SCHEMBL56973

SCHEMBL56973

C=C(C)C(=O)OCCn1c(=O)n(CCO)c(=O)n(CCO)c1=O

nearest known ligand 0.43

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.43
TSHR P16473 3/20 0.42
ALDH1A1 P00352 3/20 0.39
POLB P06746 2/20 0.36
APEX1 P27695 1/20 0.36
HTT P42858 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
GAA P10253 2/20 0.34
CA1 P00915 2/20 0.33
CA2 P00918 2/20 0.33
NPSR1 Q6W5P4 1/20 0.33
ADORA2B P29275 1/20 0.33
KDM4E B2RXH2 1/20 0.32
KMT2A Q03164 1/20 0.31
PDE4A P27815 1/20 0.30
PDE4B Q07343 1/20 0.30
PDE4C Q08493 1/20 0.30
PDE4D Q08499 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL248011 1.00 THRB (0.43) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL150780 0.93 THRB (0.48) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL486580 0.90 APEX1 (0.41) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL474744 0.89 TSHR (0.44) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL21657670 0.87 THRB (0.43) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL16009520 0.87 THRB (0.43) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL12281468 0.85 TSHR (0.44) THRBTSHRALDH1A1TDP1CA1
SCHEMBL23004645 0.84 TSHR (0.43) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL3249618 0.84 TSHR (0.47) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL5610090 0.84 TSHR (0.47) THRBTSHRALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1996 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240198582-A1 HYBRID RESIN COMPOSITION FOR THE 3D-PRINTING OF OBJECTS CUBICURE GMBH (AT) 2024-06-20 US claimed
WO-2023237595-A1 COMPOSITION BASED ON A POLYMERIZABLE COMPONENT AND A THIXOTROPIC ADDITIVE ARKEMA FRANCE (FR) 2023-12-14 WO claimed
US-11597139-B2 Solid freeform fabrication object, method of manufacturing solid freeform fabrication object, liquid set for solid freeform fabrication, and device for manufacturing solid freeform fabrication object RICOH COMPANY, LTD. (JP) 2023-03-07 US claimed
US-20230006135-A1 COMPOSITION FOR ENCAPSULATING ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE DISPLAY COMPRISING ORGANIC LAYER FORMED USING THE SAME SAMSUNG SDI CO., LTD. (KR) 2023-01-05 US claimed
US-20220040914-A1 FUNCTIONALIZED PRODUCT FABRICATED FROM A RESIN COMPRISING A FUNCTIONAL COMPONENT AND A POLYMERIC RESIN, AND METHOD OF MAKING THE SAME NATIONAL RESEARCH COUNCIL OF CANADA (CA) 2022-02-10 US claimed
EP-2540515-B1 INK COMPOSITION FOR CLEAR LAYER FORMATION, COATING METHOD FOR SAME, AND PRINTED ARTICLE USING SAME MAXELL HOLDINGS LTD (JP) 2020-06-17 EP claimed
US-20200157420-A1 COMPOSITION FOR FORMING A QUANTUM DOT LAYER, QUANTUM DOT FILM, BACKLIGHT UNIT, AND LIQUID CRYSTAL DISPLAY SHIN-A T&C (KR) 2020-05-21 US claimed
WO-2020079669-A1 FUNCTIONALIZED PRODUCT FABRICATED FROM A RESIN COMPRISING A FUNCTIONAL COMPONENT AND A POLYMERIC RESIN, AND METHOD OF MAKING THE SAME NATIONAL RESEARCH COUNCIL OF CANADA (CA) 2020-04-23 WO claimed
EP-2153699-B1 ORGANIC ELECTRONIC DEVICES PROTECTED BY ELASTOMERIC LAMINATING ADHESIVE HENKEL AG & CO KGAA (DE) 2016-07-13 EP claimed
US-20160062016-A1 POLARIZING PLATE, COMPOSITION FOR PROTECTIVE LAYERS OF A POLARIZING PLATE, AND OPTICAL DISPLAY INCLUDING THE SAME Wuxi Hengxin Optoelectronic Materials Co., Ltd. (CN) 2016-03-03 US claimed
WO-1997047679-A1 OPEN CELL POLYMERIC FOAM FILTERING MEDIA PETRELLI RESEARCH, INC. (US) 1997-12-18 WO claimed
EP-0362735-B1 Unsaturated group-containing polycarboxylic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof NIPPON KAYAKU KK (JP) 1995-11-22 EP claimed
EP-0346486-B1 RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION NIPPON KAYAKU KK (JP) 1995-10-25 EP claimed
EP-0281365-B1 CURABLE COMPOSITIONS NIPPON OIL CO. LTD. (JP) 1993-06-02 EP claimed
US-5049628-A Unsaturated group-containing polycarboxlic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1991-09-17 US claimed
EP-0362735-A2 Unsaturated group-containing polycarboxylic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1990-04-11 EP claimed
US-4911864-A Mixture of (meth)acryloyl group and electroconductive particles NIPPON OIL CO., LTD. (JP) 1990-03-27 US claimed
EP-0346486-A1 RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1989-12-20 EP claimed
EP-0281365-A2 Curable compositions NIPPON OIL CO. LTD. (JP) 1988-09-07 EP claimed
US-4690987-A Activation energy-curable resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-09-01 US claimed