Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A6 | Q4U2R8 | 2/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1728414 | 0.77 | SLC22A6 (0.41) | SLC22A6 | |
| SCHEMBL564907 | 0.70 | SLC22A6 (0.42) | SLC22A6 | |
| SCHEMBL2928808 | 0.65 | — | — | |
| SCHEMBL6770557 | 0.64 | — | — | |
| SCHEMBL4555726 | 0.63 | — | — | |
| SCHEMBL4757103 | 0.63 | TP53 (0.40) | SLC22A6 | |
| SCHEMBL564906 | 0.61 | SLC22A6 (0.30) | SLC22A6 | |
| SCHEMBL5158836 | 0.61 | LMNA (0.38) | SLC22A6 | |
| SCHEMBL2256603 | 0.61 | SLC22A6 (0.32) | SLC22A6 | |
| SCHEMBL143527 | 0.61 | TP53 (0.32) | SLC22A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 202 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024131535-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| CN-112725850-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-07 | — | — | CN | claimed |
| CN-112795960-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-03-31 | — | — | CN | claimed |
| CN-112760683-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-03-28 | — | — | CN | claimed |
| EP-2586893-B1 | COPPER PLATING BATH AND CORRESPONDING METHOD | ROHM & HAAS ELECT MAT (US) | 2022-09-21 | — | — | EP | claimed |
| US-20210062353-A1 | LEVELING AGENT AND COPPER PLATING COMPOSITION COMPRISING THE SAME | SOULBRAIN CO., LTD. (KR) | 2021-03-04 | — | — | US | claimed |
| CN-111876799-A | Hole metallization composition suitable for back plate and hole metallization method thereof | 广东硕成科技有限公司 | 2020-11-03 | — | — | CN | claimed |
| EP-3359709-B1 | COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND POLYACRYLAMIDES | ROHM & HAAS ELECT MAT (US) | 2020-07-29 | — | — | EP | claimed |
| EP-3359552-B1 | COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND SULTONES | ROHM & HAAS ELECT MAT (US) | 2020-04-01 | — | — | EP | claimed |
| EP-3359550-B1 | COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND QUINONES | ROHM & HAAS ELECT MAT (US) | 2020-02-12 | — | — | EP | claimed |
| EP-3359551-B1 | COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND BISEPOXIDES | ROHM & HAAS ELECT MAT (US) | 2019-11-20 | — | — | EP | claimed |
| EP-2562294-B1 | PLATING BATH AND METHOD | ROHM & HAAS ELECT MAT (US) | 2019-09-25 | — | — | EP | claimed |
| US-20190161877-A1 | LEVELING AGENT AND COPPER PLATING COMPOSITION COMPRISING THE SAME | SOULBRAIN CO., LTD. (KR) | 2019-05-30 | — | — | US | claimed |
| EP-3036224-B1 | POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS | ROHM & HAAS ELECT MAT (US) | 2019-04-17 | — | — | EP | claimed |
| US-12398479-B2 | Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2025-08-26 | — | — | US | disclosed |
| CN-118241266-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-118241267-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | disclosed |
| EP-1477588-A1 | Copper Electroplating composition for wafers | Rohm and Haas Electronic Materials, L.L.C. (US) | 2004-11-17 | — | — | EP | disclosed |
| US-20040222104-A1 | Electroplating composition | ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C | 2004-11-11 | — | — | US | disclosed |
| EP-1371757-A1 | Leveler compound for copper plating baths | Shipley Co. L.L.C. (US) | 2003-12-17 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20190161877-A1 | LEVELING AGENT AND COPPER PLATING COMPOSITION COMPRISING THE SAME | TET2, DPM1, SUCLG1 | SLC22A6 880/4885 |
| US-20210062353-A1 | LEVELING AGENT AND COPPER PLATING COMPOSITION COMPRISING THE SAME | TPMT, TTC14, NACA | SLC22A6 678/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.