN-111420068-B Polyethylene glycol-dendritic polylysine/anhydride-cisplatin compound and preparation method and application thereof 浙江大学 2021-11-09 CN claimed
CN-110396182-B Polyester resin prepared from bio-based raw materials and preparation method and application thereof 苏州瀚海新材料有限公司 2021-03-09 CN claimed
CN-111420068-A Polyethylene glycol-dendritic polylysine/anhydride-cisplatin compound and preparation method and application thereof 浙江大学 2020-07-17 CN claimed
CN-110755639-A Polyethylene glycol-dendritic polylysine/anhydride-cisplatin compound and preparation method and application thereof 浙江大学 2020-02-07 CN claimed
CN-110396182-A One kind polyester resin and the preparation method and application thereof as made from organism-based raw material SUZHOU MACROOCEAN NEW MAT CO LTD 2019-11-01 CN claimed
CN-109563062-A The manufacture of sulfonyl azide acid anhydrides 陶氏环球技术有限责任公司 2019-04-02 CN claimed
CN-109312022-A Aliphatic sulfonyl azide acid anhydrides for articulamentum 陶氏环球技术有限责任公司 2019-02-05 CN claimed
CN-102971355-B Polyvalent carboxylic acid composition, curing agent composition, and curable resin composition containing polyvalent carboxylic acid composition or curing agent composition as curing agent for epoxy resin NIPPON KAYAKU KK 2015-07-08 CN claimed
CN-102952064-A Preparation method of medicine intermediate cis-ex-bicyclo[2.2.1]heptane-2.3-dicarboximide TIANJIN INST PHARM RESEARCH 2013-03-06 CN claimed
CN-100448909-C Photosensitive element packaging material composition and use method thereof ETERNAL CHEMICAL INDUSTRY CO LTD (CN) 2009-01-07 CN claimed
WO-2008019149-A1 COMPOSITION AND ASSOCIATED METHOD MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-02-14 WO claimed
CN-1525557-A Photosensitive element packaging material composition and use method thereof 长兴化学工业股份有限公司 2004-09-01 CN claimed
US-4842667-A IMPREGNATING FABRIC BANDS WITH TRIS/HYDROXYPHENYL/METHANE BASED RESIN WITH MIXTURE OF ANHYDRIDE CURING AGENTS LOCKHEED CORPORATION (US) 1989-06-27 US claimed
US-4085260-A Powder coating compositions with hydroxy containing acrylic copolymers-I and carboxylic acid or anhydride crosslinking agent FORD MOTOR COMPANY (US) 1978-04-18 US claimed
CN-116490533-B Pigment dispersion composition and photosensitive coloring composition 株式会社力森诺科 2025-06-13 CN disclosed
WO-2024150597-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE, AND ELECTRONIC COMPONENT JNC株式会社 2024-07-18 WO disclosed
WO-2024147356-A1 SOLVENT-FREE ORGANIC-INORGANIC HYBRID RESIN COMPOSITION AND CURED FILM 日産化学株式会社 2024-07-11 WO disclosed
CN-118265757-A Pigment dispersion composition, photosensitive coloring composition, and color filter 株式会社力森诺科 2024-06-28 CN disclosed
CN-114213333-B Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2024-06-25 CN disclosed
CN-109563062-B Production of sulfonyl azide 陶氏环球技术有限责任公司 2024-06-18 CN disclosed
CN-113620969-B Cyclohexane dicarboxylic acid derivative with bridged ring, and pharmaceutical composition and application thereof 贵州医科大学 2024-05-14 CN disclosed
CN-118020023-A Pellicle, exposure original plate, exposure apparatus, and method for manufacturing pellicle 三井化学株式会社 2024-05-10 CN disclosed
CN-117916663-A Pellicle frame, pellicle, method for manufacturing pellicle, and method for evaluating pellicle frame 三井化学株式会社 2024-04-19 CN disclosed
CN-117916661-A Protective film assembly 三井化学株式会社 2024-04-19 CN disclosed
CN-117916662-A Pellicle, exposure original plate, exposure apparatus, and method for manufacturing pellicle 三井化学株式会社 2024-04-19 CN disclosed
CN-117777682-A Weather-resistant high-strength degradable resin and preparation method thereof 厦门进尚树脂有限公司 2024-03-29 CN disclosed
CN-113631619-B Curable resin composition 味之素株式会社 2024-02-27 CN disclosed
CN-110647010-B Resin composition, dry film, method for producing dry film, resist film, substrate, and method for producing plating molded article 东京应化工业株式会社 2024-02-09 CN disclosed
CN-113474393-B Adhesive for endoscope, cured product thereof, endoscope, and method for producing same 富士胶片株式会社 2024-01-16 CN disclosed
CN-113474394-B Adhesive for endoscope, cured product thereof, endoscope, and method for producing same 富士胶片株式会社 2024-01-16 CN disclosed
CN-117203285-A Insulating varnish composition, insulating varnish cured product, coil, and method for producing coil 三菱电机株式会社 2023-12-08 CN disclosed
CN-109709770-B Resin composition, dry film and method for producing same, method for producing resist film and substrate, method for producing plated molded article, and mercapto compound 东京应化工业株式会社 2023-11-24 CN disclosed
CN-117120493-A Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board 松下知识产权经营株式会社 2023-11-24 CN disclosed
CN-117098788-A Resin composition, film and copolymer 住友化学株式会社 2023-11-21 CN disclosed
CN-117062890-A Flux compatible epoxy-phenolic adhesive compositions for low gap underfill applications 汉高股份有限及两合公司 2023-11-14 CN disclosed
CN-117043219-A Phenol resin mixture, curable resin composition, and cured product thereof 日本化药株式会社 2023-11-10 CN disclosed
CN-117043220-A Phenol resin mixture, curable resin composition, and cured product thereof 日本化药株式会社 2023-11-10 CN disclosed
EP-3575281-B1 DIAMINE COMPOUND, AND POLYIMIDE COMPOUND AND MOLDED ARTICLE IN WHICH SAID DIAMINE COMPOUND IS USED WINGO TECH CO LTD (JP) 2023-08-23 EP disclosed
CN-113039216-B Copolymer and resin composition containing the same 株式会社力森诺科 2023-08-22 CN disclosed
CN-111868137-B Epoxy resin composition 积水化学工业株式会社 2023-08-15 CN disclosed
CN-116507494-A Polyhydroxy resin, epoxy resin, method for producing the same, epoxy resin composition, and cured product of epoxy resin composition 日铁化学材料株式会社 2023-07-28 CN disclosed
CN-108459468-B Resin composition and cured film 住友化学株式会社 2023-07-28 CN disclosed
CN-115974891-B Preparation method of norcantharidin 仁和堂药业有限公司 2023-07-25 CN disclosed
CN-116490533-A Pigment dispersion composition and photosensitive coloring composition 株式会社力森诺科 2023-07-25 CN disclosed
CN-111788247-B Coated particles 味之素株式会社 2023-07-18 CN disclosed
CN-116323726-A Active energy ray-curable composition, cured product, lens, and camera module DIC株式会社 2023-06-23 CN disclosed
CN-116171286-A Conductive paste and conductive film 互应化学工业株式会社 2023-05-26 CN disclosed
CN-115974891-A Preparation method of norcantharidin 仁和堂药业有限公司 2023-04-18 CN disclosed
