SCHEMBL5616656

SCHEMBL5616656

ON=[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL571392 0.67
SCHEMBL325170 0.61
SCHEMBL3986767 0.58
SCHEMBL1156928 0.55
SCHEMBL13555402 0.55
Hydrogen Sulfide SCHEMBL7784683 0.55
SCHEMBL11721048 0.50
Formaldoxime SCHEMBL7264705 0.50
SCHEMBL7624445 0.50
SCHEMBL10793299 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1814391-B1 MOLD-RESISTANT CONSTRUCTION MATERIALS HENKEL AG & CO KGAA (DE) 2016-08-03 EP claimed
JP-10008020-A None JP disclosed
CN-114651032-A High temperature resistant two-component silicone adhesive 汉高股份有限及两合公司 2022-06-21 CN disclosed
US-20150322318-A1 FUNGICIDE SILICON SEALING COMPOUND LANXESS DEUTSCHLAND GMBH (DE) 2015-11-12 US disclosed
US-8821908-B2 Mold-resistant construction materials HENKEL AG & CO. KGAA (DE) 2014-09-02 US disclosed
US-20070224250-A1 MOLD-RESISTANT CONSTRUCTION MATERIALS HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) (DE) 2007-09-27 US disclosed
JP-H108020-A HYDROXYIMINOSILICON-MODIFIED SILICONE SEALANT COMPOSITION DOW CORNING CORP 1998-01-13 JP disclosed