Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A6 | Q4U2R8 | 2/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4104006 | 0.77 | SLC22A6 (0.43) | SLC22A6 | |
| SCHEMBL16174829 | 0.75 | SLC22A6 (0.42) | SLC22A6 | |
| SCHEMBL16174873 | 0.75 | SLC22A6 (0.42) | SLC22A6 | |
| SCHEMBL3156105 | 0.73 | SLC22A6 (0.54) | SLC22A6 | |
| SCHEMBL1728417 | 0.70 | SLC22A6 (0.34) | SLC22A6 | |
| SCHEMBL6629801 | 0.70 | SLC22A6 (0.39) | SLC22A6 | |
| SCHEMBL8995512 | 0.70 | SLC22A6 (0.44) | SLC22A6 | |
| SCHEMBL6943906 | 0.69 | GABBR2 (0.38) | SLC22A6 | |
| SCHEMBL6943900 | 0.69 | SLC22A6 (0.37) | SLC22A6 | |
| SCHEMBL16110818 | 0.69 | SLC22A6 (0.37) | SLC22A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 446 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024131535-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| WO-2024131536-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| CN-112725850-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-07 | — | — | CN | claimed |
| CN-112795960-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-03-31 | — | — | CN | claimed |
| CN-112760683-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-03-28 | — | — | CN | claimed |
| EP-2586893-B1 | COPPER PLATING BATH AND CORRESPONDING METHOD | ROHM & HAAS ELECT MAT (US) | 2022-09-21 | — | — | EP | claimed |
| EP-2855738-B1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MACDERMID ACUMEN INC (US) | 2022-07-06 | — | — | EP | claimed |
| CN-112795960-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-14 | — | — | CN | claimed |
| CN-112760683-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-07 | — | — | CN | claimed |
| CN-112746292-A | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2021-05-04 | — | — | CN | claimed |
| EP-1308540-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-05-07 | — | — | EP | claimed |
| EP-1308541-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Company LLC (US) | 2003-05-07 | — | — | EP | claimed |
| US-20030070934-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-17 | — | — | US | claimed |
| US-20030066756-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-10 | — | — | US | claimed |
| EP-1300486-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300488-A2 | Plating path and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| EP-1300487-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-04-09 | — | — | EP | claimed |
| US-5252196-A | Containing specified concentrations of brighteners and leveling agents; irregular topography | SHIPLEY COMPANY INC. (US) | 1993-10-12 | — | — | US | claimed |
| US-5051154-A | Copper salt, an electrolyte and an organic additive for modification of the charge transfer overpotential | SHIPLEY COMPANY INC. (US) | 1991-09-24 | — | — | US | claimed |
| EP-0440027-A2 | Additive for acid-copper electroplating baths to increase throwing power | SHIPLEY COMPANY INC. (US) | 1991-08-07 | — | — | EP | claimed |