US-20230114308-A1 Flux-Compatible Epoxy-Anhydride Adhesives Compositions for Low-Gap Underfill Applications HENKEL AG & CO KGAA (DE) 2023-04-13 US disclosed
CN-111601833-B Block copolymer, polymer composition, adhesive composition, and coupling agent 旭化成株式会社 2023-04-11 CN disclosed
CN-115956108-A Adhesive for endoscope, cured product thereof, endoscope, and method for producing endoscope 富士胶片株式会社 2023-04-11 CN disclosed
CN-115916863-A Phenol resin, epoxy resin, processes for producing these, epoxy resin composition, and cured product thereof 日铁化学材料株式会社 2023-04-04 CN disclosed
CN-115715313-A Flux compatible epoxy-anhydride adhesive compositions for low gap underfill applications 汉高股份有限及两合公司 2023-02-24 CN disclosed
CN-115703920-A Resin composition for optical semiconductor encapsulation, resin molded article, optical semiconductor encapsulating material, and optical semiconductor device 日东电工株式会社 2023-02-17 CN disclosed
CN-115698121-A Epoxy resin composition and cured product thereof 日铁化学材料株式会社 2023-02-03 CN disclosed
CN-115667352-A Epoxy resin composition and cured product thereof 日铁化学材料株式会社 2023-01-31 CN disclosed
CN-111315719-B Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2022-12-27 CN disclosed
US-11512200-B2 Resin composition, resin sheet, laminate, and semiconductor element LINTEC CORPORATION (JP) 2022-11-29 US disclosed
WO-2022239203-A1 INSULATING VARNISH COMPOSITION, CURED INSULATING VARNISH, COIL AND METHOD FOR PRODUCING COIL 三菱電機株式会社 2022-11-17 WO disclosed
CN-108241258-B Resin composition for liquid crystal display device, film for liquid crystal display device, and copolymer 住友化学株式会社 2022-10-18 CN disclosed
CN-115141464-A Resin composition for optical semiconductor sealing, resin molded article, optical semiconductor sealing material, and optical semiconductor device 日东电工株式会社 2022-10-04 CN disclosed
WO-2022202335-A1 PHENOLIC RESIN MIXTURE, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 日本化薬株式会社 2022-09-29 WO disclosed
WO-2022202333-A1 PHENOLIC RESIN MIXTURE, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2022-09-29 WO disclosed
CN-112955323-B Resin composition, resin film using same, resin-coated metal foil, metal-foil-clad laminate, wiring board, and circuit mounting member 松下知识产权经营株式会社 2022-09-09 CN disclosed
CN-114902134-A Chemically amplified photosensitive composition, photosensitive dry film and method for producing same, method for producing resist film, and acid diffusion inhibitor 东京应化工业株式会社 2022-08-12 CN disclosed
CN-114868081-A Photosensitive resin composition, dry film and method for producing same, resist film, substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2022-08-05 CN disclosed
EP-3196254-B1 CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORP (JP) 2022-07-13 EP disclosed
CN-110643145-B Resin composition and article made therefrom 中山台光电子材料有限公司 2022-05-31 CN disclosed
CN-110651336-B Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition 株式会社钟化 2022-05-17 CN disclosed
WO-2022075162-A1 ACTIVE ENERGY RAY CURABLE COMPOSITION, CURED PRODUCT, LENS, AND CAMERA MODULE DIC株式会社 2022-04-14 WO disclosed
CN-111433874-B Arc-extinguishing insulating material molded body and circuit breaker 三菱电机株式会社 2022-04-12 CN disclosed
CN-109153635-B Neuropeptide S receptor (NPSR) agonists 研究三角协会 2022-04-08 CN disclosed
CN-114276298-A Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2022-04-05 CN disclosed
CN-114213333-A Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2022-03-22 CN disclosed
WO-2022054775-A1 CONDUCTIVE PASTE AND CONDUCTIVE FILM 互応化学工業株式会社 2022-03-17 WO disclosed
CN-108485448-B Resin composition, film and copolymer 住友化学株式会社 2022-02-22 CN disclosed
WO-2022003769-A1 INSULATING MATERIAL MOLDED BODY FOR ARC SUPPRESSION, CIRCUIT BREAKER, METHOD FOR PRODUCING MIXED FILLER, AND METHOD FOR PRODUCING INSULATING MATERIAL MOLDED BODY FOR ARC SUPPRESSION 三菱電機株式会社 2022-01-06 WO disclosed
CN-109312022-B Aliphatic sulfonyl azide anhydrides for tie layers 陶氏环球技术有限责任公司 2021-12-31 CN disclosed
CN-113754863-A Resin molded article for sealing optical semiconductor 日东电工株式会社 2021-12-07 CN disclosed
CN-113631619-A Curable resin composition 味之素株式会社 2021-11-09 CN disclosed
CN-113631634-A Polyamic acid composition, polyimide composition, and polyimide molded article 株式会社大阪曹达 2021-11-09 CN disclosed
CN-113620969-A Cyclohexane dicarboxylic acid derivative with bridged ring, and pharmaceutical composition and application thereof 贵州医科大学 2021-11-09 CN disclosed
CN-111420068-B Polyethylene glycol-dendritic polylysine/anhydride-cisplatin compound and preparation method and application thereof 浙江大学 2021-11-09 CN disclosed
CN-113597652-A Method for manufacturing circuit board 味之素株式会社 2021-11-02 CN disclosed
CN-113474394-A Adhesive for endoscope, cured product thereof, endoscope, and method for producing endoscope 富士胶片株式会社 2021-10-01 CN disclosed
CN-113474393-A Adhesive for endoscope, cured product thereof, endoscope, and method for producing endoscope 富士胶片株式会社 2021-10-01 CN disclosed
CN-107272331-B Curable resin composition and cured film 住友化学株式会社 2021-09-24 CN disclosed
CN-112430242-B High-nuclear zinc cluster compound with demethyl cantharidic acid as ligand, preparation method and application thereof 上海交通大学 2021-09-21 CN disclosed
CN-106967208-B Coated particles 味之素株式会社 2021-09-10 CN disclosed
CN-110325594-B Polymerizable composition and molded article 三井化学株式会社 2021-08-24 CN disclosed
CN-113286866-A Inkjet ink for color filter, light conversion layer, and color filter DIC株式会社 2021-08-20 CN disclosed
CN-113272274-A Thiol compound, synthesis method thereof and application of thiol compound 四国化成工业株式会社 2021-08-17 CN disclosed
CN-113260921-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2021-08-13 CN disclosed
CN-113227234-A Resin composition for forming resist pattern and method for manufacturing semiconductor article 株式会社钟化 2021-08-06 CN disclosed
CN-113150030-A Oxabicycloheptane prodrugs 莱克斯特生物技术公司 2021-07-23 CN disclosed
CN-113166342-A Ethylenically unsaturated resin composition and photosensitive resin composition 昭和电工株式会社 2021-07-23 CN disclosed
CN-113166288-A Composition containing carbon cluster and method for producing same 昭和电工株式会社 2021-07-23 CN disclosed
CN-113039216-A Copolymer and resin composition comprising the same 昭和电工株式会社 2021-06-25 CN disclosed
CN-112955323-A Resin composition, resin film using same, resin-coated metal foil, metal-foil-clad laminate, wiring board, and circuit mounting member 松下知识产权经营株式会社 2021-06-11 CN disclosed
CN-109843534-B Method for manufacturing optical film 柯尼卡美能达株式会社 2021-05-18 CN disclosed
CN-109843533-B Method for manufacturing optical film 柯尼卡美能达株式会社 2021-05-04 CN disclosed
WO-2021079973-A1 ONIUM SALT, CURING AGENT, CURING ACCELERATOR, CURABLE COMPOSITION, AND DEVICE MANUFACTURING METHOD 東洋合成工業株式会社 2021-04-29 WO disclosed
CN-108350146-B Epoxy resin composition containing long-chain alkylene group 日产化学工业株式会社 2021-03-16 CN disclosed
CN-110396182-B Polyester resin prepared from bio-based raw materials and preparation method and application thereof 苏州瀚海新材料有限公司 2021-03-09 CN disclosed
CN-110396182-B Polyester resin prepared from bio-based raw materials and preparation method and application thereof 苏州瀚海新材料有限公司 2021-03-09 CN disclosed
CN-109517010-B Flame-retardant compound, preparation method and application thereof 中山台光电子材料有限公司 2021-03-05 CN disclosed
CN-112430242-A High-nuclear zinc cluster compound with demethyl cantharidic acid as ligand, preparation method and application thereof 上海交通大学 2021-03-02 CN disclosed
CN-107708686-B Oxabicycloheptane prodrugs 莱克斯特生物技术公司 2021-02-19 CN disclosed
CN-108276412-B Glycolurils having glycidyl group and use thereof 四国化成工业株式会社 2021-02-02 CN disclosed
CN-109111739-B Resin composition and article made therefrom 中山台光电子材料有限公司 2020-12-01 CN disclosed
CN-111868137-A Epoxy resin composition 积水化学工业株式会社 2020-10-30 CN disclosed
CN-107434941-B Resin composition and cured film 住友化学株式会社 2020-10-30 CN disclosed
CN-111788247-A Coated particles 味之素株式会社 2020-10-16 CN disclosed
WO-2020203924-A1 RESIN COMPOSITION INCLUDING MAGNETIC POWDER 味の素株式会社 2020-10-08 WO disclosed
WO-2020203750-A1 CURABLE RESIN COMPOSITION 味の素株式会社 2020-10-08 WO disclosed
WO-2020196721-A1 POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION AND POLYIMIDE MOLDED BODY 株式会社大阪ソーダ 2020-10-01 WO disclosed
CN-111665996-A Method for manufacturing contact sensor member and contact sensor member 东丽株式会社 2020-09-15 CN disclosed
CN-111601833-A Block copolymer, polymer composition, adhesive composition, and coupling agent 旭化成株式会社 2020-08-28 CN disclosed
CN-111560094-A Near-infrared absorbing pigment polymer, composition, film, optical filter, pattern forming method and device 富士胶片株式会社 2020-08-21 CN disclosed
CN-111433874-A Arc-extinguishing insulating material molded body and circuit breaker 三菱电机株式会社 2020-07-17 CN disclosed
CN-111420068-A Polyethylene glycol-dendritic polylysine/anhydride-cisplatin compound and preparation method and application thereof 浙江大学 2020-07-17 CN disclosed
CN-111381444-A Photosensitive resin composition, photosensitive dry film, patterned resist film, substrate with mold, and method for producing plated article 东京应化工业株式会社 2020-07-07 CN disclosed
CN-108026228-B Substituted allyl ether resin, methallyl ether resin, epoxy resin composition and cured product thereof 日本化药株式会社 2020-07-07 CN disclosed
CN-111315719-A Thiol compound, method for synthesizing same, and use of thiol compound 四国化成工业株式会社 2020-06-19 CN disclosed
CN-107922751-B Near-infrared absorbing pigment polymer, composition, film, optical filter, pattern forming method and device 富士胶片株式会社 2020-05-19 CN disclosed
WO-2020066871-A1 CURABLE COMPOSITION, CURED FILM, METHOD FOR FORMING PATTERN, OPTICAL FILTER AND PHOTOSENSOR 富士フイルム株式会社 2020-04-02 WO disclosed
CN-102850893-B Curable resin composition 住友化学株式会社 2020-02-18 CN disclosed
CN-110755639-A Polyethylene glycol-dendritic polylysine/anhydride-cisplatin compound and preparation method and application thereof 浙江大学 2020-02-07 CN disclosed
CN-105531626-B Photosensitive light-shielding paste and method for producing laminated pattern for contact sensor 东丽株式会社 2020-01-14 CN disclosed
CN-110651336-A Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition 株式会社钟化 2020-01-03 CN disclosed
CN-110643145-A Resin composition and article made therefrom 中山台光电子材料有限公司 2020-01-03 CN disclosed
CN-110647010-A Resin composition, dry film and dry film, resist film, substrate, method for producing plated article, and nitrogen-containing aromatic heterocyclic compound 东京应化工业株式会社 2020-01-03 CN disclosed
EP-3575281-A1 DIAMINE COMPOUND, AND POLYIMIDE COMPOUND AND MOLDED ARTICLE IN WHICH SAID DIAMINE COMPOUND IS USED Wingo Technology Co., Ltd. (JP) 2019-12-04 EP disclosed
CN-106967213-B Eight-arm polyethylene glycol, preparation method, functionalized derivative and modified biologically-relevant substance 厦门赛诺邦格生物科技股份有限公司 2019-11-05 CN disclosed
CN-110418822-A Resin composition, resin sheet, laminate, and semiconductor element LINTEC CORP 2019-11-05 CN disclosed
CN-110396182-A One kind polyester resin and the preparation method and application thereof as made from organism-based raw material SUZHOU MACROOCEAN NEW MAT CO LTD 2019-11-01 CN disclosed
CN-110396182-A One kind polyester resin and the preparation method and application thereof as made from organism-based raw material SUZHOU MACROOCEAN NEW MAT CO LTD 2019-11-01 CN disclosed
CN-110325594-A Polymerizable composition and molded article 三井化学株式会社 2019-10-11 CN disclosed
WO-2019189226-A1 EPOXY RESIN COMPOSITION 積水化学工業株式会社 2019-10-03 WO disclosed
WO-2019155926-A1 BLOCK COPOLYMER, POLYMER COMPOSITION, COMPOSITION FOR ADHESIVES, ADHESIVE COMPOSITION AND COUPLING AGENT 旭化成株式会社 2019-08-15 WO disclosed
CN-108025405-B soldering flux 千住金属工业株式会社 2019-08-06 CN disclosed
CN-106661198-B Resin combination, prepreg, the metal foil of resin, metal-clad, printed wiring board 松下知识产权经营株式会社 2019-08-06 CN disclosed
CN-105408393-B The manufacturing method of clear polyimides copolymer, polyimide resin composition and formed body and the copolymer 索马龙株式会社 2019-08-06 CN disclosed
CN-109843534-A The manufacturing method of optical film 柯尼卡美能达株式会社 2019-06-04 CN disclosed
CN-109843533-A The manufacturing method of optical film 柯尼卡美能达株式会社 2019-06-04 CN disclosed
CN-105829386-B Epoxy resin composition, cured product thereof, and semiconductor device 日本化药株式会社 2019-05-03 CN disclosed
CN-109709770-A The manufacturing method of resin combination, dry film and manufacturing method, resist film and substrate and plating forming object, sulfhydryl compound 东京应化工业株式会社 2019-05-03 CN disclosed
