SCHEMBL5633769

SCHEMBL5633769

c1cc(COc2ccc(OCC3CO3)cc2)cc(COc2ccc(OCC3CO3)cc2)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.64
TP53 P04637 3/20 0.64
TSHR P16473 3/20 0.64
HIF1A Q16665 2/20 0.64
CYP3A4 P08684 1/20 0.64
SMN1; SMN2 Q16637 1/20 0.64
TDP1 Q9NUW8 1/20 0.61
MAPT P10636 2/20 0.53
HPGD P15428 2/20 0.53
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
PKM P14618 2/20 0.53
CYP1A2 P05177 1/20 0.53
PPARG P37231 1/20 0.53
LMNA P02545 1/20 0.53
GAA P10253 1/20 0.53
F2 P00734 2/20 0.47
PTPRC P08575 1/20 0.46
PTPN1 P18031 1/20 0.46
MAOB P27338 7/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5633641 0.95 ALDH1A1 (0.58) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL5633310 0.92 ALDH1A1 (0.63) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL3287709 0.88 TDP1 (0.73) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL1228699 0.88 TDP1 (0.73) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL1351514 0.88 TDP1 (0.73) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL7693412 0.87 TDP1 (0.71) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL5634061 0.86 TDP1 (0.63) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL7693411 0.85 TDP1 (0.69) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL19828241 0.85 ALDH1A1 (0.62) ALDH1A1TP53TSHRHIF1ACYP3A4
SCHEMBL7999229 0.84 ALDH1A1 (0.75) ALDH1A1TP53TSHRHIF1ACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed