Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 5/20 | 0.81 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.81 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.81 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.52 |
| ▸ | TP53 | P04637 | 1/20 | 0.52 |
| ▸ | MEN1 | O00255 | 3/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.48 |
| ▸ | GAA | P10253 | 2/20 | 0.48 |
| ▸ | MAPT | P10636 | 2/20 | 0.48 |
| ▸ | USP2 | O75604 | 1/20 | 0.48 |
| ▸ | LMNA | P02545 | 1/20 | 0.48 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.48 |
| ▸ | HPGD | P15428 | 1/20 | 0.48 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.48 |
| ▸ | HTT | P42858 | 1/20 | 0.48 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.47 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | RAB9A | P51151 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzidine SCHEMBL4442914 | 1.00 | CYP3A4 (0.81) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| Benzidine SCHEMBL6430439 | 1.00 | CYP3A4 (0.81) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| SCHEMBL30313807 | 0.93 | ALOX15 (0.94) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| SCHEMBL20945278 | 0.93 | ALOX15 (0.94) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| SCHEMBL23924225 | 0.90 | CYP3A4 (1.00) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| SCHEMBL29365557 | 0.90 | CYP3A4 (1.00) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| SCHEMBL29549758 | 0.90 | CYP3A4 (1.00) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| SCHEMBL105866 | 0.90 | CYP3A4 (1.00) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| Water SCHEMBL7721550 | 0.87 | CYP3A4 (0.94) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 | |
| Ammonia Solution, Strong SCHEMBL6653834 | 0.87 | CYP3A4 (0.94) | CYP3A4HSD17B10ALOX15ALDH1A1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119613718-A | Polyamide acid salt, negative photosensitive polyimide, preparation method of negative photosensitive polyimide and electronic product | 香港中文大学（深圳） | 2025-03-14 | — | — | CN | claimed |
| CN-114805805-A | Polyimide with high bonding strength and preparation method and application thereof | 中国科学院深圳先进技术研究院 | 2022-07-29 | — | — | CN | claimed |
| US-20120305484-A1 | Thermally Rearranged (TR) Polymers as Membranes for Ethanol Dehydration | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) | 2012-12-06 | — | — | US | claimed |
| WO-2012166153-A1 | THERMALLY REARRANGED (TR) POLYMERS AS MEMBRANES FOR ETHANOL DEHYDRATION | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMS (US) | 2012-12-06 | — | — | WO | claimed |
| CN-119613718-A | Polyamide acid salt, negative photosensitive polyimide, preparation method of negative photosensitive polyimide and electronic product | 香港中文大学（深圳） | 2025-03-14 | — | — | CN | disclosed |
| CN-114902135-B | Positive photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2024-07-02 | — | — | CN | disclosed |
| US-20230260787-A1 | COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-17 | — | — | US | disclosed |
| WO-2023005263-A1 | RESIN COMPOSITION, RESIN FILM, AND DISPLAY DEVICE | 吉林奥来德光电材料股份有限公司 | 2023-02-02 | — | — | WO | disclosed |
| EP-3570329-B1 | DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD (KR) | 2022-12-14 | — | — | EP | disclosed |
| CN-114902135-A | Positive photosensitive resin composition, cured film and resist film | DIC株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114805805-A | Polyimide with high bonding strength and preparation method and application thereof | 中国科学院深圳先进技术研究院 | 2022-07-29 | — | — | CN | disclosed |
| WO-2021131746-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND RESIST FILM | DIC株式会社 | 2021-07-01 | — | — | WO | disclosed |
| US-6194126-B1 | Pattern-forming process using photosensitive resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 2001-02-27 | — | — | US | disclosed |
| US-5856059-A | POLYIMIDESILOXANE COPOLYMER | HITACHI CHEMICAL CO., LTD. (JP) | 1999-01-05 | — | — | US | disclosed |
| EP-0642057-B1 | Photosensitive resin composition | HITACHI CHEMICAL CO LTD (JP) | 1998-11-25 | — | — | EP | disclosed |
| EP-0622682-B1 | Photosensitive resin composition | HITACHI CHEMICAL CO LTD (JP) | 1998-03-04 | — | — | EP | disclosed |
| EP-0431971-B1 | Photosensitive composition and resin-encapsulated semiconductor device | TOSHIBA KK (JP) | 1995-07-19 | — | — | EP | disclosed |
| EP-0642057-A1 | Photosensitive resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 1995-03-08 | — | — | EP | disclosed |
| EP-0622682-A1 | Photosensitive resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 1994-11-02 | — | — | EP | disclosed |
| EP-0431971-A2 | Photosensitive composition and resin-encapsulated semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 1991-06-12 | — | — | EP | disclosed |