CN-105348457-B Organic-inorganic composite body and its manufacturing method, organic/inorganic composite film and its manufacturing method, photonic crystal, coating material 旭化成株式会社 2019-04-26 CN disclosed
CN-109563062-A The manufacture of sulfonyl azide acid anhydrides 陶氏环球技术有限责任公司 2019-04-02 CN disclosed
CN-109517010-A flame-retardant compound, preparation method and application thereof 中山台光电子材料有限公司 2019-03-26 CN disclosed
CN-106661311-B Resin composition, prepreg, metal foil with resin, metal-clad laminate, and printed wiring board 松下知识产权经营株式会社 2019-03-19 CN disclosed
CN-109312022-A Aliphatic sulfonyl azide acid anhydrides for articulamentum 陶氏环球技术有限责任公司 2019-02-05 CN disclosed
CN-109153635-A Neuropeptide S receptor (NPSR) agonist 研究三角协会 2019-01-04 CN disclosed
CN-104470965-B9 Epoxy resin, composition epoxy resin and solidfied material 日本化药株式会社 2019-01-01 CN disclosed
CN-109111739-A Resin combination and the article being made from it 中山台光电子材料有限公司 2019-01-01 CN disclosed
CN-109071954-A Curable composition, cured film using same, and overcoat film 昭和电工株式会社 2018-12-21 CN disclosed
CN-109071955-A Curable composition, cured film using same, and overcoat film 昭和电工株式会社 2018-12-21 CN disclosed
CN-108884245-A Polyimide film and method for producing same 柯尼卡美能达株式会社 2018-11-23 CN disclosed
CN-105873973-B Epoxy resin, epoxy resin composition, and cured product thereof 日本化药株式会社 2018-11-20 CN disclosed
CN-103116244-B Hardening resin composition 住友化学株式会社 2018-11-13 CN disclosed
CN-105899566-B Epoxy resin composition, composition epoxy resin, its solidfied material and semiconductor device 日本化药株式会社 2018-10-26 CN disclosed
CN-108485448-A Resin combination, film and copolymer 住友化学株式会社 2018-09-04 CN disclosed
CN-108459468-A Resin combination and cured film 住友化学株式会社 2018-08-28 CN disclosed
CN-108350146-A The composition epoxy resin of alkyl is stretched containing long-chain 日产化学工业株式会社 2018-07-31 CN disclosed
CN-108276412-A Glycoluril class with functional group and its utilization 四国化成工业株式会社 2018-07-13 CN disclosed
CN-104419344-B The manufacturing method of conductive adhesive, solar battery module and solar battery module 迪睿合电子材料有限公司 2018-07-13 CN disclosed
CN-108241258-A Liquid crystal display device resin combination, liquid crystal display device film and copolymer 住友化学株式会社 2018-07-03 CN disclosed
CN-105873976-B Modifying epoxy resin by organosilicon and combinations thereof and solidfied material 信越化学工业株式会社 2018-07-03 CN disclosed
CN-105906678-B Fluorine substitution triazole norcantharidin derivative of structure containing glucoside and preparation method and application 绍兴文理学院 2018-06-26 CN disclosed
CN-108164534-A Glycoluril class and its utilization with functional group 四国化成工业株式会社 2018-06-15 CN disclosed
CN-104769000-B Epoxy resin mixture, epoxy resin composition, and cured product thereof 日本化药株式会社 2018-06-12 CN disclosed
CN-108025405-A soldering flux 千住金属工业株式会社 2018-05-11 CN disclosed
CN-108026228-A Allyl ether resin, methacrylic ether resin, epoxy resin, epoxy resin component and its hardening thing being substituted 日本化药株式会社 2018-05-11 CN disclosed
CN-105980441-B Epoxy resin composition, curable resin composition, its solidfied material and semiconductor device 日本化药株式会社 2018-05-08 CN disclosed
CN-104725600-B Optics composition epoxy resin and its solidfied material 新日铁住金化学株式会社 2018-04-24 CN disclosed
CN-107936227-A With the epoxide containing azo-cycle 日产化学工业株式会社 2018-04-20 CN disclosed
CN-107922751-A Near-infrared absorbing pigment polymer, composition, film, optical filter, pattern forming method and device 富士胶片株式会社 2018-04-17 CN disclosed
EP-3294287-A1 OXABICYCLOHEPTANE PRODRUGS Lixte Biotechnology, Inc. (US) 2018-03-21 EP disclosed
CN-107722563-A Transparent circuit substrate composition epoxy resin and laminated glass piece 日本化药株式会社 2018-02-23 CN disclosed
CN-107708686-A Oxabicycloheptane prodrugs 莱克斯特生物技术公司 2018-02-16 CN disclosed
CN-105555827-B Epoxy resin composition, composition epoxy resin, solidfied material and semiconductor device 日本化药株式会社 2018-02-16 CN disclosed
CN-104672433-B Clear sheet composition epoxy resin and its solidfied material and optical sheet 日本化药株式会社 2018-02-09 CN disclosed
CN-103421403-B Hardening resin composition 住友化学株式会社 2018-01-30 CN disclosed
CN-107556457-A Resin combination and its solidfied material 日本化药株式会社 2018-01-09 CN disclosed
CN-104813741-B Resin combination and its solidfied material (1) 日本化药株式会社 2018-01-05 CN disclosed
CN-105037722-B Polyimide precursor through dicarboxylic anhydride modification, polyimides obtained by imidizate and use its aligning agent for liquid crystal 日产化学工业株式会社 2017-12-19 CN disclosed
CN-107434941-A Resin combination and cured film 住友化学株式会社 2017-12-05 CN disclosed
CN-104877127-B A kind of eight arms polyethyleneglycol derivative, preparation method and its bio-related substance of modification 厦门赛诺邦格生物科技股份有限公司 2017-11-10 CN disclosed
CN-107272331-A Hardening resin composition and cured film 住友化学株式会社 2017-10-20 CN disclosed
CN-107250282-A Thermosetting resin composition and polycarboxylic acid resin containing polyol compound, acid anhydride compound and thermosetting resin, thermosetting resin composition using the same, and optical semiconductor device using any of the thermosetting resin compositions as sealing material or reflecting material 日本化药株式会社 2017-10-13 CN disclosed
CN-104918977-B Epoxy resin, curable resin composition, and cured product 日本化药株式会社 2017-10-10 CN disclosed
CN-103183809-B Epoxy resin composition for transparent circuit board and laminated glass sheet 日本化药株式会社 2017-09-29 CN disclosed
CN-104619710-B Oxabicyclo heptane and oxabicyclo heptene for treating reperfusion injury 里克思特生物技术有限公司 2017-09-22 CN disclosed
CN-105164179-B Epoxy resin composition, cured product, heat dissipating material, and electronic component DIC株式会社 2017-09-08 CN disclosed
CN-107074785-A Polybasic carboxylic acid and polycarboxylic acid compositions, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device containing it 日本化药株式会社 2017-08-18 CN disclosed
CN-105358624-B Resin combination, prepreg and laminate 松下知识产权经营株式会社 2017-06-06 CN disclosed
