SCHEMBL56435

SCHEMBL56435

Cc1cc2c(cc1C)C(=O)c1ccccc1C2=O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 2/20 0.67
KMT2A Q03164 4/20 0.63
MEN1 O00255 3/20 0.63
CDC25B P30305 2/20 0.63
BCL2 P10415 1/20 0.58
MCL1 Q07820 1/20 0.58
SMN1; SMN2 Q16637 7/20 0.54
NPC1 O15118 6/20 0.54
RAB9A P51151 6/20 0.54
ALDH1A1 P00352 5/20 0.54
MAPK1 P28482 4/20 0.54
CYP3A4 P08684 2/20 0.54
TSHR P16473 2/20 0.54
TP53 P04637 1/20 0.54
TDP1 Q9NUW8 1/20 0.54
MAPT P10636 4/20 0.54
L3MBTL1 Q9Y468 3/20 0.54
LMNA P02545 3/20 0.54
PLA2G1B P04054 2/20 0.54
ATG4B Q9Y4P1 2/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9269288 0.95 ELANE (0.61) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL27277502 0.89 ALDH1A1 (0.61) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL3420118 0.86 NQO1 (0.50) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL9429592 0.85 ELANE (0.50) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL6051235 0.84 BCL2 (0.72) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL1132044 0.84 ELANE (0.55) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL9175638 0.84 ELANE (0.55) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL22351866 0.84 ELANE (0.55) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL8770711 0.84 ALDH1A1 (0.55) ELANEKMT2AMEN1CDC25BBCL2
SCHEMBL29587496 0.84 ELANE (0.55) ELANEKMT2AMEN1CDC25BBCL2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2046 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate HANGZHOU FIRST ELECTRONIC MATERIAL CO., LTD (CN) 2025-07-24 US claimed
CN-119165729-A Photosensitive resist ink and preparation method of metal grid line 杭州福斯特电子材料有限公司 2024-12-20 CN claimed
CN-118871861-A Dry film resist, photosensitive dry film and copper-clad plate 杭州福斯特电子材料有限公司 2024-10-29 CN claimed
CN-113341647-B Dry film resist composition and dry film resist laminate 杭州福斯特电子材料有限公司 2024-05-28 CN claimed
CN-117687268-B Photosensitive resin composition, photosensitive dry film and copper-clad plate 湖南初源新材料股份有限公司 2024-04-19 CN claimed
CN-117687268-A Photosensitive resin composition, photosensitive dry film and copper-clad plate 湖南初源新材料股份有限公司 2024-03-12 CN claimed
WO-2023185530-A1 DRY FILM RESIST, PHOTOSENSITIVE DRY FILM, AND COPPER CLAD LAMINATE 杭州福斯特电子材料有限公司 2023-10-05 WO claimed
CN-111867970-B Method for producing aqueous hydrogen peroxide solution 索尔维公司 2023-08-25 CN claimed
EP-3768636-B1 PROCESS FOR MANUFACTURING AN AQUEOUS HYDROGEN PEROXIDE SOLUTION SOLVAY (BE) 2023-06-14 EP claimed
CN-116184763-A Photocurable resin composition and application thereof 杭州福斯特电子材料有限公司 2023-05-30 CN claimed
CN-101442137-A Cylinderical lithium rechargeable battery SAMSUNG SDI CO LTD (KR) 2009-05-27 CN claimed
US-20060275666-A1 an electrode assembly whose top and bottom ends are blocked by a heat sensitive composition to reduce the void volume inside a bare cell during initial overcharge; preventing exploding and ignition; batteries have improved heat resistance SANSUMG SDI CO., LTD (KR) 2006-12-07 US claimed
CN-1858931-A Lithium rechargeable battery SAMSUNG SDI CO LTD (KR) 2006-11-08 CN claimed
US-6673257-B1 BLENDS EMPLOYING AT LEAST TWO ORGANIC COMPOUNDS HAVING KNOWN MELT TEMPERATURES, EXHIBIT IMPROVED THERMAL PROPERTIES AND PERFORMANCE CHARACTERISTICS THERM-O-DISC, INCORPORATED 2004-01-06 US claimed
US-6521767-B1 Fittings having openings or channels which have a particular hydraulic diameter, preferably from 1 to 3 mm. BASF AKTIENGESELLSCHAFT (DE) 2003-02-18 US claimed
US-6441124-B1 POLYIMINES DERIVED FROM THE REACTION OF A SUBSTITUTED OR UNSUBSTITUTED ANTHRAQUINONE WITH A DIAMINOANTHRACENE; USE IN ELECTROMAGNETIC SHIELDING, AND ANTISTATIC APPLICATIONS NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2002-08-27 US claimed
US-5723675-A DIELS-ALDER REACTION OF 1,4-NAPHTHOQUINONE, 1,4-BENZOQUINONE WITH 1,3-BUTADIENE AND DEHYDROGENATION WITH LEWIS ACID OR BRONSTED ACID AS OXIDATIVE CATALYST KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 1998-03-03 US claimed
US-5662878-A HYDROGENATION OF ANTHRAQUINONE SOLUTION, MIXING OXYGEN FOR OXIDATION AND FORMING PEROXIDE UNIVERSITY OF CHICAGO (US) 1997-09-02 US claimed
US-4562142-A PRINTED CIRCUITS HITACHI CHEMICAL COMPANY, LTD. (JP) 1985-12-31 US claimed
EP-0010451-A1 Process for the delignification of lignocellulosic material and products thereof C.I.L. Inc. (CA) 1980-04-30 EP claimed