SCHEMBL5707376

SCHEMBL5707376

C=COCOc1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNA3 P22001 1/20 0.46
AOC3 Q16853 1/20 0.45
THRB P10828 1/20 0.43
TAAR1 Q96RJ0 1/20 0.41
ALDH1A1 P00352 1/20 0.41
RECQL P46063 1/20 0.41
ALOX15 P16050 1/20 0.40
LTA4H P09960 1/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
KDM4E B2RXH2 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
HTR1B P28222 2/20 0.38
HDAC3 O15379 1/20 0.38
HDAC4 P56524 1/20 0.38
HDAC1 Q13547 1/20 0.38
HDAC7 Q8WUI4 1/20 0.38
HDAC2 Q92769 1/20 0.38
HDAC10 Q969S8 1/20 0.38
HDAC11 Q96DB2 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7180242 0.88 NQO1 (0.38) AOC3THRBALDH1A1ALOX15SMN1; SMN2
SCHEMBL13337843 0.83 AOC3 (0.33) KCNA3AOC3THRBLTA4HSMN1; SMN2
SCHEMBL1127589 0.80 KCNA3 (0.56) KCNA3AOC3THRBTAAR1ALDH1A1
SCHEMBL6008158 0.80
SCHEMBL3954299 0.79 KDM4E (0.38) ALDH1A1SMN1; SMN2KDM4EMEN1KMT2A
SCHEMBL8373718 0.78 CHRNA7 (0.47) ALDH1A1ALOX15KDM4EMEN1KMT2A
SCHEMBL2468780 0.78 KCNA3 (0.60) KCNA3AOC3THRBTAAR1ALDH1A1
SCHEMBL2503254 0.77 KCNA3 (0.46) KCNA3AOC3THRBTAAR1ALDH1A1
SCHEMBL497461 0.77 KCNA3 (0.63) KCNA3TAAR1ALDH1A1RECQLALOX15
SCHEMBL9353618 0.77 KCNA3 (0.64) KCNA3THRBTAAR1ALDH1A1RECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105246940-B Optical semiconductor sealing solidification compound 株式会社大赛璐 2018-09-04 CN disclosed
US-9685597-B2 Curable composition for sealing optical semiconductor DAICEL CORPORATION (JP) 2017-06-20 US disclosed
US-20160126431-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR DAICEL CORPORATION (JP) 2016-05-05 US disclosed
EP-3006481-A1 CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR Daicel Corporation (JP) 2016-04-13 EP disclosed
CN-105246940-A Curable composition for sealing optical semiconductor DAICEL CORP 2016-01-13 CN disclosed
EP-1403710-B1 Polymerizable composition FUJIFILM CORP (JP) 2015-06-10 EP disclosed
EP-1287985-B1 Lithographic printing plate precursor FUJI PHOTO FILM CO LTD (JP) 2006-10-11 EP disclosed
US-20030138721-A1 For recording images by infrared scanning exposure based on digital signals; improved on-machine development quality, photosensitivity, and high printing durability FUJIFILM CORPORATION (JP) 2003-07-24 US disclosed
EP-1287985-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2003-03-05 EP disclosed