Known targets — ChEMBL curated mechanism
CACNA1CCACNA1DCACNA1FCACNA1SDPP4HTR1BHTR1D
The experimentally established mechanism targets of Triethylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.58 |
| ▸ | DAO | P14920 | 1/20 | 0.58 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.58 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.52 |
| ▸ | SRD5A2 | P31213 | 2/20 | 0.50 |
| ▸ | CES1 | P23141 | 2/20 | 0.50 |
| ▸ | CES2 | O00748 | 1/20 | 0.50 |
| ▸ | PKM | P14618 | 1/20 | 0.50 |
| ▸ | GAA | P10253 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.47 |
| ▸ | PTK2B | Q14289 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 3/20 | 0.46 |
| ▸ | TP53 | P04637 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | RECQL | P46063 | 1/20 | 0.43 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.43 |
| ▸ | NR4A2 | P43354 | 1/20 | 0.43 |
| ▸ | NR4A3 | Q92570 | 1/20 | 0.43 |
| ▸ | RARB | P10826 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Triethylene Glycol SCHEMBL205789 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Triethylene Glycol SCHEMBL2112665 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Triethylene Glycol SCHEMBL28076076 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Tetraethylene Glycol SCHEMBL1555416 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Pentaethylene Glycol SCHEMBL8622527 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Tetraethylene Glycol SCHEMBL9137599 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Triethylene Glycol SCHEMBL2442859 | 1.00 | TSHR (0.58) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Benzoic Acid SCHEMBL6060002 | 0.98 | TSHR (0.61) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Benzoic Acid SCHEMBL148714 | 0.98 | TSHR (0.61) | TSHRDAONAPRTSMN1; SMN2SRD5A2 | |
| Benzoic Acid SCHEMBL818565 | 0.98 | TSHR (0.61) | TSHRDAONAPRTSMN1; SMN2SRD5A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3860318-A1 | HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD | Sekisui Fuller Company, Ltd. (JP) | 2021-08-04 | — | — | EP | claimed |
| US-20210222027-A1 | HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD | SEKISUI FULLER COMPANY, LTD. (JP) | 2021-07-22 | — | — | US | claimed |
| CN-112772005-A | Hot melt coating agent for electronic circuit mounting substrate | 积水富乐株式会社 | 2021-05-07 | — | — | CN | claimed |
| WO-2020066882-A1 | HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD | 積水フーラー株式会社 | 2020-04-02 | — | — | WO | claimed |
| EP-3860318-A1 | HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD | Sekisui Fuller Company, Ltd. (JP) | 2021-08-04 | — | — | EP | disclosed |
| US-20210222027-A1 | HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD | SEKISUI FULLER COMPANY, LTD. (JP) | 2021-07-22 | — | — | US | disclosed |
| CN-112772005-A | Hot melt coating agent for electronic circuit mounting substrate | 积水富乐株式会社 | 2021-05-07 | — | — | CN | disclosed |
| WO-2020066882-A1 | HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD | 積水フーラー株式会社 | 2020-04-02 | — | — | WO | disclosed |
| EP-0649718-B2 | Method of packaging an adhesive composition | FULLER H B LICENSING FINANC (US) | 2006-01-18 | — | — | EP | disclosed |
| US-RE36177-E | Method of packaging an adhesive composition and corresponding packaged article | H. B. FULLER LICENSING & FINANCING, INC. | 1999-04-06 | — | — | US | disclosed |
| EP-0649718-B1 | Method of packaging an adhesive composition and corresponding packaged article | FULLER H B LICENSING FINANC (US) | 1998-10-28 | — | — | EP | disclosed |
| EP-0649378-B1 | A METHOD OF PACKAGING AN ADHESIVE COMPOSITION AND THE COMPOSITION OF THE PACKAGING | FULLER H B LICENSING FINANC (US) | 1997-08-27 | — | — | EP | disclosed |
| EP-0649718-A1 | Method of packaging an adhesive composition and corresponding packaged article | H.B. FULLER LICENSING & FINANCING, INC. (US) | 1995-04-26 | — | — | EP | disclosed |
| US-5387623-A | Package does not separate or degrade on exposure to conditions present in the adhesive application equipment | H. B. FULLER COMPANY (US) | 1995-02-07 | — | — | US | disclosed |
| WO-1994001330-A1 | A METHOD OF PACKAGING AN ADHESIVE COMPOSITION AND THE COMPOSITION OF THE PACKAGING | H.B. FULLER COMPANY (US) | 1994-01-20 | — | — | WO | disclosed |
| EP-0410412-B1 | Hot melt adhesive having controlled property change | FULLER H B LICENSING FINANC (US) | 1994-01-05 | — | — | EP | disclosed |
| US-5257491-A | Method of packaging an adhesive composition and corresponding packaged article | H.B. FULLER LICENSING & FINANCING, INC. | 1993-11-02 | — | — | US | disclosed |
| WO-1992002348-A1 | METHOD OF PACKAGING AN ADHESIVE COMPOSITION AND CORRESPONDING PACKAGED ARTICLE | H.B. FULLER LICENSING AND FINANCING INC. (US) | 1992-02-20 | — | — | WO | disclosed |
| EP-0469564-A1 | Method of packaging an adhesive composition and corresponding packaged article | H.B. FULLER LICENSING & FINANCING, INC. (US) | 1992-02-05 | — | — | EP | disclosed |
| EP-0410412-A1 | Hot melt adhesive having controlled property change | H.B. FULLER LICENSING & FINANCING, INC. (US) | 1991-01-30 | — | — | EP | disclosed |