CN-106795125-A Polybasic carboxylic acid and the polycarboxylic acid compositions containing it, composition epoxy resin, hot curing resin composition, their solidfied material and optical semiconductor device 日本化药株式会社 2017-05-31 CN disclosed
CN-104412369-B Method for producing semiconductor device 日立化成株式会社 2017-05-24 CN disclosed
CN-106661311-A Resin composition, prepreg, metal foil with resin, metal-clad laminate, and printed wiring board 松下知识产权经营株式会社 2017-05-10 CN disclosed
CN-106661198-A Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board 松下知识产权经营株式会社 2017-05-10 CN disclosed
CN-104470965-B Epoxy resin, epoxy resin composition and cured product 日本化药株式会社 2017-04-12 CN disclosed
CN-104903379-B Epoxy resin, epoxy resin composition and cured meterial 日本化药株式会社 2017-04-12 CN disclosed
CN-104781307-B Polyphenylene ether novolac resin, epoxy resin composition, and cured product thereof 日本化药株式会社 2017-04-12 CN disclosed
CN-105121508-B Novel polycarboxylic acid anhydride and use thereof 新日本理化株式会社 2017-03-22 CN disclosed
CN-104395371-B Composition epoxy resin and its solidfied material and hardening resin composition 日本化药株式会社 2017-03-15 CN disclosed
WO-2016186963-A1 OXABICYCLOHEPTANE PRODRUGS LIXTE BIOTECHNOLOGY, INC. (US) 2016-11-24 WO disclosed
CN-106133020-A Modifying epoxy resin by organosilicon and containing the compositions of this epoxy resin and solidfied material thereof 信越化学工业株式会社 2016-11-16 CN disclosed
CN-106083966-A Fluorine replaces containing galactoside structure triazole norcantharidin derivative and preparation method and application 绍兴文理学院 2016-11-09 CN disclosed
CN-106083965-A Containing lactoside structure triazole norcantharidin derivative and preparation method and application 绍兴文理学院 2016-11-09 CN disclosed
CN-106083967-A Containing galactoside structure triazole norcantharidin derivative and preparation method and application 绍兴文理学院 2016-11-09 CN disclosed
CN-106083968-A Containing glucoside structure triazole norcantharidin derivative and preparation method and application 绍兴文理学院 2016-11-09 CN disclosed
CN-106008634-A Fluoro-substituted triazole norcantharidin derivative containing arabinoside structure, and preparation method and application thereof 绍兴文理学院 2016-10-12 CN disclosed
CN-106008635-A Triazole norcantharidin derivative containing galactoside structure, and preparation method and application thereof 绍兴文理学院 2016-10-12 CN disclosed
CN-105980441-A Epoxy resin mixture, curable resin composition, cured product thereof, and semiconductor device 日本化药株式会社 2016-09-28 CN disclosed
CN-105980440-A Epoxy resin, curable resin composition, and cured product thereof 日本化药株式会社 2016-09-28 CN disclosed
EP-3068398-A1 PROTEIN PHOSPHATASE INHIBITORS THAT CROSS THE BLOOD BRAIN BARRIER Lixte Biotechnology, Inc. (US) 2016-09-21 EP disclosed
CN-105924486-A Maltoside structure-containing triazole demethylcantharidin derivative and preparation method and application thereof 绍兴文理学院 2016-09-07 CN disclosed
CN-105906678-A Fluoro-substituted glucoside-structure-containing triazole norcantharidin derivative and preparation method and application thereof 绍兴文理学院 2016-08-31 CN disclosed
CN-105899566-A Epoxy resin mixture, epoxy resin composition, cured product thereof, and semiconductor device 日本化药株式会社 2016-08-24 CN disclosed
CN-105873973-A Epoxy resin, epoxy resin composition, and cured product thereof 日本化药株式会社 2016-08-17 CN disclosed
CN-103314063-B Painting cloth material, organic/inorganic composite film and antireflection parts containing organic-inorganic composite body 旭化成株式会社 2016-08-17 CN disclosed
CN-105873976-A Silicone-modified epoxy resin and composition and cured article thereof 信越化学工业株式会社 2016-08-17 CN disclosed
CN-105849149-A Thermosetting resin composition, method for manufacturing reflective member for optical semiconductor device using same, and optical semiconductor device 日本化药株式会社 2016-08-10 CN disclosed
CN-105829386-A Epoxy resin composition, cured product thereof, and semiconductor device 日本化药株式会社 2016-08-03 CN disclosed
CN-105745213-A Glycolurils having functional group and use thereof 四国化成工业株式会社 2016-07-06 CN disclosed
CN-103787887-B The manufacture method of polybasic carboxylic acid and compositions, hardening resin composition, solidfied material and polybasic carboxylic acid 日本化药株式会社 2016-06-22 CN disclosed
CN-105637008-A Curable resin composition and cured product thereof NIPPON KAYAKU KK 2016-06-01 CN disclosed
CN-103476764-B Process for producing episulfide compound ASAHI KASEI KABUSHIKI KAISHA (JP) 2016-05-25 CN disclosed
CN-105555827-A Epoxy resin mixture, epoxy resin composition, cured product and semiconductor device NIPPON KAYAKU KK 2016-05-04 CN disclosed
CN-105531626-A Photosensitive light-shielding paste and process for producing laminated pattern for touch sensor TORAY INDUSTRIES 2016-04-27 CN disclosed
CN-105531297-A Epoxy resin mixture, epoxy resin composition, cured product and semiconductor device NIPPON KAYAKU KK 2016-04-27 CN disclosed
CN-104067173-B Photosensitive conductive paste TORAY INDUSTRIES, INC. (JP) 2016-04-06 CN disclosed
CN-102939313-B Curable resin composition and cured product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2016-03-16 CN disclosed
CN-105408393-A Transparent polyimide copolymer, polyimide resin composition and molded article, and production method of said copolymer SOMAR CORP 2016-03-16 CN disclosed
CN-103739617-B Isoxazole norcantharidin derivative and preparation method thereof and application SHAOXING UNIVERSITY (CN) 2016-03-02 CN disclosed
CN-105348457-A Organic/inorganic composite, manufacturing method therefor, organic/inorganic composite film, manufacturing method therefor, photonic crystal, coating material ASAHI KASEI CHEMICALS CORP 2016-02-24 CN disclosed
CN-105358624-A Resin composition, prepreg and laminate board PANASONIC IP MAN CO LTD 2016-02-24 CN disclosed
CN-103896954-B A kind of pyrazoles norcantharidin derivative and preparation method thereof and application SHAOXING UNIVERSITY (CN) 2016-02-17 CN disclosed
CN-103554135-B A kind of containing chromone structure isoxazole norcantharidin derivative and preparation method thereof and application SHAOXING UNIVERSITY (CN) 2016-01-20 CN disclosed
CN-103554122-B A kind of containing chromone structure pyrazoles norcantharidin derivative and preparation method thereof and application SHAOXING UNIVERSITY (CN) 2016-01-20 CN disclosed
