SCHEMBL5634014

SCHEMBL5634014

c1cc(COc2ccc(-c3ccc(OCCCCC4CO4)cc3)cc2)cc(COc2ccc(-c3ccc(OCCCCC4CO4)cc3)cc2)c1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
F2 P00734 2/20 0.40
MRGPRX4 Q96LA9 1/20 0.40
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
PTPRC P08575 1/20 0.40
PTPN1 P18031 1/20 0.40
HDAC3 O15379 1/20 0.39
HDAC4 P56524 1/20 0.39
HDAC1 Q13547 1/20 0.39
HDAC7 Q8WUI4 1/20 0.39
HDAC2 Q92769 1/20 0.39
HDAC10 Q969S8 1/20 0.39
HDAC11 Q96DB2 1/20 0.39
HDAC8 Q9BY41 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
HDAC9 Q9UKV0 1/20 0.39
HDAC5 Q9UQL6 1/20 0.39
ALDH1A1 P00352 1/20 0.39
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5634063 0.89 GSTP1 (0.40) MEN1KMT2AHDAC3HDAC4HDAC1
SCHEMBL2833284 0.85 HRH3 (0.44) MEN1KMT2AHDAC3HDAC4HDAC1
SCHEMBL2718081 0.85 HRH3 (0.44) MEN1KMT2AHDAC3HDAC4HDAC1
SCHEMBL8541225 0.85 MGLL (0.50) MEN1KMT2AHDAC6ALDH1A1SMN1; SMN2
SCHEMBL2718715 0.84 HRH3 (0.42) MEN1KMT2AHDAC3HDAC4HDAC1
SCHEMBL2720688 0.84 HRH3 (0.42) MEN1KMT2AHDAC3HDAC4HDAC1
SCHEMBL2720901 0.84 HRH3 (0.42) MEN1KMT2AHDAC3HDAC4HDAC1
SCHEMBL5633641 0.83 ALDH1A1 (0.58) F2MEN1KMT2APTPRCPTPN1
SCHEMBL2906327 0.82 FFAR4 (0.47) MEN1KMT2AALDH1A1TP53CYP3A4
SCHEMBL27670580 0.81 NR5A1 (0.47) HDAC3HDAC4HDAC1HDAC7HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed