SCHEMBL5714010

SCHEMBL5714010

CC(C)C(C)(C)O[Si](O)(O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9705098 0.69
SCHEMBL232182 0.67
SCHEMBL6659883 0.67
SCHEMBL9664191 0.67
SCHEMBL28259887 0.64
SCHEMBL96706 0.63 TSHR (0.33)
SCHEMBL263071 0.63
SCHEMBL15603194 0.63
SCHEMBL6179113 0.63 ALDH1A1 (0.32)
SCHEMBL2426801 0.61 ALDH1A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6936537-B2 Methods for forming low-k dielectric films THE BOC GROUP, INC. (US) 2005-08-30 US claimed
EP-1271634-A2 Methods for forming low-K dielectric films THE BOC GROUP, INC. (US) 2003-01-02 EP claimed
US-20020192980-A1 Methods for forming low-k dielectric films BOC GROUP, INC., THE 2002-12-19 US claimed
CN-118662665-A Preparation and application of CT/MR dual-function imaging nano drug-carrying material 中国科学院宁波材料技术与工程研究所 2024-09-20 CN disclosed
CN-113528005-A Nano high-temperature-resistant self-cleaning transparent coating 上海涂尊新材料科技有限公司 2021-10-22 CN disclosed
EP-1271634-A3 Methods for forming low-K dielectric films THE BOC GROUP, INC. (US) 2006-04-19 EP disclosed
US-6936537-B2 Methods for forming low-k dielectric films THE BOC GROUP, INC. (US) 2005-08-30 US disclosed
EP-1271634-A2 Methods for forming low-K dielectric films THE BOC GROUP, INC. (US) 2003-01-02 EP disclosed
EP-1271634-A2 Methods for forming low-K dielectric films THE BOC GROUP, INC. (US) 2003-01-02 EP disclosed
US-20020192980-A1 Methods for forming low-k dielectric films BOC GROUP, INC., THE 2002-12-19 US disclosed