CN-103554134-B Containing chromone structure isoxazole norcantharidin derivative and preparation method thereof and application SHAOXING UNIVERSITY (CN) 2016-01-20 CN disclosed
CN-103554123-B Containing chromone structure pyrazoles norcantharidin derivative and preparation method thereof and application SHAOXING UNIVERSITY (CN) 2016-01-20 CN disclosed
EP-2966106-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT, HEAT RADIATING MATERIAL, AND ELECTRONIC MEMBER DIC Corporation (JP) 2016-01-13 EP disclosed
CN-105164179-A Epoxy resin composition, cured product, heat dissipating material, and electronic component DAINIPPON INK & CHEMICALS 2015-12-16 CN disclosed
CN-105121508-A Novel polycarboxylic acid anhydride and use thereof NEW JAPAN CHEM CO LTD 2015-12-02 CN disclosed
CN-103038285-B Composition, the display equipment mechanical seal agent composition, display equipment and the manufacture method thereof that are made up of said composition MITSUI CHEMICALS, INC. (JP) 2015-11-25 CN disclosed
CN-103221451-B Epoxy resin composition for transparent sheet and cured product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2015-11-25 CN disclosed
CN-105037722-A Polyimide precursor modified with dicarboxylic acid anhydride, imidized polyimide and liquid crystal aligning agent using it NISSAN CHEMICAL IND LTD 2015-11-11 CN disclosed
CN-102686633-B Composition epoxy resin NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2015-10-07 CN disclosed
CN-104918977-A Epoxy resin, curable resin composition, and cured product NIPPON KAYAKU KK 2015-09-16 CN disclosed
CN-104903379-A Epoxy resin, epoxy resin composition and cured meterial NIPPON KAYAKU KK 2015-09-09 CN disclosed
CN-104877127-A Eight-armed polyethylene glycol derivative, preparation method and related biological substance modified by derivative XIAMEN SINOPEG BIOTECH CO LTD 2015-09-02 CN disclosed
CN-104822729-A Resin composition and cured product (2) thereof NIPPON KAYAKU KK 2015-08-05 CN disclosed
CN-104813741-A Resin composition, and cured product (1) thereof NIPPON KAYAKU KK 2015-07-29 CN disclosed
CN-103502311-B Polyimide precursor modified with dicarboxylic anhydride, polyimide obtained by imidization, and liquid crystal alignment treatment agent using same NISSAN CHEMICAL IND LTD 2015-07-22 CN disclosed
CN-102532483-B Thermosetting resin compound containing carboxyl modified polyurethane resin TOYO INK SC HOLDINGS CO LTD 2015-07-15 CN disclosed
CN-104781307-A Polyphenylene ether novolac resin, epoxy resin composition, and cured product thereof NIPPON KAYAKU KK 2015-07-15 CN disclosed
CN-102574983-B Curable resin composition and cured products thereof NIPPON KAYAKU KK 2015-07-08 CN disclosed
CN-104769000-A Epoxy resin mixture, epoxy resin composition, and cured product thereof NIPPON KAYAKU KK 2015-07-08 CN disclosed
CN-102971355-B Polyvalent carboxylic acid composition, curing agent composition, and curable resin composition containing polyvalent carboxylic acid composition or curing agent composition as curing agent for epoxy resin NIPPON KAYAKU KK 2015-07-08 CN disclosed
CN-102639590-B Curable resin composition and cured product thereof NIPPON KAYAKU KK 2015-06-24 CN disclosed
CN-104725600-A The optical epoxy resin composition and cured product thereof NIPPON STEEL & SUMIKIN CHEM CO 2015-06-24 CN disclosed
CN-103285381-B A combination of ribonucleases and cantharidin GUIZHOU MAQIKA GROUP 2015-06-24 CN disclosed
US-9051116-B2 Container and composition for enhanced gas barrier properties THE COCA-COLA COMPANY (US) 2015-06-09 US disclosed
CN-104672433-A Epoxy resin composition, cured product thereof and optical sheet NIPPON KAYAKU KK 2015-06-03 CN disclosed
WO-2015073802-A1 PROTEIN PHOSPHATASE INHIBITORS THAT CROSS THE BLOOD BRAIN BARRIER LIXTE BIOTECHNOLOGY, INC. (US) 2015-05-21 WO disclosed
CN-104610222-A Process for preparing episulfide compounds ASAHI KASEI CHEMICALS CORP 2015-05-13 CN disclosed
CN-104619710-A Oxabicycloheptanes and oxabicycloheptenes for the treatment of reperfusion injury LIXTE BIOTECHNOLOGY INC 2015-05-13 CN disclosed
CN-104470965-A Epoxy resin, epoxy resin composition and cured product NIPPON KAYAKU KK 2015-03-25 CN disclosed
CN-103038298-B Coating composition and method for producing coating films ASAHI GLASS CO LTD 2015-03-25 CN disclosed
CN-101942073-B Curable resin composition for encapsulating optical semiconductor and cured product thereof NIPPON KAYAKU KK 2015-03-18 CN disclosed
CN-104395371-A Epoxy resin composition, cured product thereof, and curable resin composition NIPPON KAYAKU KK 2015-03-04 CN disclosed
CN-102395555-B Epoxy resin, curable resin composition, and material resulting from curing same NIPPON KAYAKU KK 2015-01-21 CN disclosed
CN-104231958-A Adhesive material for semiconductor manufacturing process NIPPONKAYAKU KABUSHIKI KAISHA 2014-12-24 CN disclosed
CN-102333768-B diene compound, epoxy resin and composition thereof NIPPON KAYAKU KK 2014-11-12 CN disclosed
CN-102010343-B Polyhydroxy compound, method for manufacturing the same and epoxy resin composition, cured product thereof NIPPON STEEL CHEMICAL CO. (JP) 2014-10-22 CN disclosed
CN-102892745-B Diolefin compound, epoxy resin, curable resin composition, and cured article NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2014-10-15 CN disclosed
CN-104066788-A Composition, composition for display device end-face sealing agent comprising composition, and display device and method for manufacturing same MITSU CHEMICALS INC 2014-09-24 CN disclosed
CN-104067173-A Photosensitive conductive paste TORAY INDUSTRIES 2014-09-24 CN disclosed
US-20140212611-A1 CONTAINER AND COMPOSITION FOR ENHANCED GAS BARRIER PROPERTIES THE COCA-COLA COMPANY (US) 2014-07-31 US disclosed
CN-102459144-B Polycarboxylic acid, composition thereof, curable resin composition, cured product, and method for producing polycarboxylic acid NIPPON KAYAKU KK 2014-07-16 CN disclosed
CN-103917597-A Resin composition for optical semiconductor sealing material DAI ICHI KOGYO SEIYAKU CO LTD 2014-07-09 CN disclosed
CN-103896954-A Pyrazol norcantharidin derivative as well as preparation method and application thereof UNIV SHAOXING 2014-07-02 CN disclosed
CN-102448965-B Prostaglandin e receptor antagonists ALLERGAN INC 2014-06-18 CN disclosed
