SCHEMBL562401

SCHEMBL562401

CC(CN)CCON

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL8752911 0.97 ODC1 (0.33)
SCHEMBL10090676 0.85 ADRB2 (0.38)
SCHEMBL12360630 0.78
SCHEMBL20207347 0.78
SCHEMBL1508185 0.78
SCHEMBL20207458 0.78
SCHEMBL23126862 0.76 ALDH1A1 (0.32)
SCHEMBL14091426 0.76 ADRB2 (0.32)
Hydrochloric Acid SCHEMBL4655483 0.76
SCHEMBL65860 0.75 ALDH1A1 (0.47)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120031846-A1 METHOD FOR COLLECTING OIL WITH MODIFIED CLAY NATIONAL TAIWAN UNIVERSITY (TW) 2012-02-09 US claimed
EP-1301572-B1 AN ARTICLE HAVING A CHIP-RESISTANT ELECTRODEPOSITED COATING AND A PROCESS FOR FORMING AN ELECTRODEPOSITED COATING PPG IND OHIO INC (US) 2005-09-07 EP claimed
EP-1082394-B1 A PROCESS FOR FORMING A TWO-COAT ELECTRODEPOSITED COMPOSITE COATING, THE COMPOSITE COATING AND CHIP RESISTANT ELECTRODEPOSITED COATING COMPOSITION PPG IND OHIO INC (US) 2004-09-15 EP claimed
EP-1301572-A2 AN ARTICLE HAVING A CHIP-RESISTANT ELECTRODEPOSITED COATING AND A PROCESS FOR FORMING AN ELECTRODEPOSITED COATING PPG Industries Ohio, Inc. (US) 2003-04-16 EP claimed
US-6423425-B1 CURABLE ELASTOMER COMPRISING POLY(UREA)URETHANE POLYMER OR COPOLYMER WITH POLYESTER OR POLYETHER COATING ON SURFACE OF CORROSION RESISTANT ELECTROCONDUCTIVE SUBSTRATE PPG INDUSTRIES OHIO, INC. 2002-07-23 US claimed
EP-0918829-B1 WIRE ENAMELS CONTAINING POLYESTER IMIDES AND/OR POLYAMIDE IMIDES WITH POLYOXYALKYLENE DIAMINES AS MOLECULAR ELEMENTS SCHENECTADY INT INC (US) 2002-03-27 EP claimed
WO-2002004710-A2 AN ARTICLE HAVING A CHIP-RESISTANT ELECTRODEPOSITED COATING AND A PROCESS FOR FORMING AN ELECTRODEPOSITED COATING PPG INDUSTRIES OHIO, INC. (US) 2002-01-17 WO claimed
US-6316046-B1 COATING COPPER WIRES, ESPECIALLY THICK ROUND WIRES OR PROFILED WIRES. SCHENECTADY INTERNATIONAL 2001-11-13 US claimed
US-5610195-A ANTITUMOR AGENTS CIBA-GEIGY CORPORATION (US) 1997-03-11 US claimed
EP-0644873-A1 ORNITHINE DECARBOXYLASE INHIBITING BRANCHED AMINOOXY AMINO ALKANE DERIVATIVES. CIBA GEIGY AG (CH) 1995-03-29 EP claimed
WO-1994024094-A1 ORNITHINE DECARBOXYLASE INHIBITING BRANCHED AMINOOXY AMINO ALKANE DERIVATIVES CIBA-GEIGY AG (CH) 1994-10-27 WO claimed
JP-1316368-A None JP disclosed
US-8647513-B2 Method for collecting oil with modified clay NATIONAL TAIWAN UNIVERSITY (TW) 2014-02-11 US disclosed
US-20120031846-A1 METHOD FOR COLLECTING OIL WITH MODIFIED CLAY NATIONAL TAIWAN UNIVERSITY (TW) 2012-02-09 US disclosed
EP-1301572-B1 AN ARTICLE HAVING A CHIP-RESISTANT ELECTRODEPOSITED COATING AND A PROCESS FOR FORMING AN ELECTRODEPOSITED COATING PPG IND OHIO INC (US) 2005-09-07 EP disclosed
WO-1998006790-A1 WIRE ENAMELS CONTAINING POLYESTER IMIDES AND/OR POLYAMIDE IMIDES WITH POLYOXYALKYLENE DIAMINES AS MOLECULAR ELEMENTS SCHENECTADY INTERNATIONAL, INC. (US) 1998-02-19 WO disclosed
WO-1998006790-A1 WIRE ENAMELS CONTAINING POLYESTER IMIDES AND/OR POLYAMIDE IMIDES WITH POLYOXYALKYLENE DIAMINES AS MOLECULAR ELEMENTS SCHENECTADY INTERNATIONAL, INC. (US) 1998-02-19 WO disclosed
US-5391826-A Amidating glutamic acid with a primary diamine or triamine ethers or polyethers HUNTSMAN CORPORATION (US) 1995-02-21 US disclosed
US-4891423-A STERILIZATION OF CONTACT LENSES STOCKEL RICHARD F (US) 1990-01-02 US disclosed
JP-H01316368-A MELAMINE/DIAMINE CONDENSATES AND CURING OF 1,2-EPOXY RESIN WITH THE SAME TEXACO DEV CORP 1989-12-21 JP disclosed