Paraben

Paraben

SCHEMBL565120

O=C(O)c1ccc(O)cc1.Oc1cccc(O)c1

nearest known ligand 0.73

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 4/20 0.73
CA2 P00918 4/20 0.73
CA9 Q16790 4/20 0.73
CA1 P00915 3/20 0.73
CA14 Q9ULX7 3/20 0.73
CA6 P23280 2/20 0.73
CA5A P35218 2/20 0.73
CA5B Q9Y2D0 2/20 0.73
CA7 P43166 2/20 0.73
CA3 P07451 1/20 0.73
TYR P14679 1/20 0.73
DRD1 P21728 1/20 0.73
CA4 P22748 1/20 0.73
SRD5A2 P31213 2/20 0.64
TSHR P16473 2/20 0.55
ALDH1A1 P00352 1/20 0.55
LMNA P02545 1/20 0.55
CYP3A4 P08684 1/20 0.55
HSD17B10 Q99714 1/20 0.55
TP53 P04637 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Terephthalic Acid SCHEMBL27164912 0.95 CA12 (0.74) CA12CA2CA9CA1CA14
Terephthalic Acid SCHEMBL4640732 0.95 CA12 (0.74) CA12CA2CA9CA1CA14
Paraben SCHEMBL9489073 0.91 CA12 (0.83) CA12CA2CA9CA1CA14
Terephthalic Acid SCHEMBL28483540 0.89 CA12 (0.79) CA12CA2CA9CA1CA14
Terephthalic Acid SCHEMBL28651640 0.89 CA12 (0.79) CA12CA2CA9CA1CA14
Terephthalic Acid SCHEMBL904446 0.89 CA12 (0.79) CA12CA2CA9CA1CA14
Benzoic Acid SCHEMBL5974437 0.88 CA12 (0.78) CA12CA2CA9CA1CA14
Benzoic Acid SCHEMBL124054 0.88 CA12 (0.78) CA12CA2CA9CA1CA14
Paraben SCHEMBL9796837 0.88 CA12 (0.84) CA12CA2CA9CA1CA14
Paraben SCHEMBL10457334 0.88 CA12 (0.84) CA12CA2CA9CA1CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1300488-B1 Plating path and method for depositing a metal layer on a substrate ROHM & HAAS ELECT MAT (US) 2017-09-27 EP claimed
US-20050139118-A1 Brightener degradation inhibitor compound in copper plating bath SHIPLEY COMPANY, L.L.C. (US) 2005-06-30 US claimed
US-6911068-B2 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. (US) 2005-06-28 US claimed
US-20040206631-A1 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. 2004-10-21 US claimed
EP-1300488-A2 Plating path and method for depositing a metal layer on a substrate Shipley Co. L.L.C. (US) 2003-04-09 EP claimed
EP-1300488-B1 Plating path and method for depositing a metal layer on a substrate ROHM & HAAS ELECT MAT (US) 2017-09-27 EP disclosed
US-8956523-B2 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2015-02-17 US disclosed
US-20140081045-A1 METAL PLATING COMPOSITIONS AND METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-03-20 US disclosed
EP-1978134-B1 Metal plating compositions ROHM & HAAS ELECT MAT (US) 2013-09-11 EP disclosed
US-8337688-B2 Metal plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-12-25 US disclosed
US-8329018-B2 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-12-11 US disclosed
EP-1978051-B1 Metal plating compositions and methods ROHM & HAAS ELECT MAT (US) 2012-02-22 EP disclosed
US-20080269395-A1 Metal plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-10-30 US disclosed
US-20080268138-A1 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-10-30 US disclosed
EP-1978051-A1 Metal plating compositions and methods Rohm and Haas Electronic Materials, L.L.C. (US) 2008-10-08 EP disclosed
EP-1978134-A1 Metal plating compositions Rohm and Haas Electronic Materials LLC (US) 2008-10-08 EP disclosed
US-20050139118-A1 Brightener degradation inhibitor compound in copper plating bath SHIPLEY COMPANY, L.L.C. (US) 2005-06-30 US disclosed
US-6911068-B2 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. (US) 2005-06-28 US disclosed
US-20040206631-A1 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. 2004-10-21 US disclosed
EP-1300488-A2 Plating path and method for depositing a metal layer on a substrate Shipley Co. L.L.C. (US) 2003-04-09 EP disclosed