CN-103788059-A Diolefin compound, epoxy resin, curable resin composition and cured product NIPPON KAYAKU KK 2014-05-14 CN disclosed
CN-103787887-A Polyvalent carboxylic acid, composition thereof, curable resin composition, cured product, and method for manufacturing a polyvalent carboxylic acid NIPPON KAYAKU KK 2014-05-14 CN disclosed
CN-102648244-B Polycarboxylic acid composition, process for preparation thereof, and curable resin compositions containing the polycarboxylic acid composition NIPPON KAYAKU KK 2014-05-07 CN disclosed
CN-103781815-A Curable resin composition for sealing optical semiconductor element and cured product thereof NIPPON KAYAKU KK 2014-05-07 CN disclosed
CN-103739617-A Isoxazole norcantharidin derivative, and preparation method and application thereof UNIV SHAOXING 2014-04-23 CN disclosed
CN-103554122-A Chromone structure-containing pyrazole norcantharidin derivative as well as preparation method and application thereof UNIV SHAOXING 2014-02-05 CN disclosed
CN-103554134-A Chromone structure containing isoxazole norcantharidin derivatives as well as preparation method and application thereof UNIV SHAOXING 2014-02-05 CN disclosed
CN-103554135-A Chromone structure containing isoxazole norcantharidin derivatives as well as preparation method and application thereof UNIV SHAOXING 2014-02-05 CN disclosed
CN-103554123-A Chromone structure-containing pyrazole norcantharidin derivatives, and preparation method and application thereof UNIV SHAOXING 2014-02-05 CN disclosed
CN-103502311-A Polyimide precursor modified with dicarboxylic anhydride, polyimide obtained by imidization, and liquid crystal alignment treatment agent using same NISSAN CHEMICAL IND LTD 2014-01-08 CN disclosed
CN-103476764-A Process for producing episulfide compound ASAHI KASEI CHEMICALS CORP (JP) 2013-12-25 CN disclosed
CN-103421403-A Curable resin composition SUMITOMO CHEMICAL CO 2013-12-04 CN disclosed
CN-102388016-B Olefin compound, epoxy resin, curable resin composition and cured product thereof, and led device NIPPON KAYAKU KK 2013-11-06 CN disclosed
CN-103314063-A Coating material containing organic/inorganic composite, organic/inorganic composite film and antireflection member ASAHI KASEI CHEMICALS CORP (JP) 2013-09-18 CN disclosed
CN-103282387-A Organic-inorganic composite and method for producing same, organic-inorganic composite film and method for producing same, photonic crystal, coating material, thermoplastic composition, microstructure, optical material, antireflection member, and optical lens ASAHI KASEI CHEMICALS CORP (JP) 2013-09-04 CN disclosed
US-8524921-B2 Liquid tetracarboxylic dianhydrides and process for the preparation thereof HITACHI CHEMICAL CO., LTD. (JP) 2013-09-03 US disclosed
CN-103222069-A Conductive adhesive material, solar cell module, and method for manufacturing same SONY CHEM & INF DEVICE 2013-07-24 CN disclosed
CN-103221451-A Epoxy resin composition for transparent sheet and cured product thereof NIPPON KAYAKU KK 2013-07-24 CN disclosed
CN-103183809-A Epoxy resin composition for transparent circuit board and laminated glass sheet NIPPON KAYAKU KK 2013-07-03 CN disclosed
EP-2602257-A1 EPOXY COMPOUND WITH NITROGEN-CONTAINING RING Nissan Chemical Industries, Ltd. (JP) 2013-06-12 EP disclosed
EP-2601187-A1 DEUTERATED TANDOSPIRONE DERIVATIVES AS 5-HT1A RECEPTOR AGONISTS Conrig Pharma ApS (DK) 2013-06-12 EP disclosed
CN-103113805-A Curable resin composition SUMITOMO CHEMICAL CO 2013-05-22 CN disclosed
CN-103116244-A Curable resin composition SUMITOMO CHEMICAL CO 2013-05-22 CN disclosed
CN-103068822-A Epoxy compound having nitrogen-containing ring NISSAN CHEMICAL IND LTD 2013-04-24 CN disclosed
CN-103048881-A Curable resin composition SUMITOMO CHEMICAL CO 2013-04-17 CN disclosed
CN-103038285-A Composition, composition being for end-face sealing agent for display devices and consisting of the composition, display devices, and process for producing same MITSUI CHEMICALS INC 2013-04-10 CN disclosed
CN-103038298-A Coating composition and method for producing coating films ASAHI GLASS CO LTD 2013-04-10 CN disclosed
US-8409425-B2 Biosensor coating composition and methods thereof ABBOTT DIABETES CARE INC. (US) 2013-04-02 US disclosed
CN-102971355-A Polyvalent carboxylic acid composition, curing agent composition, and curable resin composition containing polyvalent carboxylic acid composition or curing agent composition as curing agent for epoxy resin NIPPON KAYAKU KK 2013-03-13 CN disclosed
CN-102952064-A Preparation method of medicine intermediate cis-ex-bicyclo[2.2.1]heptane-2.3-dicarboximide TIANJIN INST PHARM RESEARCH 2013-03-06 CN disclosed
CN-102076734-B Modified resin composition, method for producing same, and curable resin composition containing same ASAHI KASEI CHEMICALS CORP (JP) 2013-02-27 CN disclosed
CN-102939315-A Curable resin composition and substance obtained by curing same NIPPON KAYAKU KK 2013-02-20 CN disclosed
CN-102939313-A Curable resin composition and cured product thereof NIPPON KAYAKU KK 2013-02-20 CN disclosed
CN-102892745-A Diolefin compound, epoxy resin, curable resin composition, and cured article NIPPON KAYAKU KK 2013-01-23 CN disclosed
CN-102850893-A Curable resin composition SUMITOMO CHEMICAL CO 2013-01-02 CN disclosed
CN-102791760-A Curable resin composition and cured product thereof NIPPON KAYAKU KK 2012-11-21 CN disclosed
CN-102782014-A Process for production of organopolysiloxane, organopolysiloxane obtained by the process, and composition that contains the organopolysiloxane NIPPON KAYAKU KK 2012-11-14 CN disclosed
CN-102686633-A Epoxy resin composition NIPPON KAYAKU KK 2012-09-19 CN disclosed
CN-102648244-A Polycarboxylic acid composition, process for preparation thereof, and curable resin compositions containing the polycarboxylic acid composition NIPPON KAYAKU KK 2012-08-22 CN disclosed
CN-102639590-A Curable resin composition and cured product thereof NIPPON KAYAKU KK 2012-08-15 CN disclosed
CN-102574983-A Curable resin composition and cured products thereof NIPPON KAYAKU KK 2012-07-11 CN disclosed
CN-102532483-A Thermosetting resin compound containing carboxyl modified polyurethane resin TOYO INK MFG CO 2012-07-04 CN disclosed
