⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3137072 | 0.87 | TSHR (0.33) | — | |
| SCHEMBL5613264 | 0.86 | ALDH1A1 (0.54) | — | |
| SCHEMBL29106723 | 0.86 | ALDH1A1 (0.54) | — | |
| SCHEMBL21811502 | 0.82 | NAAA (0.55) | — | |
| SCHEMBL21811776 | 0.82 | NAAA (0.55) | — | |
| SCHEMBL21811418 | 0.82 | NAAA (0.55) | — | |
| SCHEMBL21811474 | 0.82 | NAAA (0.55) | — | |
| SCHEMBL21811594 | 0.82 | NAAA (0.55) | — | |
| SCHEMBL29547684 | 0.82 | NAAA (0.55) | — | |
| SCHEMBL4246452 | 0.82 | HCAR2 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250011480-A1 | CURABLE RESIN COMPOSITION | KYOEISHA CHEMICAL CO., LTD. (JP) | 2025-01-09 | — | — | US | disclosed |
| EP-4414426-A1 | CURABLE RESIN COMPOSITION | Kyoeisha Chemical Co., Ltd. (JP) | 2024-08-14 | — | — | EP | disclosed |
| CN-118019808-A | Curable resin composition | 共荣社化学株式会社 | 2024-05-10 | — | — | CN | disclosed |
| US-11958802-B2 | Migration-resistant photopolymerization sensitizer | KAWASAKI KASEI CHEMICALS LTD. (JP) | 2024-04-16 | — | — | US | disclosed |
| CN-113166036-B | Photopolymerizing sensitizers with migration resistance | 川崎化成工业株式会社 | 2023-10-10 | — | — | CN | disclosed |
| WO-2023080228-A1 | CURABLE RESIN COMPOSITION | 共栄社化学株式会社 | 2023-05-11 | — | — | WO | disclosed |
| US-20230110863-A1 | THERMOSETTING RESIN COMPOSITION AND TRANSESTERIFICATION REACTION CATALYST | KYOEISHA CHEMICAL CO., LTD. (JP) | 2023-04-13 | — | — | US | disclosed |
| EP-4098696-A1 | THERMOSETTING RESIN COMPOSITION AND TRANSESTERIFICATION REACTION CATALYST | Kyoeisha Chemical Co., Ltd. (JP) | 2022-12-07 | — | — | EP | disclosed |
| CN-115244128-A | Thermosetting resin composition and transesterification catalyst | 共荣社化学株式会社 | 2022-10-25 | — | — | CN | disclosed |
| US-20220251274-A1 | CURABLE RESIN COMPOSITION, CURED FILM, COATING RESIN MOLDED BODY AND MULTILAYER FILM | KYOEISHA CHEMICAL CO., LTD. (JP) | 2022-08-11 | — | — | US | disclosed |
| EP-3988301-A1 | CURABLE RESIN COMPOSITION, CURED FILM, COATED RESIN MOLDED BODY AND MULTILAYER FILM | Kyoeisha Chemical Co., Ltd. (JP) | 2022-04-27 | — | — | EP | disclosed |
| US-20220106254-A1 | MIGRATION-RESISTANT PHOTOPOLYMERIZATION SENSITIZER | KAWASAKI KASEI CHEMICALS LTD. (JP) | 2022-04-07 | — | — | US | disclosed |
| CN-114096622-A | Curable resin composition, cured film, coated resin molded article, and multilayer film | 共荣社化学株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-113166036-A | Photopolymerisable sensitizers having migration resistance | 川崎化成工业株式会社 | 2021-07-23 | — | — | CN | disclosed |
| WO-2021006290-A1 | CURABLE RESIN COMPOSITION, CURED FILM, COATED RESIN MOLDED BODY AND MULTILAYER FILM | 共栄社化学株式会社 | 2021-01-14 | — | — | WO | disclosed |
| WO-2020054874-A1 | PHOTOPOLYMERIZATION SENSITIZER | 川崎化成工業株式会社 | 2020-03-19 | — | — | WO | disclosed |
| US-20070270521-A1 | Transition metal compound, polymerization-initiator system comprising the same, and process for producing polymer | SUMITOMO CHEMICAL COMPANY, LIMITED | 2007-11-22 | — | — | US | disclosed |
| CN-101024659-A | Transition metal compound, polymerization initiator system including same and polymer production method | SUMITOMO CHEMICAL CO (JP) | 2007-08-29 | — | — | CN | disclosed |