CN-102459144-A Polycarboxylic acid, composition thereof, curable resin composition, cured product, and method for producing polycarboxylic acid NIPPON KAYAKU KK 2012-05-16 CN disclosed
CN-102448965-A Prostaglandin e receptor antagonists ALLERGAN INC 2012-05-09 CN disclosed
CN-102388016-A Olefin compound, epoxy resin, curable resin composition and cured product thereof, and led device NIPPON KAYAKU KK 2012-03-21 CN disclosed
WO-2012016569-A1 DEUTERATED TANDOSPIRONE DERIVATIVES AS 5-HT1A RECEPTOR AGONISTS CONRIG PHARMA APS (DK) 2012-02-09 WO disclosed
CN-102333768-A Diene compound, epoxy resin and composition thereof NIPPON KAYAKU KK 2012-01-25 CN disclosed
US-20110301362-A1 NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-12-08 US disclosed
CN-102076734-A Modified resin composition, method for producing same, and curable resin composition containing same ASAHI CHEMICAL CORP (JP) 2011-05-25 CN disclosed
CN-101942073-A Optical semiconductor sealing curable resin composition and cured article thereof NIPPON KAYAKU KK 2011-01-12 CN disclosed
EP-2264097-A1 Method for producing cure system, adhesive system, and electronic device Momentive Performance Materials Inc. (US) 2010-12-22 EP disclosed
CN-100448909-C Photosensitive element packaging material composition and use method thereof ETERNAL CHEMICAL INDUSTRY CO LTD (CN) 2009-01-07 CN disclosed
WO-2008021135-A2 SYNERETIC COMPOSITION, ASSOCIATED METHOD AND ARTICLE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-02-21 WO disclosed
WO-2008021139-A1 OXETANE COMPOSITION, ASSOCIATED METHOD AND ARTICLE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-02-21 WO disclosed
WO-2008019151-A1 OXETANE COMPOSITION, ASSOCIATED METHOD AND ARTICLE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-02-14 WO disclosed
WO-2008019149-A1 COMPOSITION AND ASSOCIATED METHOD MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-02-14 WO disclosed
WO-2008019152-A1 COMPOSITION, ASSOCIATED METHOD AND ARTICLE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-02-14 WO disclosed
CN-100998589-A Novel use of Enduotai, hard capsule thereof, and method for preparing the injection WANG GUANGSHENG (CN) 2007-07-18 CN disclosed
CN-1240757-C Highly nucleated thermoplastic articles MILLIKEN & CO (US) 2006-02-08 CN disclosed
CN-1213050-C Use of oxadicyclo [2.2.1] heptane derivative as pesticide BAYER AG (DE) 2005-08-03 CN disclosed
CN-1525557-A Photosensitive element packaging material composition and use method thereof 长兴化学工业股份有限公司 2004-09-01 CN disclosed
CN-1498245-A Highly nucleated thermoplastic articles 2004-05-19 CN disclosed
CN-1355168-A Use of oxadicyclo [2.2.1] heptane derivative as pesticide BAYER AG (DE) 2002-06-26 CN disclosed
US-20020065369-A1 Low gloss powder coating composition DUMAIN ERIC (US) 2002-05-30 US disclosed
CN-1084348-C Epoxy functional polyethers SHELL INT RESEARCH (NL) 2002-05-08 CN disclosed
CN-1307904-A Near infrared ray irradiation method for cosmetics and its application BASF AG (DE) 2001-08-15 CN disclosed
US-6093774-A COMPRISING A GLYCIDYL-CONTAINING ACRYLIC POLYMER, A FIRST ACID FUNCTIONAL CROSSLINKING AGENT COMPRISING A COPOLYMER OF AN ETHYLENICALLY UNSATURATED COMPOUND AND AN ANHYDRIDE OF DICARBOXYLIC ACID, AND A SECOND DICARBOXYLIC ACID CROSSLINKER REICHHOLD CHEMICALS, INC. (US) 2000-07-25 US disclosed
WO-1999016838-A1 POWDER COATING COMPOSITION REICHHOLD, INC. (US) 1999-04-08 WO disclosed
US-5847155-A Aromatic pyrrolidine amide prolyl endopeptidase inhibitors PFIZER INC (US) 1998-12-08 US disclosed
CN-1171127-A Epoxy functional polyethers SHELL INT RESEARCH (NL) 1998-01-21 CN disclosed
CN-1087526-A A Gan goes anticancer preparation prescription and technology UNIV BEIJING MEDICAL (CN) 1994-06-08 CN disclosed
EP-0338498-A2 Process for preparing fluorine-containing copolymers DAIKIN INDUSTRIES, LIMITED (JP) 1989-10-25 EP disclosed
US-4842667-A IMPREGNATING FABRIC BANDS WITH TRIS/HYDROXYPHENYL/METHANE BASED RESIN WITH MIXTURE OF ANHYDRIDE CURING AGENTS LOCKHEED CORPORATION (US) 1989-06-27 US disclosed
EP-0095156-B1 PROCESS FOR PREPARING QUATERNARY AMMONIUM-FUNCTIONAL SILICON COMPOUNDS, PRODUCTS PREPARED THEREOF AND USE OF THE SAME Stauffer-Wacker Silicones Corporation (US) 1986-08-13 EP disclosed
US-4421561-A CHEMICAL EMBOSSING TARKETT AB (SE) 1983-12-20 US disclosed
EP-0095676-A2 Carboxylic acid-functional polysiloxane polymers, process for preparing the same and use thereof SWS Silicones Corporation (US) 1983-12-07 EP disclosed
EP-0095156-A2 Process for preparing quaternary ammonium-functional silicon compounds, products prepared thereof and use of the same Stauffer-Wacker Silicones Corporation (US) 1983-11-30 EP disclosed
US-4390713-A CATIONIC POLYMERS FROM A CARBOXYLIC ACID-CONTAINING POLYSILOXANE AND A HYDROXYL-CONTAINING AMMONIUM SALT; TEXTILE ANTISTATIC AGENTS SWS SILICONES CORPORATION (US) 1983-06-28 US disclosed
US-4369065-A Water based ink compositions using organic acid TARKETT AB (SE) 1983-01-18 US disclosed
US-4277427-A DISTRIBUTION OF RESINOUS FLAKES CONTAINING A BLOWING AGENT SUPPRESSOR ON A PRINTED, GELLED, FOAMABLE POLYMER CONGOLEUM CORPORATION (US) 1981-07-07 US disclosed
US-4167539-A Styrene-grafted polyanhydride copolymer GULF OIL CORPORATION (US) 1979-09-11 US disclosed
US-4097448-A Thermosettable epoxide-polyanhydride compositions GULF OIL CORPORATION (US) 1978-06-27 US disclosed
US-4097449-A Handleable, thermosettable epoxide-polyanhydride compositions GULF OIL CORPORATION (US) 1978-06-27 US disclosed
US-4091048-A Powder coating compositions containing glycidyl ester copolymers and organic carboxylic acid anhydride crosslinking agent FORD MOTOR COMPANY (US) 1978-05-23 US disclosed
US-4056506-A HOMOGENEOUS POLYEPOXIDE-POLYANHYDRIDE COMPOSITIONS GULF OIL CORPORATION (US) 1977-11-01 US disclosed
US-4017453-A Homogeneous polyepoxide-polyanhydride compositions GULF OIL CORPORATION (US) 1977-04-12 US disclosed
US-3975456-A Powder paint with epoxy and amide copolymer and anhydride FORD MOTOR COMPANY (US) 1976-08-17 US disclosed
US-3975456-A Powder paint with epoxy and amide copolymer and anhydride FORD MOTOR COMPANY (US) 1976-08-17 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110301362-A1 NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF EXOC1, C9, CA1 TP53 2177/4885ELANE 14/4885PRKCA 4259/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.